Patents by Inventor Ken Pham
Ken Pham has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7918378Abstract: Methods and systems are described for enabling the efficient fabrication of wedge-bonding of integrated circuit systems and electronic systems.Type: GrantFiled: August 6, 2010Date of Patent: April 5, 2011Assignee: National Semiconductor CorporationInventor: Ken Pham
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Patent number: 7714418Abstract: An improved leadframe panel suitable for use in packaging IC dice is described. The described leadframe panel is configured such that the amount of leadframe material that is removed during singulation of the leadframe panel is reduced.Type: GrantFiled: July 23, 2007Date of Patent: May 11, 2010Assignee: National Semiconductor CorporationInventors: Peng Soon Lim, Terh Kuen Yii, Mohd Sabri Bin Mohamad Zin, Ken Pham
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Publication number: 20100084748Abstract: Methods for minimizing warpage of a welded foil carrier structure used in the packaging of integrated circuits are described. Portions of a metallic foil are ultrasonically welded to a carrier to form a foil carrier structure. The ultrasonic welding helps define a panel in the metallic foil that is suitable for packaging integrated circuits. Warpage of the thin foil can be limited in various ways. By way of example, an intermittent welding pattern that extends along the edges of the panel may be formed. Slots may be cut to define sections in the foil carrier structure. Materials for the metallic foil and the carrier may be selected to have similar coefficients of thermal expansion. An appropriate thickness for the metallic foil and the carrier may be selected, such that the warpage of the welded foil carrier structure is limited when the foil carrier structure is subjected to large increases in temperature. Foil carrier structures for use in the above methods are also described.Type: ApplicationFiled: December 8, 2009Publication date: April 8, 2010Applicant: NATIONAL SEMICONDUCTOR CORPORATIONInventors: Anindya PODDAR, Jaime A. BAYAN, Nghia Thuc TU, Will K. WONG, Ken PHAM
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Publication number: 20090026590Abstract: An improved leadframe panel suitable for use in packaging IC dice is described. The described leadframe panel is configured such that the amount of leadframe material that is removed during singulation of the leadframe panel is reduced.Type: ApplicationFiled: July 23, 2007Publication date: January 29, 2009Applicant: NATIONAL SEMICONDUCTOR CORPORATIONInventors: Peng Soon LIM, Terh Kuen YII, Mohd Sabri ZIN, Ken PHAM
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Patent number: 7269027Abstract: Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices.Type: GrantFiled: January 31, 2006Date of Patent: September 11, 2007Assignee: National Semiconductor CorporationInventors: Jia Liu, Luu Thanh Nguyen, Ken Pham, William Paul Mazotti, Bruce Carlton Roberts, Stephen Andrew Gee, John P. Briant
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Patent number: 7247942Abstract: The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using wirebond studs and an adhesive material. In other cases, the combination is joined using an anisotropic conductive film. Yet, in other cases, the combination is joined using solder material. Each of these joining mechanisms provides high levels of thermal, electrical and optical performance. The joining mechanisms can apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.Type: GrantFiled: December 15, 2004Date of Patent: July 24, 2007Assignee: National Semiconductor CorporationInventors: Luu Thanh Nguyen, Ken Pham, Peter Deane, William Paul Mazotti, Bruce Carlton Roberts, Jia Liu
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Patent number: 7199440Abstract: The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using wirebond studs and an adhesive material. In other cases, the combination is joined using an anisotropic conductive film. Yet, in other cases, the combination is joined using solder material. Each of these joining mechanisms provides high levels of thermal, electrical and optical performance. The joining mechanisms can apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.Type: GrantFiled: December 30, 2004Date of Patent: April 3, 2007Assignee: National Semiconductor CorporationInventors: Luu Thanh Nguyen, Ken Pham, Peter Deane, William Paul Mazotti, Bruce Carlton Roberts, Jia Liu
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Patent number: 7195955Abstract: This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental exposure in field applications. The overmolding of the devices with a clear mold cap or similar material also provides a standoff for optical fibers positioned next to the active facets. The photonic devices are attached to a substrate, which may be flexible that has electronic traces that allow the photonic devices to be connected to an external device such as a semiconductor device. A technique for manufacturing the overmolding cap using a mold die system in combination with a rigid carrier is also disclosed. The rigid carrier is used to maintain the shape of the substrate during the molding process. The proposed method applies to photonic devices used in optoelectronic packages that can serve as transceivers, transmitters, or receivers.Type: GrantFiled: August 31, 2005Date of Patent: March 27, 2007Assignee: National Semiconductor CorporationInventors: Luu Thanh Nguyen, Ken Pham, Peter Deane, William Paul Mazotti, Bruce Carlton Roberts
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Patent number: 7086788Abstract: Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices.Type: GrantFiled: March 30, 2005Date of Patent: August 8, 2006Assignee: National Semiconductor CorporationInventors: William Paul Mazotti, Peter Deane, Luu Thanh Nguyen, Ken Pham, Bruce Carlton Roberts, Jia Liu, Yongseon Koh, John P. Briant, Roger William Clarke, Michael R. Nelson, Christopher J. Smith, Janet E. Townsend
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Publication number: 20060140534Abstract: Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices.Type: ApplicationFiled: January 31, 2006Publication date: June 29, 2006Applicant: National Semiconductor CorporationInventors: Jia Liu, Luu Nguyen, Ken Pham, William Mazotti, Bruce Roberts, Stephen Gee, John Briant
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Patent number: 7045035Abstract: A post singulation, die separation assembly for bulk separation of a plurality of dice in a singulated wafer from the adhesive backing of wafer saw tape. The die separation assembly includes a support base having a support surface. A feed tray includes a collection end positioned adjacent the base such that an elongated, substantially tin gap is formed between the tray collection end and at least a portion of the base. A flexible platform is movably supported atop the base support surface for movement along the base. Upon movement of the flexible platform down the down-ramped portion of the support base, a portion of the wafer saw tape thereat is peeled away from the respective die. The tape is the separated from the dice, releasing the respective dice onto the collection end of the feed tray in a manner substantially maintaining their forward alignment orientation of thereof.Type: GrantFiled: April 6, 2005Date of Patent: May 16, 2006Assignee: National Semiconductor CorporationInventors: Nikhil Kelkar, Ken Pham, Jaime A. Bayan, Cheol Hyun Han
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Patent number: 7023705Abstract: Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices.Type: GrantFiled: June 6, 2002Date of Patent: April 4, 2006Assignee: National Semiconductor CorporationInventors: Jia Liu, Luu Thanh Nguyen, Ken Pham, William Paul Mazotti, Bruce Carlton Roberts, Stephen Andrew Gee, John P. Briant
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Publication number: 20060055080Abstract: Techniques for forming packaged semiconductor devices having top surfaces with flash-free electrical contact surfaces are described. According to one aspect, a molding cavity is provided which has a molding surface that is sufficiently smooth such that when placed in contact with an electrically conductive contact, gaps between the conductive contact and the mold cavity surface do not form.Type: ApplicationFiled: November 3, 2005Publication date: March 16, 2006Applicant: National Semiconductor CorporationInventors: Ken Pham, Luu Nguyen, William Mazotti
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Patent number: 7001083Abstract: This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental exposure in field applications. The overmolding of the devices with a clear mold cap or similar material also provides a standoff for optical fibers positioned next to the active facets. The photonic devices are attached to a substrate, which may be flexible that has electronic traces that allow the photonic devices to be connected to an external device such as a semiconductor device. A technique for manufacturing the overmolding cap using a mold die system in combination with a rigid carrier is also disclosed. The rigid carrier is used to maintain the shape of the substrate during the molding process. The proposed method applies to photonic devices used in optoelectronic packages that can serve as transceivers, transmitters, or receivers.Type: GrantFiled: September 21, 2001Date of Patent: February 21, 2006Assignee: National Semiconductor CorporationInventors: Luu Thanh Nguyen, Ken Pham, Peter Deane, William Paul Mazotti, Bruce Carlton Roberts
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Patent number: 6989122Abstract: Techniques for forming packaged semiconductor devices having top surfaces with flash-free electrical contact surfaces are described. According to one aspect, a molding cavity is provided which has a molding surface that is sufficiently smooth such that when placed in contact with an electrically conductive contact, gaps between the conductive contact and the mold cavity surface do not form.Type: GrantFiled: October 17, 2002Date of Patent: January 24, 2006Assignee: National Semiconductor CorporationInventors: Ken Pham, Luu Thanh Nquyen, William Paul Mazotti
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Publication number: 20060001183Abstract: This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental exposure in field applications. The overmolding of the devices with a clear mold cap or similar material also provides a standoff for optical fibers positioned next to the active facets. The photonic devices are attached to a substrate, which may be flexible that has electronic traces that allow the photonic devices to be connected to an external device such as a semiconductor device. A technique for manufacturing the overmolding cap using a mold die system in combination with a rigid carrier is also disclosed. The rigid carrier is used to maintain the shape of the substrate during the molding process. The proposed method applies to photonic devices used in optoelectronic packages that can serve as transceivers, transmitters, or receivers.Type: ApplicationFiled: August 31, 2005Publication date: January 5, 2006Applicant: National Semiconductor Corporation, A Delaware Corp.Inventors: Luu Nguyen, Ken Pham, Peter Deane, William Mazotti, Bruce Roberts
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Patent number: 6973225Abstract: The techniques of the present invention are directed towards setting a photonic device into a groove of a substrate, which is then attached to the chip sub-assembly in a way that the resulting optoelectronic package has a low profile and the interconnects between the photonic device and the semiconductor chip are short. The technique involves partially etching a groove in a substrate to allow for positioning of a photonic device within the groove. The photonic device is connected to the chip sub-assembly through interconnects that extend through the thickness of the substrate. The photonic devices are placed on their sides so that the active facets are perpendicular to the main axis of the chip sub-assembly. In this configuration, the optical fibers can be positioned parallel to the CSA top surface, ensuring a low module profile in the process.Type: GrantFiled: June 6, 2002Date of Patent: December 6, 2005Assignee: National Semiconductor CorporationInventors: Luu Thanh Nguyen, Ken Pham, Peter Deane, William Paul Mazotti, Bruce Carlton Roberts, Hau Thanh Nguyen, John P. Briant, Roger Clarke, Michael R. Nelson, Janet E. Townsend
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Patent number: 6932136Abstract: A post singulation, die separation assembly for bulk separation of a plurality of dice in a singulated wafer from the adhesive backing of wafer saw tape. The die separation assembly includes a support base having a support surface, a first portion and an opposite second portion thereof. The second portion includes a down-ramped portion thereof skewed downwardly at a first acute angle from the support surface. A feed tray includes a collection end positioned adjacent the base second portion such that an elongated, substantially thin gap is formed between the tray collection end and at least a portion of the base second portion. A flexible platform is movably supported atop the base support surface for movement from the first portion to the second portion thereof. At the second portion, the platform passes downward through the gap formed between the tray collection end and the at least a portion of the base second portion.Type: GrantFiled: April 8, 2004Date of Patent: August 23, 2005Assignee: National Semiconductor CorporationInventors: Nikhil Kelkar, Ken Pham, Jaime A. Bayan, Cheol Hyun Han
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Publication number: 20050175297Abstract: Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices.Type: ApplicationFiled: March 30, 2005Publication date: August 11, 2005Applicant: National Semiconductor CorporationInventors: William Mazotti, Peter Deane, Luu Nguyen, Ken Pham, Bruce Roberts, Jia Liu, Yongseon Koh, John Briant, Roger Clarke, Michael Nelson, Christopher Smith, Janet Townsend
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Patent number: 6916121Abstract: Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices.Type: GrantFiled: June 6, 2002Date of Patent: July 12, 2005Assignee: National Semiconductor CorporationInventors: William Paul Mazotti, Peter Deane, Luu Thanh Nguyen, Ken Pham, Bruce Carlton Roberts, Jia Liu, Yongseon Koh, John P. Briant, Roger William Clarke, Michael R. Nelson, Christopher J. Smith, Janet E. Townsend