Abstract: An opening/closing mechanism for a vacuum processing apparatus comprises a link mechanism comprising a supporting member having first and second valve elements for closing first and second opening portions, and a base end side member rotatably attached at a rear edge portion side of the supporting member through a rotation axis, a guide mechanism rotatably supporting the supporting member to a horizontal moving direction of the first and second valve elements while restricting the vertical moving range of the supporting member, first and second guide members which move the rotation axis of the link mechanism to a vertical direction and at the top portion to the horizontal direction, and first and second vertical moving mechanisms which vertically move the first guide member, the second guide member and the base edge side member.

Abstract: A carrying device carries a semiconductor wafer above a base disposed in a transfer chamber or the like. The carrying device comprises pick for holding the object, a main arm mechanism adapted to bend and stretch in a horizontal operating plane, and an auxiliary arm mechanism adapted to bend and stretch in a vertical operating plane. The main arm mechanism includes a proximal end supported by the base, and distal end connected to the pick, respectively. The auxiliary arm mechanism includes a main arm and an arm linkage. The main arm has a proximal end supported by the base, and distal end. The arm linkage has a proximal end connected to the distal end of the main arm and a distal end connected to the pick.

Abstract: A transfer system has a position aligning device, a mounting device, and a transfer mechanism having two pick. In a delivery position aligning method for use in a transfer system, a set of delivery position coordinates that defines an access point of each pick of the transfer mechanism is temporarily determined. Then, a set of delivery position coordinates of each pick of the transfer mechanism to the position aligning device is fixed, and parts of sets of delivery position coordinates of each pick of the transfer mechanism to devices other than the position aligning device are fixed. A position alignment object is transferred to the position aligning device via a transfer route passing an unfixed set of delivery position coordinates, and an amount of positional displacement thereof is calculated. The unfixed set of delivery position coordinates is corrected based on the amount of positional displacement, and fixed.

Abstract: A positioning substrate is used for performing a teaching operation on a transfer mechanism for transferring a target substrate in a semiconductor processing system. The positioning substrate includes a substrate body made of a material selected from the group consisting of the same material as the target substrate, semiconductor, compound semiconductor, and ceramic. The substrate body has an outer contour sized to be handled by the transfer mechanism as an alternative to the target substrate. The positioning substrate also includes a positioning assistant having a combination of a positioning hole and a positioning reference line formed in the substrate body. The positioning hole is formed to penetrate the substrate body in a thickness direction. The positioning reference line is formed on a surface of the substrate body to extend across an opening of the positioning hole and have a predetermined width.

Abstract: A carrying device carries a semiconductor wafer above a base disposed in a transfer chamber or the like. The carrying device comprises pick for holding the object, a main arm mechanism adapted to bend and stretch in a horizontal operating plane, and an auxiliary arm mechanism adapted to bend and stretch in a vertical operating plane. The main arm mechanism includes a proximal end supported by the base, and distal end connected to the pick, respectively. The auxiliary arm mechanism includes a main arm and an arm linkage. The main arm has a proximal end supported by the base, and distal end. The arm linkage has a proximal end connected to the distal end of the main arm and a distal end connected to the pick.

Abstract: In most cases, a hot, corrosive atmosphere is created in, for example, a semiconductor wafer processing chamber. When an arm including belts, such as steel belts, is moved into such a semiconductor wafer processing chamber, the belts are exposed to the hot, corrosive atmosphere. Belts, such as steel belts, have limited heat resistance and corrosion resistance and the hot, corrosive atmosphere in the processing chamber shortens the life of the belts. A carrying device of the present invention has a frog leg type arm (3) and a wafer holder (4) connected to the frog leg type arm (3). The wafer holder (4) is pivotally connected to front end parts of a first front arm (8A) and a second front arm (8B) by coaxial joints (10). The wafer holder (4) is linked to the first front arm (8A) and the second front arm (8B) by a posture maintaining linkage (5) including two antiparallel linkages capable of controlling the turning of the wafer holder (4) relative to the first and the second front arms (8A, 8B).

Abstract: A positioning substrate is used for performing a teaching operation on a transfer mechanism for transferring a target substrate in a semiconductor processing system. The positioning substrate includes a substrate body made of a material selected from the group consisting of the same material as the target substrate, semiconductor, compound semiconductor, and ceramic. The substrate body has an outer contour sized to be handled by the transfer mechanism as an alternative to the target substrate. The positioning substrate also includes a positioning assistant having a combination of a positioning hole and a positioning reference line formed in the substrate body. The positioning hole is formed to penetrate the substrate body in a thickness direction. The positioning reference line is formed on a surface of the substrate body to extend across an opening of the positioning hole and have a predetermined width.

Abstract: In most cases, a hot, corrosive atmosphere is created in, for example, a semiconductor wafer processing chamber. When an arm including belts, such as steel belts, is moved into such a semiconductor wafer processing chamber, the belts are exposed to the hot, corrosive atmosphere. Belts, such as steel belts, have limited heat resistance and corrosion resistance and the hot, corrosive atmosphere in the processing chamber shortens the life of the belts. A carrying device of the present invention has a frog leg type arm (3) and a wafer holder (4) connected to the frog leg type arm (3). The wafer holder (4) is pivotally connected to front end parts of a first front arm (8A) and a second front arm (8B) by coaxial joints (10). The wafer holder (4) is linked to the first front arm (8A) and the second front arm (8B) by a posture maintaining linkage (5) including two antiparallel linkages capable of controlling the turning of the wafer holder (4) relative to the first and the second front arms (8A, 8B).

Abstract: In most cases, a hot, corrosive atmosphere is created in, for example, a semiconductor wafer processing chamber. When an arm including belts, such as steel belts, is moved into such a semiconductor wafer processing chamber, the belts are exposed to the hot, corrosive atmosphere. Belts, such as steel belts, have limited heat resistance and corrosion resistance and the hot, corrosive atmosphere in the processing chamber shortens the life of the belts. A carrying device of the present invention has a frog leg type arm (3) and a wafer holder (4) connected to the frog leg type arm (3). The wafer holder (4) is pivotally connected to front end parts of a first front arm (8A) and a second front arm (8B) by coaxial joints (10). The wafer holder (4) is linked to the first front arm (8A) and the second front arm (8B) by a posture maintaining linkage (5) including two antiparallel linkages capable of controlling the turning of the wafer holder (4) relative to the first and the second front arms (8A, 8B).

Abstract: A vacuum processing apparatus includes a transfer chamber filled with a gas to have an upper limit of a target pressure range, a gas supply system connected to a gas supply source to supply the gas into the transfer chamber, a gas exhaust system for releasing the gas from within the transfer chamber, first and second vacuum chambers connected to the transfer chamber, first and second gate valves interposed between the transfer chamber and the vacuum chambers, which selectively permit the transfer chamber and the vacuum chambers to communicate with each other and a transfer mechanism for transferring a target object from the first vacuum chamber to the transfer chamber via the first gate valve and for transferring the target object from the transfer chamber to the second vacuum chamber via the second gate valve.