Abstract: A wafer heating apparatus which is capable of quickly cooling by improving the cooling rate of the heater section is provided. The wafer heating apparatus comprises a plate-shaped member having two opposing principal surfaces with one of the principal surfaces serving as a mounting surface to mount a wafer thereon and the other principal surface having a band-shaped resistive heating member formed thereon, power feeder terminals connected to the resistive heating member for supplying electric power to the resistive heating member, a casing provided to cover the power feeder terminals on the other surface of the plate-shaped member and a nozzle of which tip faces the other surface of the plate-shaped member for cooling the plate-shaped member, wherein the position of the tip of the nozzle as projected onto the other surface of the plate-shaped member is located between the bands of the resistive heating member.

Abstract: This invention is aimed at providing a wafer-level package which is capable of relaxing the stress in a chip-size package and exalting the reliability of the operation of mounting on a printed board and a method for the production thereof. This invention is directed toward a wafer-level package of a semiconductor substrate possessed of either or both of an electrode part and a wiring layer connected to an electrode part, which is provided on the semiconductor substrate with an insulating layer formed mainly of a fluorene skeleton-containing resin and on the electrode part with one step or a plurality of steps of posts, and on the posts with bumps formed of electroconductive balls and a method for the production thereof.

Abstract: A resist pattern is provided on a substrate and includes a first resist layer provided on the substrate and defined by a first organic material which dissolves in an organic solvent, water, or a solvent primarily composed of water, a second resist layer defined by a second organic material provided on the first resist layer, the second organic material having a high absorbance of a light having a predetermined wavelength, and a third resist layer defined by a third organic material provided on the second resist layer, the organic material having a resistance to dry etching and being photosensitive to the light.

Abstract: A resist pattern is provided on a substrate and includes a first resist layer provided on the substrate and defined by a first organic material which dissolves in an organic solvent, water, or a solvent primarily composed of water, a second resist layer defined by a second organic material provided on the first resist layer, the second organic material having a high absorbance of a light having a predetermined wavelength, and a third resist layer defined by a third organic material provided on the second resist layer, the organic material having a resistance to dry etching and being photosensitive to the light.

Abstract: A band-like raw material which becomes a contact plate is supplied to a position between an upper mold and a lower mold as these molds are closed, a convex part for the contact with the lower mold is engaged with a concave part for contact with the upper mold, by which, simultaneously punching out the contact part onto a part of the band-like raw material, the band-like raw material is cut to a predetermined length between edge parts to form the contact plate. At this time, a tip of a press pin on which the concave part is formed is brought into direct contact with a central part of the band-like raw material. A resin is injected into the mold cavities to form a push rod integrally with the contact plate, and the central part of the contact plate is deformed in the concave part to provide a stopgap.

Abstract: Shaft holes 12 and 22 are formed on each pivot portion of a switch case 10 having an unfolded fan shaped concave body 11. A stationary contact base 20 covers the concave body, and a corresponding end portion of a shaft holder 40 are fitted into the respective holes to rotate freely. In addition, positioning through-holes 18 and 27 are formed at each corresponding portion of the switch case 10 and the stationary contact base 20. Either the switch case 10 side or the stationary contact base side 20 is set on an assembly jig 80 toward these shaft holes 12 and 22 and the positioning holes 17 and 27. As a result, the lever 72 can be engaged from either side of the switch case 10 or the stationary contact base 20.

Abstract: A substantially fan-shaped stationary contact base is provided at its pivot of the fan with a shaft hole and at its outer periphery with mounting bosses, each having a through bore. The mounting boss is formed in the middle of the outer periphery of a circular arc to have an enlarged area in the circumferential direction where there is provided an elongated positioning slot which is extended in the radial direction of the shaft hole. A shaft holder supported by a switch case is inserted into the shaft hole and a positioning projection provided on the side of the switch case is then inserted into the elongated positioning slot so that the stationary contact base and the switch case can be assembled together.

Abstract: An inverter for DC/AC conversion includes an inverter bridge controlled by a PWM controller. The inverter has a first control loop for performing PWM control in accordance with the difference between the instantaneous AC value of an inverter output and an amplitude of waveform data read out from an AC waveform memory. The inverter also has a second control loop for multiplying the amplitude value of the waveform data by a coefficient adjusted on the basis of the error between the means AC current or voltage value of the inverter outputs and a target control value, and performing PWM control in accordance with waveform data having the adjusted amplitude. By using a delta scheme of finely increasing/decreasing at a time the coefficient by which waveform data is multiplied, an inverter with a high control precision and high stability can be obtained.

Abstract: Analysis of an electromagnetic field in a region including an electric conductor having an arbitrary shape is efficiently and accurately performed with a computer. A value of electric potential at a predetermined portion of the electric conductor or a value of the normal component of an electric current density vector to the cross section of a predetermined portion of the electric conductor is used as an initial condition. The distribution of exciting current density vectors in the electric conductor is obtained form the initial condition so as to meet the condition of continuity of electric current. The electromagnetic field of the region is analyzed by using the obtained distribution of exciting current density vectors.