Patents by Inventor Keiichi SAWA

Keiichi SAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130256779
    Abstract: A method of manufacturing a semiconductor device comprising: forming a first insulating film on a semiconductor substrate; forming an adsorption film on the first insulating film; forming a first film containing germanium on the adsorption film; forming a second insulating film on the first film; forming a floating electrode film on the second insulating film; forming a third insulating film on the floating electrode film; and forming a gate electrode on the third insulating film.
    Type: Application
    Filed: March 14, 2013
    Publication date: October 3, 2013
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Keiichi SAWA, Tetsuya Kai, Shinji Mori, Kenichiro Toratani, Masayuki Tanaka