Patents by Inventor Keisuke Namiki
Keisuke Namiki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7897007Abstract: A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.Type: GrantFiled: June 10, 2008Date of Patent: March 1, 2011Assignee: Ebara CorporationInventors: Yoshihiro Gunji, Hozumi Yasuda, Keisuke Namiki, Hiroshi Yoshida
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Patent number: 7850509Abstract: The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.Type: GrantFiled: October 16, 2008Date of Patent: December 14, 2010Assignee: Ebara CorporationInventors: Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi
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Publication number: 20090137190Abstract: The present invention provides a dressing method of dressing a polishing pad used in a polishing apparatus for polishing a substrate. This method includes repetitively moving the dresser on an upper surface of the polishing pad in a radial direction of the polishing pad so as to perform a dressing process on the polishing pad, during the dressing process, measuring a height of an upper surface of the polishing pad at a predetermined point in one of plural zones on the polishing surface, and repeating the repetitive moving of the dresser and the measuring of the height of the upper surface of the polishing pad so as to measure the height of the upper surface of the polishing pad in all of the plural zones.Type: ApplicationFiled: November 24, 2008Publication date: May 28, 2009Inventors: Tetsuji Togawa, Keisuke Namiki, Satoru Yamaki
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Publication number: 20090095634Abstract: A plating method can form a plated film having a uniform thickness over the entire surface, including the peripheral surface, of a substrate. The plating method includes: disposing an anode so as to face a conductive film, formed on a substrate, which serves as a cathode, and disposing an auxiliary cathode on an ring-shaped seal member for sealing a peripheral portion of the substrate; bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution; and supplying electric currents between the anode and the conductive film, and between the anode and the auxiliary cathode to carry out plating.Type: ApplicationFiled: October 15, 2007Publication date: April 16, 2009Inventors: Natsuki Makino, Keisuke Namiki, Kunihito Ide, Junji Kunisawa, Katsuyuki Musaka, Philippe Vereecken, Brett C. Baker-O'Neal, Hariklia Deligianni, Keith Kwietniak
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Publication number: 20090095618Abstract: A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus included a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves as a cathode, a ring-shaped seal member for covering the cathode contact and bringing its inner circumferential portion into contact with the peripheral portion of the substrate to seal the peripheral portion of the substrate, an anode disposed so as to face the conductive film formed on the substrate, and an auxiliary cathode disposed to the seal member such that at least part of the auxiliary cathode expose on a surface of the seal member. Plating is carried out by bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution.Type: ApplicationFiled: October 15, 2007Publication date: April 16, 2009Inventors: Natsuki Makino, Keisuke Namiki, Kunihito Ide, Junji Kunisawa, Katsuyuki Musaka
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Publication number: 20090061748Abstract: The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.Type: ApplicationFiled: October 16, 2008Publication date: March 5, 2009Inventors: Tetsuji TOGAWA, Ikutarao NOJI, Keisuke NAMIKI, Hozumi YASUDA, Shunichiro KOJIMA, Kunihiko SAKURAI, Nobuyuki TAKADA, Osamu NABEYA, Makoto FUKUSHIMA, Hideki TAKAYANAGI
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Patent number: 7491117Abstract: The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.Type: GrantFiled: June 14, 2006Date of Patent: February 17, 2009Assignee: Ebara CorporationInventors: Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi
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Publication number: 20080299880Abstract: A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.Type: ApplicationFiled: June 10, 2008Publication date: December 4, 2008Inventors: Yoshihiro Gunji, Hozumi Yasuda, Keisuke Namiki, Hiroshi Yoshida
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Publication number: 20080066862Abstract: A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.Type: ApplicationFiled: October 30, 2007Publication date: March 20, 2008Inventors: Yoshihiro Gunji, Hozumi Yasuda, Keisuke Namiki, Hiroshi Yoshida
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Publication number: 20080047667Abstract: A substrate holding apparatus has a substrate holder body with a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.Type: ApplicationFiled: October 15, 2007Publication date: February 28, 2008Inventors: Yoshihiro Gunji, Hozumi Yasuda, Keisuke Namiki, Hiroshi Yoshida
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Publication number: 20070034526Abstract: An electrolytic processing apparatus can planarize uniformly over an entire surface of a substrate under a low pressure without any damages to the substrate. The electrolytic processing apparatus has a substrate holder configured to hold and rotate a substrate having a metal film formed on a surface of the substrate and an electrolytic processing unit configured to perform an electrolytic process on the substrate held by the substrate holder. The electrolytic processing unit has a rotatable processing electrode, a polishing pad attached to the rotatable processing electrode, and a pressing mechanism configured to press the polishing pad against the substrate.Type: ApplicationFiled: August 12, 2005Publication date: February 15, 2007Inventors: Natsuki Makino, Junji Kunisawa, Keisuke Namiki, Yukio Fukunaga, Katsuyuki Musaka, Ray Fang, Emanuel Cooper, John Cotte, Hariklia Deligianni, Keith Kwietniak, Brett Baker-O'Neal, Matteo Flotta, Philippe Vereecken
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Patent number: 7156725Abstract: There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface.Type: GrantFiled: July 10, 2002Date of Patent: January 2, 2007Assignee: Ebara CorporationInventors: Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi
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Publication number: 20060234609Abstract: The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.Type: ApplicationFiled: June 14, 2006Publication date: October 19, 2006Inventors: Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi
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Patent number: 7083507Abstract: The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.Type: GrantFiled: January 5, 2005Date of Patent: August 1, 2006Assignee: Ebara CorporationInventors: Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi
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Publication number: 20060113192Abstract: According to the present invention, there is provided a plating apparatus which can deposit a metal plated film such as a copper layer selectively in fine recesses for interconnects, such as trenches or via holes in a circuit form.Type: ApplicationFiled: January 22, 2004Publication date: June 1, 2006Inventors: Keiichi Kurashina, Keisuke Namiki, Tsutomu Nakada, Koji Mishima
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Publication number: 20050155865Abstract: There is provided an electrolytic processing apparatus and method which can produce products having various specifications with enhanced productivity, thus reducing the production cost, and which can respond flexibly to the movement toward finer interconnects in semiconductor devices.Type: ApplicationFiled: May 14, 2004Publication date: July 21, 2005Inventors: Koji Mishima, Keisuke Namiki, Masao Hodai, Junji Kunisawa, Natsuki Makino, Yukio Fukunaga
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Publication number: 20050118935Abstract: The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further comprises a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for being brought into contact with the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus further comprises a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.Type: ApplicationFiled: January 5, 2005Publication date: June 2, 2005Inventors: Tetsuji Togawa, Ikutaro Noji, Keisuke Namiki, Hozumi Yasuda, Shunichiro Kojima, Kunihiko Sakurai, Nobuyuki Takada, Osamu Nabeya, Makoto Fukushima, Hideki Takayanagi
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Patent number: 6890402Abstract: A substrate holding apparatus comprises a substrate holder body having a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.Type: GrantFiled: July 31, 2001Date of Patent: May 10, 2005Assignee: Ebara CorporationInventors: Yoshihiro Gunji, Hozumi Yasuda, Keisuke Namiki, Hiroshi Yoshida
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Publication number: 20050072527Abstract: A substrate holding apparatus comprises a substrate holder body having a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.Type: ApplicationFiled: October 26, 2004Publication date: April 7, 2005Inventors: Yoshihiro Gunji, Hozumi Yasuda, Keisuke Namiki, Hiroshi Yoshida
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Patent number: D633452Type: GrantFiled: February 25, 2010Date of Patent: March 1, 2011Assignee: Ebara CorporationInventors: Keisuke Namiki, Hozumi Yasuda, Osamu Nabeya, Makoto Fukushima, Shingo Togashi, Satoru Yamaki, Katsuhide Watanabe