Elastic membrane for semiconductor wafer polishing apparatus

- Ebara Corporation
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Description

FIG. 1 is a bottom view of an elastic membrane for semiconductor wafer polishing apparatus showing our new design;

FIG. 2 is a top view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a perspective view, observed from below thereof,

FIG. 8 is a perspective view, observed from above thereof;

FIG. 9 is a cross-section view taken along the line 9—9 of FIG. 1 thereof; and,

FIG. 10 is a enlarged view of part 10 of FIG. 9 thereof.

Claims

The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.

Referenced Cited
U.S. Patent Documents
645938 March 1900 Brown
5964653 October 12, 1999 Perlov et al.
6056632 May 2, 2000 Mitchel et al.
6110026 August 29, 2000 Arai
6159079 December 12, 2000 Zuniga et al.
6183354 February 6, 2001 Zuniga et al.
6659850 December 9, 2003 Korovin et al.
D488135 April 6, 2004 Hatter
6722965 April 20, 2004 Zuniga et al.
6739958 May 25, 2004 Chao et al.
6852019 February 8, 2005 Togawa et al.
6890402 May 10, 2005 Gunji et al.
7033260 April 25, 2006 Togawa et al.
7083507 August 1, 2006 Togawa et al.
7108592 September 19, 2006 Fukaya et al.
7255771 August 14, 2007 Chen et al.
7311585 December 25, 2007 Togawa et al.
7357699 April 15, 2008 Togawa et al.
D587222 February 24, 2009 Sasaki et al.
7491117 February 17, 2009 Togawa et al.
7632173 December 15, 2009 Togawa et al.
7635292 December 22, 2009 Togawa et al.
D616390 May 25, 2010 Sato
20010001755 May 24, 2001 Sandhu et al.
20010029158 October 11, 2001 Sasaki et al.
20020086624 July 4, 2002 Zuniga et al.
20030171076 September 11, 2003 Moloney et al.
20080070479 March 20, 2008 Nabeya et al.
20080119121 May 22, 2008 Togawa et al.
20080299880 December 4, 2008 Gunji et al.
20090068934 March 12, 2009 Hong et al.
20090068935 March 12, 2009 Torii et al.
20090111362 April 30, 2009 Nabeya et al.
20090191797 July 30, 2009 Nabeya et al.
20090233532 September 17, 2009 Togawa et al.
20100056028 March 4, 2010 Togawa et al.
Foreign Patent Documents
20050814728 December 2005 EP
2000-167762 June 2000 JP
2000-301452 October 2000 JP
2002-075936 March 2002 JP
2002-527894 August 2002 JP
2004-297029 October 2004 JP
2004-363505 December 2004 JP
2006-159392 June 2006 JP
2006-255851 September 2006 JP
3937368 April 2007 JP
30-0526799 April 2009 KR
30-0526801 April 2009 KR
2006/062232 June 2006 WO
Patent History
Patent number: D633452
Type: Grant
Filed: Feb 25, 2010
Date of Patent: Mar 1, 2011
Assignee: Ebara Corporation (Tokyo)
Inventors: Keisuke Namiki (Ohta-ku), Hozumi Yasuda (Ohta-ku), Osamu Nabeya (Ohta-ku), Makoto Fukushima (Ohta-ku), Shingo Togashi (Ohta-ku), Satoru Yamaki (Ohta-ku), Katsuhide Watanabe (Ohta-ku)
Primary Examiner: Selina Sikder
Attorney: Sughrue Mion, PLLC
Application Number: 29/356,456