Abstract: The present invention is to provide a monomer mixture that is cured rapidly even in the presence of oxygen and that forms a cured product having high hardness and excellent adhesion to metals and/or glass. The monomer mixture according to an embodiment of the present invention contains two or more types of cationically polymerizable monomers. As the cationically polymerizable monomers, the monomer mixture contains at least 10 wt. %, based on a total amount of the monomer mixture, of a compound having at least one cationically polymerizable group selected from the group consisting of a vinyl ether group, an epoxy group, and an oxetanyl group, and at least one hydroxy group in a molecule, and at least 5 wt. %, based on the total amount of the monomer mixture, of a compound represented by Formula (b).

Abstract: The present invention provides a monomer mixture that rapidly cures even in high humidity environments, and is useful as a raw material for a curable composition that forms a cured product having excellent adhesion to metals and glass, as well as of course to paper and plastic. The monomer mixture according to an embodiment of the present invention contains two or more types of cationically polymerizable monomers. The monomer mixture contains, as the cationically polymerizable monomers, a compound (A) having a vinyl ether group and a hydroxyl group; a compound (B) having an oxetanyl group and a hydroxyl group; and a compound (C) represented by Formula (c) below. A total content of the compound (A), the compound (B), and the compound (C) is 50 wt. % or greater of the total amount of the monomer mixture, and a content [A] of the compound (A) and a content [B] of the compound (B) satisfy Relationship (1) below. A/(A+B)?0.

Abstract: Provided is a monomer mixture that is rapidly cured to form a cured product having high hardness, excellent alkali resistance, and excellent adhesion to a substrate. The monomer mixture of the present invention is a monomer mixture containing at least: a compound represented by Formulas (a-1) and/or (a-2); a compound (2B) including two cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; a compound (3B) including three or more cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; and a compound represented by Formula (c-1).

Abstract: Provided is a monomer composition that has rapid curability and can be cured rapidly, even in the presence of oxygen and/or water, to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition according to the present invention contains a vinyl ether compound (A). The vinyl ether compound (A) includes a vinyl ether compound (a) having a cyclic ether skeleton. The monomer composition further contains at least one compound selected from the group consisting of a vinyl ether compound (a?) having a chain hydrocarbon skeleton, a divinyl ether compound (a?-1) having a cyclic hydrocarbon skeleton, an oxetane compound (B), and an epoxy compound (C).

Abstract: The present invention provides a monomer mixture that rapidly cures even in high humidity environments, and is useful as a raw material for a curable composition that forms a cured product having excellent adhesion to metals and glass, as well as of course to paper and plastic. The monomer mixture according to an embodiment of the present invention contains two or more types of cationically polymerizable monomers. The monomer mixture contains, as the cationically polymerizable monomers, a compound (A) having a vinyl ether group and a hydroxyl group; a compound (B) having an oxetanyl group and a hydroxyl group; and a compound (C) represented by Formula (c) below. A total content of the compound (A), the compound (B), and the compound (C) is 50 wt. % or greater of the total amount of the monomer mixture, and a content [A] of the compound (A) and a content [B] of the compound (B) satisfy Relationship (1) below. A/(A+B)?0.

Abstract: Provided is a monomer mixture that is rapidly cured to form a cured product having high hardness, excellent alkali resistance, and excellent adhesion to a substrate. The monomer mixture of the present invention is a monomer mixture containing at least: a compound represented by Formulas (a-1) and/or (a-2) below; a compound (2B) including two cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; a compound (3B) including three or more cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; and a compound represented by Formula (c-1) below; wherein a total content of the compound represented by Formula (a-1) above and the compound represented by Formula (a-2) above is from 1 to 20 wt. % of a total amount of the monomer mixture; a ratio of contents of the compound (2B)/the compound (3B) is from 0.1 to 3.

Abstract: Provided is a monomer mixture having fast-curing properties and forming a cured product having high hardness, excellent alkali resistance, and excellent adhesion to a substrate. The monomer mixture according to an embodiment of the present invention is a monomer mixture containing a compound represented by Formulas (a-1) and/or (a-2): a compound (2B) including two cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; and a compound (3B) including three or more cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; wherein a total content of the compound represented by Formula (a-1) above and the compound represented by Formula (a-2) above is from 1 to 20 wt. % of a total amount of the monomer mixture; the compound (2B) contains a compound represented by Formula (2b-1); and a content of the compound represented by Formula (2b-1) above is 5 wt.

Abstract: The present invention is to provide a monomer mixture that is cured rapidly even in the presence of oxygen and that forms a cured product having high hardness and excellent adhesion to metals and/or glass. The monomer mixture according to an embodiment of the present invention contains two or more types of cationically polymerizable monomers. As the cationically polymerizable monomers, the monomer mixture contains at least 10 wt. %, based on a total amount of the monomer mixture, of a compound having at least one cationically polymerizable group selected from the group consisting of a vinyl ether group, an epoxy group, and an oxetanyl group, and at least one hydroxy group in a molecule, and at least 5 wt. %, based on the total amount of the monomer mixture, of a compound represented by Formula (b).

Abstract: Provided is a monomer composition that has rapid curability and can be cured rapidly, even in the presence of oxygen and/or water, to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition according to the present invention contains a vinyl ether compound (A). The vinyl ether compound (A) includes a vinyl ether compound (a) having a cyclic ether skeleton. The monomer composition further contains at least one compound selected from the group consisting of a vinyl ether compound (a?) having a chain hydrocarbon skeleton, a divinyl ether compound (a?-1) having a cyclic hydrocarbon skeleton, an oxetane compound (B), and an epoxy compound (C).

Abstract: Provided is a monomer composition that has rapid curability and can be rapidly cured even in the presence of oxygen and/or water to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition contains a multifunctional vinyl ether compound in an amount of 10 to 80 weight percent, a bifunctional oxetane compound represented by Formula (b) in an amount of 0.5 to 20 weight percent, and a monofunctional oxetane compound represented by Formula (b?) in an amount of 5 to 80 weight percent. In the formulae, Ring Z is selected from an aromatic hydrocarbon ring and a structure including two or more aromatic hydrocarbon rings bonded to each other through a single bond or a linkage group; R represents a monovalent aliphatic hydrocarbon group; R? is selected from hydrogen and ethyl; and m represents an integer of 0 or more.

Abstract: Provided is a thermosetting compound that has satisfactory solvent solubility and can be rapidly cured by a heat treatment to form a cured product having extreme heat resistance. The thermosetting compound according to the present invention is represented by following Formula (1). In Formula (1), R1 and R2 each independently represent a thermosetting group; D1 and D2 are each, identically or differently, selected from a single bond and a linkage group; Ar1, Ar2, and Ar3 are each, identically or differently, selected from a divalent aromatic hydrocarbon group and a divalent group including two or more aromatic hydrocarbons bonded to each other via any one selected from a single bond, a divalent aliphatic hydrocarbon group, and a divalent alicyclic hydrocarbon group; and E represents, independently on each occurrence, an ester bond.

Abstract: Provided is a monomer composition that has rapid curability and can be cured rapidly, even in the presence of oxygen and/or water, to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition according to the present invention contains a vinyl ether compound (A). The vinyl ether compound (A) includes a vinyl ether compound (a) having a cyclic ether skeleton. The monomer composition further contains at least one compound selected from the group consisting of a vinyl ether compound (a?) having a chain hydrocarbon skeleton, a divinyl ether compound (a?-1) having a cyclic hydrocarbon skeleton, an oxetane compound (B), and an epoxy compound (C).

Abstract: Provided is a monomer composition that has rapid curability and can be cured rapidly, even in the presence of oxygen and/or water, to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition according to the present invention contains a vinyl ether compound (A). The vinyl ether compound (A) includes a vinyl ether compound (a) having a cyclic ether skeleton. The monomer composition further contains at least one compound selected from the group consisting of a vinyl ether compound (a?) having a chain hydrocarbon skeleton, a divinyl ether compound (a?-1) having a cyclic hydrocarbon skeleton, an oxetane compound (B), and an epoxy compound (C).

Abstract: Provided is a monomer composition that has rapid curability and can be rapidly cured even in the presence of oxygen and/or water, to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition according to the present invention contains a multifunctional vinyl ether compound in an amount of 10 to 80 weight percent, a bifunctional oxetane compound represented by Formula (b) in an amount of 0.5 to 20 weight percent, and a monofunctional oxetane compound represented by Formula (b?) in an amount of 5 to 80 weight percent. In the formulae, Ring Z is selected from an aromatic hydrocarbon ring and a structure including two or more aromatic hydrocarbon rings bonded to each other through a single bond or a linkage group; R represents a monovalent aliphatic hydrocarbon group; R? is selected from hydrogen and ethyl; and m represents an integer of 0 or more.

Abstract: Provided is a monomer composition that has rapid curability and can be cured rapidly, even in the presence of oxygen and/or water, to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition according to the present invention contains a vinyl ether compound (A). The vinyl ether compound (A) includes a vinyl ether compound (a) having a cyclic ether skeleton. The monomer composition further contains at least one compound selected from the group consisting of a vinyl ether compound (a?) having a chain hydrocarbon skeleton, a divinyl ether compound (a?-1) having a cyclic hydrocarbon skeleton, an oxetane compound (B), and an epoxy compound (C).

Abstract: Provided is a monomer composition that has rapid curability and can be rapidly cured, even in the presence of oxygen and/or water, to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition according to the present invention includes at least one cationically curable monomer. The at least one cationically curable monomer includes at least one of 3-allyloxyoxetane and 3-(2-ethylhexyloxy)oxetane. The at least one of 3-allyloxyoxetane and 3-(2-ethylhexyloxy)oxetane is present in a total content of 5 weight percent or more of the total weight of the monomer composition.

Abstract: Provided is a monomer composition that has rapid curability and can be rapidly cured even in the presence of oxygen and/or water, to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition according to the present invention includes vinyl ether compounds (A). The monomer composition contains a monofunctional monomer in an amount of 20 to 80 weight percent, a hydroxy-free multifunctional vinyl ether compound in an amount of 5 to 80 weight percent, and a hydroxy-containing vinyl ether compound in an amount of 0.1 weight percent to less than 10 weight percent, where all weight percentages are based on the total weight of the monomer composition.

Abstract: Disclosed is a curable resin composition which includes a ladder-type silsesquioxane (A) having an aliphatic carbon-carbon double bond in the molecule; a ladder-type silsesquioxane (B) having a Si—H bond in the molecule; and a hydrosilylation catalyst. The curable resin composition is useful as sealants typically for optical semiconductor elements. Also disclosed is a cured article which is obtained by curing the curable resin composition. The curable resin composition can give such a cured article having properties including resistance to elevated temperatures, flexibility, transparency, resistance to thermal yellowing, and resistance to photoyellowing.

Abstract: A polymer for lithographic purposes has at least a repeating structural unit represented by following General Formula (I). In Formula (I), R1, R3, R4, and R6 each independently represent hydrogen atom, a halogen atom, cyano group, an alkyl group, or a haloalkyl group; R2 and R5 each independently represent hydrogen atom, cyano group, etc.; X1 and X2 each independently represent single bond, or a substituted or unsubstituted bivalent alkylene, alkenylene, or cycloalkylene group, etc.; X3 and X4 each independently represent single bond or —CO—; R7, R8, R9, and R10 each independently represent hydrogen atom, an alkyl group, or a cycloalkyl group. The polymer for lithographic purposes shows good balance between line edge roughness (LER) and etching resistance and allows very fine and uniform patterning.

Abstract: Disclosed is a curable resin composition which includes a ladder-type silsesquioxane (A) having an aliphatic carbon-carbon double bond in the molecule; a ladder-type silsesquioxane (B) having a Si—H bond in the molecule; and a hydrosilylation catalyst. The curable resin composition is useful as sealants typically for optical semiconductor elements. Also disclosed is a cured article which is obtained by curing the curable resin composition. The curable resin composition can give such a cured article having properties including resistance to elevated temperatures, flexibility, transparency, resistance to thermal yellowing, and resistance to photoyellowing.