Abstract: This invention relates to materials produced by diluting in a solvent a preceramic mixture of a hydrogen silsesquioxane resin and a metal oxide precursor selected from the group consisting of an aluminum alkoxide, a titanium alkoxide, and a zirconium alkoxide. The preceramic mixture solvent solution is applied to a substrate and ceramified by heating. One or more ceramic coatings containing silicon carbon, silicon nitrogen, or silicon carbon nitrogen can be applied over the ceramified SiO.sub.2 /metal oxide coating. A CVD or PECVD top coating can be applied for further protection. The invention is particularly useful for coating electronic devices.

Abstract: This invention relates to materials produced by diluting in a solvent a preceramic mixture of a partially hydrolyzed silicate ester which is applied to a substrate and ceramified by heating. One or more ceramic coatings containing silicon carbon, silicon nitrogen, or silicon carbon nitrogen can be applied over the ceramified SiO.sub.2 coating. A CVD or PECVD top coating can be applied for further protection. The invention is particularly useful for coating electronic devices.

Abstract: An improved curable siloxane-epoxy molding composition which is a blend of a phenylpolysiloxane, an aluminum catalyst, a silica filler, and an aromatic polyepoxide resin which contains at least 38 percent by weight of a polydiglycidyl ether of a bisphenol is disclosed. The molding composition has improved thermal shock crack resistance when used to encapsulate electronic devices.

Abstract: The admixing of a small amount of an organosilicon compound containing at least one silicon-bonded hydrogen atom with curable compositions comprising a hydroxyl-containing organosilicon compound, an epoxy compound and certain catalytic aluminum compounds to improve the performance of the cured composition is disclosed. The improved compositions are especially useful as a resin binder in molding compounds that are used to mold electronic devices.

Abstract: Certain aluminum compounds, such as aluminum alkoxides, chelates and acylates, catalyst the reaction of .tbd.SiOH with ##EQU1## to yield compositions containing ##EQU2## LINKAGES.

Abstract: Certain aluminum compounds, such as aluminum alkoxides, chelates and acylates, catalyst the reaction of .tbd.SiOH with ##STR1## to yield compositions containing ##STR2## linkages.