Patents by Inventor Keisuke Kondoh
Keisuke Kondoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240075805Abstract: A vehicle includes: a grille opening through which cooling air is introduced; a radiator air guide duct that guides cooling air introduced from the grille opening to a radiator; and a left brake duct that is connected to both ends of the radiator air guide duct in the vehicle width direction and guides a part of the flowing cooling air toward the brake of the front wheel, wherein the vehicle includes a backflow suppression plate protruding from a center side plate of the left brake duct toward the inside of the left brake duct.Type: ApplicationFiled: June 27, 2023Publication date: March 7, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Keisuke KONDOH
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Publication number: 20230063958Abstract: An electric motor vehicle comprises a charging port which is opened in a vehicle side portion and opened/closed by a charging lid, a charging inlet which is arranged inside the charging port and has a connection unit connectable to an outside power source, and on-vehicle liquid tank which is arranged in the vicinity of the charging port and provided with liquid level indication of the stored liquid amount. The charging port has therein check hole which is opened to check the liquid level indication.Type: ApplicationFiled: August 30, 2022Publication date: March 2, 2023Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Takuya Tomioka, Keisuke Kondoh, Takamitsu Goto
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Patent number: 11554493Abstract: According to one embodiment of the present disclosure, there is provided a transfer apparatus comprising at least one arm configured to support a substrate; at least one gear disposed at a joint that rotatably supports the at least one arm, the at least one gear rotating the at least one arm; and a detector disposed to face the at least one gear and configured to detect a temperature of the at least one gear without contacting the at least one gear.Type: GrantFiled: January 20, 2020Date of Patent: January 17, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Shota Shimazaki, Keisuke Kondoh
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Patent number: 11545381Abstract: Provided is a substrate transferring method which is capable of accurately mounting a substrate at a desired rotation angle. In order to eliminate a misalignment of a wafer W in a rotational direction in a vacuum process chamber, which is caused by a variation in a transfer distance of the wafer W, the wafer W is mounted on a stage while being offset from the center of the stage in a load lock chamber and an angle of rotation of the wafer W with respect to a fork when a transfer arm receives the wafer W is changed.Type: GrantFiled: February 23, 2017Date of Patent: January 3, 2023Assignee: TOKYO ELECTRON LIMITEDInventor: Keisuke Kondoh
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Patent number: 11257707Abstract: A substrate gripping mechanism, for gripping a substrate between a fixed clamp portion to be engaged with an edge portion of a substrate and a movable clamp portion configured to reciprocate with respect to the fixed clamp portion by a reciprocating driving unit, includes an interlocking member configured to move together with the movable clamp portion, and a first sensor and a second sensor, each having a detection region and configured to detect whether or not the interlocking member exists in the detection region. The interlocking member has a first to a fourth portion connected in a reciprocating direction of the movable clamp portion. The first to the fourth portion have shapes to make detection results thereof by the first sensor and the second sensor different from each other.Type: GrantFiled: December 18, 2018Date of Patent: February 22, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Masahiro Dogome, Keisuke Kondoh
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Patent number: 10906756Abstract: Four groups of a three-tier arrangement of processing units, each of the processing units being provided with two processing modules and a load lock module, are provided in the front and rear sides along a Y-guide extending rearward when viewed from an EFEM and in the left and right sides of the Y-guide. An exchange of a substrate between a delivery mechanism on the EFEM side and a substrate transfer mechanism on the processing unit side is performed by a substrate loading part, which is movable along the Y-guide and can move upward and downward, and on which a plurality of wafers can be placed in a shelf-like manner.Type: GrantFiled: January 21, 2019Date of Patent: February 2, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Shinji Wakabayashi, Keisuke Kondoh
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Patent number: 10896835Abstract: A system includes a transfer device for transferring workpieces in an atmospheric atmosphere, a transfer unit for transferring the workpieces in a vacuum atmosphere, and a vacuum processing unit including vacuum process chambers connected to the transfer unit and for performing a process on the workpieces in each process chamber. The vacuum processing unit simultaneously performs the process on the workpieces in each process chamber. The process chambers are arranged along a first direction. The transfer unit includes first and second common transfer devices installed along the first direction to transfer the workpieces along the first direction. The first common transfer device is connected to each process chamber at a first side in a second direction perpendicular to the first direction, the second common transfer device is connected to each process chamber at a second side in the second direction.Type: GrantFiled: March 28, 2018Date of Patent: January 19, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Atsushi Kawabe, Keisuke Kondoh
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Publication number: 20200312689Abstract: Provided is a substrate transferring method which is capable of accurately mounting a substrate at a desired rotation angle. In order to eliminate a misalignment of a wafer W in a rotational direction in a vacuum process chamber, which is caused by a variation in a transfer distance of the wafer W, the wafer W is mounted on a stage while being offset from the center of the stage in a load lock chamber and an angle of rotation of the wafer W with respect to a fork when a transfer arm receives the wafer W is changed.Type: ApplicationFiled: February 23, 2017Publication date: October 1, 2020Inventor: Keisuke KONDOH
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Publication number: 20200230819Abstract: According to one embodiment of the present disclosure, there is provided a transfer apparatus comprising at least one arm configured to support a substrate; at least one gear disposed at a joint that rotatably supports the at least one arm, the at least one gear rotating the at least one arm; and a detector disposed to face the at least one gear and configured to detect a temperature of the at least one gear without contacting the at least one gear.Type: ApplicationFiled: January 20, 2020Publication date: July 23, 2020Inventors: Shota Shimazaki, Keisuke Kondoh
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Patent number: 10403529Abstract: A carrier transport device capable of delivering a carrier to and from an external transport device which transports the carrier is provided. The carrier transport device includes a housing on which the carrier is mountable, first ports provided in the housing and configured to deliver the carrier to and from the external transport device, second ports provided in the housing and provided with a lid opening/closing mechanism, and a transfer machine provided in the housing and configured to transfer the carrier. The first ports, the transfer machine and the second ports are disposed under a transport path of the external transport device. The first ports and the second ports are disposed on both sides of the transfer machine. The second ports are configured at multiple stages.Type: GrantFiled: December 24, 2015Date of Patent: September 3, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Shinji Wakabayashi, Keisuke Kondoh
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Publication number: 20190214289Abstract: A substrate gripping mechanism, for gripping a substrate between a fixed clamp portion to be engaged with an edge portion of a substrate and a movable clamp portion configured to reciprocate with respect to the fixed clamp portion by a reciprocating driving unit, includes an interlocking member configured to move together with the movable clamp portion, and a first sensor and a second sensor, each having a detection region and configured to detect whether or not the interlocking member exists in the detection region. The interlocking member has a first to a fourth portion connected in a reciprocating direction of the movable clamp portion. The first to the fourth portion have shapes to make detection results thereof by the first sensor and the second sensor different from each other.Type: ApplicationFiled: December 18, 2018Publication date: July 11, 2019Inventors: Masahiro DOGOME, Keisuke KONDOH
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Patent number: 10347510Abstract: A compartment variable device is provided with: a baffle plate which has a plurality of openings and which as a whole has a rectangular shape; a rectangular frame disposed around the baffle plate; a bellows connected to a bottom of the frame; and a bellows support portion to which the lower end of the bellows is fixed. When a transfer arm of an atmosphere-side transfer device is lifted, the frame of the compartment variable device which is engaged with the transfer arm is lifted, thereby extending the bellows. Accordingly, the volume of a gas flow space in an atmospheric pressure transfer chamber is decreased, allowing the atmosphere in the gas flow space in the atmospheric pressure transfer chamber to be replaced in a short time.Type: GrantFiled: June 7, 2016Date of Patent: July 9, 2019Assignee: Tokyo Electron LimitedInventor: Keisuke Kondoh
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Publication number: 20190152722Abstract: Four groups of a three-tier arrangement of processing units, each of the processing units being provided with two processing modules and a load lock module, are provided in the front and rear sides along a Y-guide extending rearward when viewed from an EFEM and in the left and right sides of the Y-guide. An exchange of a substrate between a delivery mechanism on the EFEM side and a substrate transfer mechanism on the processing unit side is performed by a substrate loading part, which is movable along the Y-guide and can move upward and downward, and on which a plurality of wafers can be placed in a shelf-like manner.Type: ApplicationFiled: January 21, 2019Publication date: May 23, 2019Inventors: Shinji WAKABAYASHI, Keisuke KONDOH
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Patent number: 10229847Abstract: A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.Type: GrantFiled: February 9, 2017Date of Patent: March 12, 2019Assignee: Tokyo Electron LimitedInventors: Shinji Wakabayashi, Keisuke Kondoh, Sensho Kobayashi
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Patent number: 10134619Abstract: A connecting mechanism includes a mounting unit, a substrate transfer port, a door closing or opening the substrate transfer port, a coupling mechanism coupling a cover of the substrate container mounted on the mounting unit with the door, and a gas exhaust/purge unit. First, second and third seal members respectively seal a first space between a peripheral portion of the substrate transfer port and the door, a second space between the door and the cover of the substrate container, and a space between the peripheral portion of the substrate transfer port and the main body. The gas exhaust unit exhausts the first space and a second space. The purge gas, which has been supplied into the substrate container by the gas exhaust/purge unit, is supplied into the first and the second space by allowing the gas exhaust unit to exhaust the first and the second space.Type: GrantFiled: February 2, 2017Date of Patent: November 20, 2018Assignee: Tokyo Electron LimitedInventors: Keisuke Kondoh, Norihiko Tsuji
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Patent number: 10128134Abstract: Provided is a substrate transfer method for sequentially transferring a substrate between a heat treatment chamber and another chamber different from the heat treatment chamber using a transfer unit having a first pick and a second pick. An unprocessed substrate is held by the first pick, and the substrate is transferred to the heat treatment chamber. A processed substrate, heat-treated in the heat treatment chamber, is held by the second pick, and the unprocessed substrate held by the first pick is loaded into the heat treatment chamber. The processed substrate held by the second pick is transferred to the other chamber. An unprocessed substrate in the other chamber is held by the first pick, the processed substrate held by the second pick is loaded into the other chamber, and then both the first pick and the second pick are put into a state of not holding a substrate.Type: GrantFiled: September 7, 2015Date of Patent: November 13, 2018Assignee: TOKYO ELECTRON LIMITEDInventor: Keisuke Kondoh
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Publication number: 20180286729Abstract: A system includes a transfer device for transferring workpieces in an atmospheric atmosphere, a transfer unit for transferring the workpieces in a vacuum atmosphere, and a vacuum processing unit including vacuum process chambers connected to the transfer unit and for performing a process on the workpieces in each process chamber. The vacuum processing unit simultaneously performs the process on the workpieces in each process chamber. The process chambers are arranged along a first direction. The transfer unit includes first and second common transfer devices installed along the first direction to transfer the workpieces along the first direction. The first common transfer device is connected to each process chamber at a first side in a second direction perpendicular to the first direction, the second common transfer device is connected to each process chamber at a second side in the second direction.Type: ApplicationFiled: March 28, 2018Publication date: October 4, 2018Inventors: Atsushi KAWABE, Keisuke KONDOH
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Publication number: 20180211850Abstract: A compartment variable device is provided with: a baffle plate which has a plurality of openings and which as a whole has a rectangular shape; a rectangular frame disposed around the baffle plate; a bellows connected to a bottom of the frame; and a bellows support portion to which the lower end of the bellows is fixed. When a transfer arm of an atmosphere-side transfer device is lifted, the frame of the compartment variable device which is engaged with the transfer arm is lifted, thereby extending the bellows. Accordingly, the volume of a gas flow space in an atmospheric pressure transfer chamber is decreased, allowing the atmosphere in the gas flow space in the atmospheric pressure transfer chamber to be replaced in a short time.Type: ApplicationFiled: June 7, 2016Publication date: July 26, 2018Inventor: Keisuke KONDOH
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Publication number: 20180033663Abstract: A carrier transport device capable of delivering a carrier to and from an external transport device which transports the carrier is provided. The carrier transport device includes a housing on which the carrier is mountable, first ports provided in the housing and configured to deliver the carrier to and from the external transport device, second ports provided in the housing and provided with a lid opening/closing mechanism, and a transfer machine provided in the housing and configured to transfer the carrier. The first ports, the transfer machine and the second ports are disposed under a transport path of the external transport device. The first ports and the second ports are disposed on both sides of the transfer machine. The second ports are configured at multiple stages.Type: ApplicationFiled: December 24, 2015Publication date: February 1, 2018Inventors: Shinji WAKABAYASHI, Keisuke KONDOH
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Publication number: 20170287746Abstract: Provided is a substrate transfer method for sequentially transferring a substrate between a heat treatment chamber and another chamber different from the heat treatment chamber using a transfer unit having a first pick and a second pick. An unprocessed substrate is held by the first pick, and the substrate is transferred to the heat treatment chamber. A processed substrate, heat-treated in the heat treatment chamber, is held by the second pick, and the unprocessed substrate held by the first pick is loaded into the heat treatment chamber. The processed substrate held by the second pick is transferred to the other chamber. An unprocessed substrate in the other chamber is held by the first pick, the processed substrate held by the second pick is loaded into the other chamber, and then both the first pick and the second pick are put into a state of not holding a substrate.Type: ApplicationFiled: September 7, 2015Publication date: October 5, 2017Applicant: TOKYO ELECTRON LIMITEDInventor: Keisuke KONDOH