Abstract: A swash plate type variable displacement compressor comprises cylinder bores, pistons, a suction chamber and a discharge chamber. A suction valve introduces a low pressure gas into a working chamber in each cylinder bore. A discharge valve introduces a high pressure gas in the working chamber into the discharge chamber during a compression stroke. A crank chamber communicates to each of the cylinder bores at rear sides of the pistons. A swash plate is tiltably supported on a drive shaft and connected to each of the pistons through associated rods. The swash plate makes the pistons reciprocate in response to its undulating swing motion and varies its inclination angle based upon pressure differential between pressure in the suction chamber and pressure in the crank chamber therefore adjusting discharge displacement.

Abstract: A deactivating device for a locking mechanism of a pretensioner. The deactivating device includes: an operation lever provided movably about a central axis of rotation and in a direction of the central axis of rotation, and adapted to set the locking mechanism in one of an activated state and a deactivated state; and an urging member for imparting an urging force to the operation lever, wherein the operation lever has a deactivation operation mode for setting the locking mechanism in the deactivated state as the operation lever moves continuously in stages about the central axis of rotation and in the direction of the central axis of rotation against the urging force of the urging member and a position of the operation lever is subsequently held, and an activation operation mode for setting the locking mechanism in the activated state as the operation lever is automatically made to undergo returning movement by the urging force of the urging member from the deactivation operation mode.

Abstract: In an erasing and recovering system for a data block on a magnetic tape in a magnetic tape recording and reproducing apparatus, the system includes: a detecting unit for detecting data error caused by a damaged portion on the magnetic tape by reading a data block just after the data block is written to the magnetic tape; a calculating unit for calculating the circumference of the magnetic tape including the damaged portion; an erasing unit for erasing half of the circumference including the damaged portion; and a data write unit for re-writing the same data block as the data block including the error into another half of the same circumference as the circumference including the damaged portion.

Abstract: A raveling-preventing agent for a glass fiber woven fabric, which contains as essential components a reaction product from an epoxy resin having an epoxy equivalent of 150 to 1,000 and a molecular weight of 500 to 2,000 and a hydroxyl group-containing amine compound, and an isocyanate curing agent. The raveling-preventing agent firmly binds glass fibers together and prevents the raveling of edge-forming warp yarns when applied to sectioned marginal portions of a glass fiber woven fabric. Further it is free from swelling in a solvent used in a thermosetting resin varnish.

Abstract: A woven material of inorganic fiber, and a process for making the same, are disclosed in which exposed surfaces of warps and wefts constituting the woven material are opened as a result of being impinged by jets of pressurized water, whereby the fibers on the surface of the woven material are uniformly raised.

Abstract: The present invention provides a method for producing a glass cloth which is suitable as a reinforcing material for making resin laminates and which comprises subjecting filaments of glass fibers to a sizing treatment with a sizing agent containing at least one water-soluble film forming agent selected from the group consisting of an amine-modified epoxy resin, an ethylene oxide-added epoxy resin and ethylene oxide-added bisphenol A as film forming component, forming glass yarns from the thus treated filaments, weaving the glass yarns to make a glass cloth, washing the glass cloth with water until the loss of ignition of the sizing agent to the glass cloth reaches 0.25% by weight or less, and then treating this glass cloth with a solution of a surface treating agent.

Abstract: A woven material of inorganic fiber, and a process for making the same, are disclosed in which exposed surfaces of warps and wefts constituting the woven material are opened as a result of being impinged by jets of pressurized water, whereby the fibers on the surface of the woven material are uniformly raised.

Abstract: A fabric for a printed circuit-board characterized by that it is composed of one or more fiber(s) selected from the group consisting of polyether ether ketone fiber, polyetherimide fiber and polysulphone fiber, and glass fiber, and a printed circuit-board employing the fabric as its base material.

Abstract: Disclosed is a woven fabric used for production of fiber-reinforced thermoplastic resin laminates wherein each or warps and wefts which constitute the fabric comprises at least one kind of thermoplastic resin yarns and at least one kind of reinforcing yarns and the reinforcing yarns of the warps and wefts as such constitute a weave. The weave constituted of only the reinforcing yarns is preferably a plain weave. The fiber-reinforced thermoplastic resin laminates made by compression molding a laminate of said woven fabrics are high in strength.

Abstract: The present invention provides a ceramic having a first region comprising a dielectric porcelain having an insulating layer at the crystal grain boundary of a semiconductor porcelain containing 0.50 to 5.30 mol parts of MnO.sub.2 and 0.02 to 0.40 mol parts of Y.sub.2 O.sub.3 per 100 mol parts of the principal components comprising 49.50 to 54.00 mol % of TiO.sub.2 and 50.50 to 46.00 mol % of SrO, and a second region comprising a dielectric porcelain containing further 0.40 to 5.00 mol parts of MgO and 0.05 to 2.00 mol parts of SiO.sub.2 per 100 mol parts of the principal components in addition to the composition of the first region, and also provides a circuit substrate and an electronic circuit substrate using the same ceramic.

Abstract: The present invention provides a ceramic having a first region comprising a dielectric porcelain having an insulating layer at the crystal grain boundary of a semiconductor porcelain containing 0.50 to 5.30 mol parts of MnO.sub.2 and 0.02 to 0.40 mol parts of Y.sub.2 O.sub.3 per 100 mol parts of the principal components comprising 49.50 to 54.00 mol. % of TiO.sub.2 and 50.50 to 46.00 mol. % of SrO, and a second region comprising a dielectric porcelain containing further 0.40 to 5.00 mol parts of Al.sub.2 O.sub.3 and 0.05 to 2.00 mol parts of SiO.sub.2 per 100 mol parts of the principal components in addition to the composition of the first region, and also provides a circuit substrate and an electronic circuit substrate using the same ceramic.

Abstract: A ceramic comprising a first region comprises a dielectric porcelain having an insulating layer at the crystal grain boundary of a semiconductor porcelain containing 0.50-5.30 mol parts of MnO.sub.2 and 0.02-0.40 mol parts of Y.sub.2 O.sub.3 per 100 mol parts of a principal components consisting of 49.50-54.00 mol % of TiO.sub.2 and 50.50-46.00 mol % of SrO, and a second region comprising a dielectric porcelain containing further 0.40-5.00 mol parts of Al.sub.2 O.sub.3, based on 100 mol parts of said principal components, in addition to the composition of the first region.

Abstract: A ceramic comprises a first region comprising a dielectric porcelain having an insulating layer at the crystal grain boundary of a semiconductor porcelain containing 0.50-5.30 mol parts of MnO.sub.2 and 0.02-0.40 mol parts of Y.sub.2 O.sub.3 per 100 mol parts of a principal components consisting of 49.50-54.00 mol % of TiO.sub.2 and 50.50-46.00 mol % of SrO, and a second region comprising a dielectric porcelain containing further 0.40-5.00 mol parts of M.sub.g O, based on 100 mol parts of said principal components, in addition to the composition of the first region.

Abstract: A ceramic-forming composition comprises from 2.0 to 5.0 mol parts of MnO.sub.2 and from 0.05 to 0.30 mol part of Y.sub.2 O.sub.3 based on 100 mol parts of a main component comprising from 50.20 to 53.50 mol % of TiO.sub.2 and from 49.80 to 46.50 mol % of SrO. A semiconductor porcelain substrate, a dielectric porcelain substrate and a capacitor are produced by using the same ceramic-forming composition.

Abstract: The present invention provides a ceramic having a first region comprising a dielectric porcelain having an insulating layer at the crystal grain boundary of a semiconductor porcelain containing 0.50 to 5.30 mol parts of MnO.sub.2 and 0.02 to 0.40 mol parts of Y.sub.2 O.sub.3 per 100 mol parts of the principal components comprising 49.50 to 54.00 mol % of TiO.sub.2 and 50.50 to 46.00 mol % of SrO, and a second region comprising a dielectric porcelain containing further 0.40 to 5.00 mol parts of Al.sub.2 O.sub.3 and 0.05 to 2.00 mol parts of SiO.sub.2 per 100 mol parts of the principal components in addition to the composition of the first region, and also provides a circuit substrate and an electronic circuit substrate using the same ceramic.

Abstract: A ceramic comprises a first region comprising a dielectric porcelain having an insulating layer at the crystal grain boundary of a semiconductor porcelain containing 0.50-5.30 mol parts of MnO.sub.2 and 0.02-0.40 mol parts of Y.sub.2 O.sub.3 per 100 mol parts of a principal components consisting of 49.50-54.00 mol % of TiO.sub.2 and 50.50-46.00 mol % of SrO, and a second region comprising a dielectric porcelain containing further 0.40-5.00 mol parts of MgO, based on 100 mol parts of said principal components, in addition to the composition of the first region.

Abstract: The present invention provides a ceramic having a first region comprising a dielectric porcelain having an insulating layer at the crystal grain boundary of a semiconductor porcelain containing 0.50 to 5.30 mol parts of MnO.sub.2 and 0.02 to 0.40 mol parts of Y.sub.2 O.sub.3 per 100 mol parts of the principal components comprising 49.50 to 54.00 mol% of TiO.sub.2 and 50.50 to 46.00 mol% of SrO, and a second region comprising a dielectric porcelain containing further 0.40 to 5.00 mol parts of MgO and 0.05 to 2.00 mol parts of SiO.sub.2 per 100 mol parts of the principal components in addition to the composition of the first region, and also provides a circuit substrate and an electronic circuit substrate using the same ceramic.

Abstract: A ceramic comprising a first region comprises a dielectric porcelain having an insulating layer at the crystal grain boundary of a semiconductor porcelain containing 0.50-5.30 mol parts of MnO.sub.2 and 0.02-0.40 mol parts of Y.sub.2 O.sub.3 per 100 mol parts of a principal components consisting of 49.50-54.00 mol % of TiO.sub.2 and 50.50-46.00 mol % of SrO, and a second region comprising a dielectric porcelain containing further 0.40-5.00 mol parts of Al.sub.2 O.sub.3, based on 100 mol parts of said principal components, in addition to the composition of the first region.

Abstract: A ceramic comprises therein two or more dielectric portions having different dielectric constants formed by filling of one or more vacant spaces provided within a dielectric porcelain, a semiconductor porcelain as a precursor of said dielectric porcelain or a molded product as a precursor of said semiconductor procelain with one or more kinds of materials capable of becoming to have different dielectric constants from said dielectric porcelain and subsequent calcination.

Abstract: In a substrate of a printed circuit, a metal foil is mounted onto at least one of the outermost surfaces of a laminate made of a plurality of glass fiber woven fabrics impregnated with synthetic resin, and heated and pressed. Warps and wefts of the glass fiber fabrics filamentated their filaments. The synthetic resin enters gaps among the opening filaments so that the vertically laminated glass fiber fabrics including the opening fibers are integrally jointed with each other. Warps and wefts of the glass fiber fabrics may have their surfaces made fuzzy so that the synthetic resin enters fuzzy filaments. Furthermore, the thus produced substrate may be used as a multilayer printed circuit substrate.