Patents by Inventor Keisuke Namiki

Keisuke Namiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10213896
    Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion. The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: February 26, 2019
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki, Shintaro Isono
  • Publication number: 20180301367
    Abstract: An elastic membrane to be used for a polishing head includes a contact portion configured to come into contact with a wafer, an annular side wall provided to stand on an outer peripheral end of the contact portion, a first partition wall linearly extending inward in a radial direction in sectional view from the side wall, and a second partition wall linearly extending inward and upward in the radial direction in sectional view from an outer peripheral end portion of the contact portion, wherein the first partition wall, the second partition wall, and the side wall constitute an edge pressure chamber for pressing an edge of the wafer.
    Type: Application
    Filed: April 11, 2018
    Publication date: October 18, 2018
    Inventors: Satoru YAMAKI, Makoto FUKUSHIMA, Keisuke NAMIKI, Osamu NABEYA, Shingo TOGASHI, Tomoko OWADA, Yoshikazu KATO
  • Patent number: 9999956
    Abstract: A polishing device is provided to suppress deterioration in reproducibility of a polishing profile due to a variation or change with time of a shape of a retaining ring of a substrate holding member for each of retaining rings. The polishing device includes: a polishing head configured to press a substrate against a polishing pad and have a retainer ring surrounding the substrate pressed against the polishing pad; a measurement sensor configured to measure a surface shape of the retainer ring; and a controller configured to determine a polishing condition of the substrate based on the surface shape of the retainer ring measured by the measurement sensor.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: June 19, 2018
    Assignee: Ebara Corporation
    Inventors: Keisuke Namiki, Hozumi Yasuda, Osamu Nabeya, Makoto Fukushima, Shingo Togashi, Satoru Yamaki, Shintaro Isono
  • Publication number: 20180117730
    Abstract: A substrate holding apparatus which can adjust polishing profile precisely is disclosed. The substrate holding apparatus includes an elastic membrane that forms a plurality of pressure chambers for pressing a substrate, and a head body to which the elastic membrane is coupled. The elastic membrane includes a contact portion to be brought into contact with the substrate for pressing the substrate against a polishing pad, an edge circumferential wall extending upwardly from a peripheral edge of the contact portion, and a plurality of inner circumferential walls arranged radially inwardly of the edge circumferential wall and extending upwardly from the contact portion. At least two adjacent inner circumferential walls of the plurality of inner circumferential walls include slope circumferential walls inclined radially inwardly. The slope circumferential walls are inclined radially inwardly in their entirety from their lower ends to upper ends, and extend upwardly.
    Type: Application
    Filed: October 23, 2017
    Publication date: May 3, 2018
    Inventors: Osamu NABEYA, Makoto FUKUSHIMA, Keisuke NAMIKI, Shingo TOGASHI, Satoru YAMAKI, Masahiko KISHIMOTO, Tomoko OWADA
  • Patent number: 9815171
    Abstract: A substrate holder capable of preventing an increase in a polishing rate of an edge portion of a substrate, even when polishing a plurality of substrates successively, is disclosed. The substrate holder includes: a top ring body configured to hold the substrate; and a retaining ring disposed so as to surround the substrate held by the top ring body. The retaining ring includes a pad pressing structure in an annular shape which is to be brought into contact with the polishing pad, and the pad pressing structure has a width in a range of 3 mm to 7.5 mm.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: November 14, 2017
    Assignee: EBARA CORPORATION
    Inventors: Satoru Yamaki, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Makoto Fukushima, Shingo Togashi
  • Publication number: 20170266779
    Abstract: According to one embodiment, a substrate polishing method includes: conveying a substrate to a position above a polishing pad by sucking the substrate by a first region of an elastic film; polishing the substrate while bringing the substrate into contact with the polishing pad; and lifting off the substrate by sucking the substrate by a second region of the elastic film, the second region being larger than the first region.
    Type: Application
    Filed: March 14, 2017
    Publication date: September 21, 2017
    Inventors: Shintaro ISONO, Hozumi YASUDA, Keisuke NAMIKI, Osamu NABEYA, Makoto FUKUSHIMA, Shingo TOGASHI, Satoru YAMAKI
  • Publication number: 20170173756
    Abstract: A polishing object is prevented from slipping out without depending on the process type or the polishing condition.
    Type: Application
    Filed: December 14, 2016
    Publication date: June 22, 2017
    Inventors: Satoru YAMAKI, Hozumi YASUDA, Keisuke NAMIKI, Osamu NABEYA, Makoto FUKUSHIMA, Shingo TOGASHI, Shintaro ISONO
  • Patent number: 9676076
    Abstract: A polishing method is used for polishing a film formed on a substrate by pressing the substrate against a polishing pad. The polishing method includes preparing, in advance, an algorithm for correction of polishing time from a relationship between a known amount of wear of the polishing pad or a known thickness of the polishing pad, and a polishing time and a polishing amount; setting a polishing target value for the film; and measuring an amount of wear of the polishing pad or a thickness of the polishing pad. The polishing method further includes determining an optimal polishing time for the polishing target value from the measured amount of wear of the polishing pad or the measured thickness of the polishing pad and from the algorithm; and polishing the film for the determined optimal polishing time.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: June 13, 2017
    Assignee: Ebara Corporation
    Inventors: Keisuke Namiki, Hozumi Yasuda, Shingo Togashi
  • Patent number: 9662764
    Abstract: The substrate holder is a device for holding a substrate and pressing it against a polishing pad. The substrate holder includes: an inner retaining ring vertically movable independently of the top ring body and arranged around the substrate; an inner pressing mechanism to press the inner retaining ring against the polishing surface of the polishing pad; an outer retaining ring to vertically movable independently of the inner retaining ring and the top ring body; an outer pressing mechanism to press the outer retaining ring against the polishing surface; and a supporting mechanism to receive a lateral force applied to the inner retaining ring from the substrate during polishing of the substrate and to tiltably support the outer retaining ring.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: May 30, 2017
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Publication number: 20170144267
    Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion, The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.
    Type: Application
    Filed: January 10, 2017
    Publication date: May 25, 2017
    Inventors: Makoto FUKUSHIMA, Hozumi YASUDA, Keisuke NAMIKI, Osamu NABEYA, Shingo TOGASHI, Satoru YAMAKI, Shintaro ISONO
  • Patent number: 9573241
    Abstract: A polishing apparatus capable of eliminating a variation in film thickness along a circumferential direction of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a polishing head including an elastic membrane for pressing the substrate against the polishing surface and a retainer ring arranged so as to surround the substrate, the retainer ring being capable of contacting the polishing surface; a rotating mechanism configured to rotate the polishing head about its own axis; a rotation angle detector configured to detect a rotation angle of the polishing head; and a polishing controller configured to periodically change a polishing condition of the substrate in synchronization with the rotation angle of the polishing head.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: February 21, 2017
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki
  • Patent number: 9573244
    Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion. The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: February 21, 2017
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki, Shintaro Isono
  • Patent number: D769200
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: October 18, 2016
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Patent number: D770990
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: November 8, 2016
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Patent number: D793976
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: August 8, 2017
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Patent number: D794585
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: August 15, 2017
    Assignee: EBARA CORPORATION
    Inventors: Osamu Nabeya, Hozumi Yasuda, Makoto Fukushima, Keisuke Namiki, Shingo Togashi, Satoru Yamaki
  • Patent number: D799437
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: October 10, 2017
    Assignee: EBARA CORPORATION
    Inventors: Osamu Nabeya, Hozumi Yasuda, Makoto Fukushima, Shingo Togashi, Keisuke Namiki, Satoru Yamaki
  • Patent number: D808349
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: January 23, 2018
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Patent number: D813180
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: March 20, 2018
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Patent number: D839224
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: January 29, 2019
    Assignee: EBARA CORPORATION
    Inventors: Satoru Yamaki, Makoto Fukushima, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Tomoko Owada, Masahiko Kishimoto