Abstract: The instant invention pertains to a multi-layer tamper proof electronic coating wherein the first layer is a protecting layer produced from preceramic silicon containing material and at least one filler. The second layer is a resin sealer coat produced from a sealer resin selected from the group consisting of colloidal inorganic-based siloxane resins, benzocyclobutene based resins, polyimide polymers, siloxane polyimides and parylenes. An optional third layer is a cap coating layer selected from SiO.sub.2 coating, SiO.sub.2 /ceramic oxide coating, silicon containing coatings, silicon carbon containing coatings, silicon nitrogen containing coatings, silicon oxygen nitrogen coatings, silicon nitrogen carbon containing coatings and/or diamond like coatings.

Abstract: The present invention relates to a method of forming luminescent coatings on substrates and the substrates coated thereby. The method comprises applying a coating comprising hydrogen silsesquioxane resin and a phosphor filler on a substrate and heating the coated substrate at a temperature sufficient to convert the hydrogen silsesquioxane resin to a ceramic coating.

Abstract: The present invention relates to a method of forming coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising hydrogen silsesquioxane resin and a polysilazane on a substrate and heating the coated substrate at a temperature sufficient to convert the resins to ceramics.

Abstract: Disclosed is a method of increasing the adhesion between gold and silica derived from hydrogen silsesquioxane resin. The method comprises joining the gold and silica followed by annealing under an oxidizing atmosphere.

Abstract: A method and composition for joining flip chips back-side-up with respect to substrates by applying an adhesive between the active side of the flip chip and the substrate. The adhesive is a conductive silicone pressure sensitive adhesive containing (i) a silicone resin, (ii) a siloxane gum, (iii) a conductive particulate material, and optionally, (iv) a peroxide catalyst. Suitable conductive particulate materials are silver-clad glass fibers; spherical gold particles; spherical hollow glass microspheres coated with silver, gold, nickel, or copper; or spherical particles of metal alloys of Sn/Cu, Pb/Sn, or Au/Sn. The adhesive can be applied as a ball or bump itself, in conjunction with a solder ball or bump, or in the form of tape sandwiched between the flip chip and substrate.

Abstract: This invention relates to integrated circuits which are protected from the environment. Such circuits are sealed by applying a diffusion barrier metal layer to the bond pads and two passivation layers to the remainder of the circuit.

Abstract: A coating composition comprising hydrogen silsesquioxane resin and a phosphor filler diluted in a solvent. These compositions are used to form luminescent coatings on substrates.

Abstract: The present invention relates to a method of forming composite coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising hydrogen silsesquioxane resin and a refractory fiber on an electronic substrate and heating the coated substrate at a temperature sufficient to convert the hydrogen silsesquioxane resin into a ceramic.

Abstract: Disclosed is a method of forming metal containing ceramic coatings on substrates. The method comprises applying a coating of hydrogen silsesquioxane resin and a metallic filler onto a substrate and heating the coated substrate at a temperature sufficient to convert the hydrogen silsesquioxane resin to a silica containing ceramic matrix containing the metallic filler.

Abstract: This invention relates to integrated circuits which are protected from the environment. Such circuits are hermetically sealed by applying ceramic layers to the top metallization.

Abstract: Disclosed is a method of forming tamper-proof coatings on electronic devices. The method comprises applying a coating of a silica precursor resin and a filler onto the electronic device, wherein the filler is one which reacts in an oxidizing atmosphere to liberate enough heat to damage the electronic device. The coated electronic device is then heated at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.

Abstract: The present invention relates to the application of ceramic coatings on substrates. The method comprises applying a preceramic coating comprising hydrogen silsesquioxane resin, a material containing Si--Si bonds which forms volatile SiH compounds, and a catalyst followed by pyrolyzing the preceramic coating in an inert atmosphere. The novel ceramic coatings formed by the process of this invention are especially valuable on electronic devices.

Abstract: The present invention relates to a low temperature method of forming silica-containing ceramic coatings on substrates. The method involves applying a coating comprising a silicon hydride containing resin on a substrate and heating the coated substrate under an environment comprising nitrous oxide at a temperature sufficient to convert the resin to the silica-containing ceramic coating. This method is especially valuable for forming protective and dielectric coatings on electronic devices.

Abstract: The present invention relates to a method of forming protective coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising a polysilazane and a filler on a substrate and heating the coated substrate at a temperature sufficient to convert the polysilazane to a ceramic.

Abstract: The present invention relates to a method of forming coatings on electronic substrates and the substrates coated thereby. The method comprises applying a coating comprising a borosilazane and a filler on a substrate and heating the coated substrate at a temperature sufficient to convert the borosilazane to a ceramic coating.

Abstract: This invention relates to a threshold switching device which exhibits negative differential resistance, and which is made by depositing a silicon dioxide film derived from hydrogen silsesquioxane resin between at least two electrodes and then applying a voltage above a threshold voltage across the electrodes.

Abstract: Disclosed is a method of forming opaque coatings on integrated circuits. The method comprises selectively applying a coating of a silica precursor resin and a filler onto the integrated circuit and heating the coated circuit at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.

Abstract: Disclosed is a method of forming high dielectric constant coatings on substrates. The method comprises applying a coating of hydrogen silsesquioxane resin and a high dielectric constant filler onto a substrate and heating the coated substrate at a temperature sufficient to convert the hydrogen silsesquioxane resin to a silica containing ceramic matrix containing the filler.

Abstract: Disclosed are compositions which are useful for forming photodelineable coatings on substrates. The compositions contain a solvent, hydrogen silsesquioxane resin and an initiator which generates free radicals upon exposure to radiation.

Abstract: This invention relates to a method of forming a threshold switching device which exhibits negative differential resistance and to the devices formed thereby. The method comprises depositing a silicon dioxide film derived from hydrogen silsesquioxane resin between at least two electrodes and then applying a voltage above a threshold voltage across the electrodes.