Abstract: A crimp terminal includes barrel pieces respectively on both of two sides in a width direction thereof. The barrel pieces are included in a pressure-bonding section for pressure-bonding an exposed part of an electric wire conductor of an insulated wire. The insulated wire includes the electric wire conductor and an insulating cover for covering an outer circumference of the electric wire conductor, and the exposed part is a part of the electric wire conductor which is exposed from a tip of the cover by a predetermined length. The barrel pieces have a length in a longitudinal direction which is longer than the length of the exposed part of the electric wire conductor. The pressure-bonding section pressure-bonds, by the barrel pieces, a continuous part from a tip of the electric wire conductor to a position rear to the tip of the cover.

Abstract: Has an object of providing a crimp terminal, a connection structural body, and a method for producing the crimp terminal, which has a conducting function with certainty, with no galvanic corrosion occurring due to an electric wire and the terminal formed of different metal materials. A crimp terminal 1 includes a box section, and a pressure-bonding section including a wire barrel section and an insulation barrel section, which are provided in this order. The crimp terminal is formed of a metal plate which is formed of a copper alloy having a higher potential than aluminum used to form core wires of an insulated wire which is to be pressure-bonded by the pressure-bonding section. The crimp terminal 1 includes, in at least a part thereof, a resin cover section for covering a surface of the metal plate with a resin.

Abstract: In a connection structural body, an aluminum electric wire tip part and a crimp terminal are connected to each other. The aluminum electric wire tip part is an exposed tip part of an insulated wire including an aluminum core wire and an insulating cover for covering the aluminum core wire. The crimp terminal includes a wire barrel section for pressure-bonding and thus connecting the aluminum electric wire tip part and is formed of a metal material having a higher potential than that of the aluminum core wire. The aluminum electric wire tip part is covered with a cover solder and/or a cover resin, pressure-bonded, and connected to the wire barrel section such that the aluminum electric wire tip part is covered with the cover and/or the cover resins, with no gap, from an insulating cover tip part to a rear end portion of the wire barrel section.

Abstract: A metallic material for a connecting part, having a rectangular wire material of copper or a copper alloy as a base material, and formed at an outermost surface thereof, a copper-tin alloy layer substantially composed of copper and tin, wherein the copper-tin alloy layer of the outermost surface further contains at least one selected from the group consisting of zinc, indium, antimony, gallium, lead, bismuth, cadmium, magnesium, silver, gold, and aluminum, in a total amount of 0.01% or more and 1% or less in terms of mass ratio with respect to the content of the tin.

Abstract: A metallic material for a connecting part, having a rectangular wire material of copper or a copper alloy as a base material, and formed at an outermost surface thereof, a copper-tin alloy layer substantially composed of copper and tin, wherein the copper-tin alloy layer of the outermost surface further contains at least one selected from the group consisting of zinc, indium, antimony, gallium, lead, bismuth, cadmium, magnesium, silver, gold, and aluminum, in a total amount of 0.01% or more and 1% or less in terms of mass ratio with respect to the content of the tin.

Abstract: A metallic material for a connector, having a base material of a bar material or a rectangular wire material formed of copper or a copper alloy, in which a striped copper-tin alloy layer is formed in the longitudinal direction of the metallic material on a part of the surface of the metallic material, and in which a tin layer or a tin alloy layer is formed on the remaining part of the surface of the metallic material; and, a method of producing a metallic material for a connector, containing: providing a bar material or a rectangular wire material of copper or a copper alloy as a base material; forming a tin plating layer or a tin alloy plating layer on the base material, to obtain an intermediate material; and subjecting the intermediate material to reflow treatment in a stripe form in the longitudinal direction of the intermediate material.

Abstract: A connector terminal, fabricated from a metallic material for connector which material has a tin or tin alloy layer, formed on a copper or copper alloy base material, wherein the thickness of the tin or tin alloy layer at a contact site on the surface of the terminal is smaller than the thickness of the tin or tin alloy layer in the areas other than the contact site, and a copper-tin alloy layer is formed as an under layer of the tin or tin alloy layer at the contact site; and a connector terminal, fabricated from a metallic material for connector which material has a copper or copper alloy base material, wherein a copper-tin alloy layer is formed in a spot shape at a contact site on the surface of the terminal, and a tin or tin alloy layer is formed in the remaining areas on the surface.

Abstract: A metallic material for an electrical electronic includes a CU-Sun alloy layer (2) provided on a conductive base (1). A Cu concentration of the Cu—Sn alloy layer gradually decreases from the base side to the surface (3) side.

Abstract: An optical module equipped with at least one optical component, a package for housing the one optical component, and a joining portion. The joining portion is formed within the package by Sn—Ag solder containing 2.0 to 5.0 wt % Ag and 2.0 to 20.0 wt % Au, or Sn—Zn solder containing 6.0 to 10.0 wt % Zn and 2.0 to 20.0 wt % Au.

Abstract: An optical module equipped with at least one optical component, a package for housing the one optical component, and a joining portion. The joining portion is formed within the package by Sn—Ag solder containing 2.0 to 5.0 wt % Ag and 2.0 to 20.0 wt % Au, or Sn—Zn solder containing 6.0 to 10.0 wt % Zn and 2.0 to 20.0 wt % Au.

Abstract: A condenser angle of 0.5 mrad or below is set with respect to a specimen. Electron-beam diameter of 20 to 100 nm &phgr; is set onto the surface of the specimen. A flux of highly parallel electron beams is irradiated onto the specimen having a strained layer quantum well structure. An image of electrons diffracted from the specimen is recorded onto an imaging plate. The recorded image is analyzed. Lattice constants and strains of layers of the strained layer quantum well structure are measured based on a result of this analysis.

Abstract: A medical guidewire comprised of an NiTi-based alloy having a high elasticity over a wide range of strain, excellent straightness, and preferable shape and characteristics of a stress-strain curve in a tensile test. The wire is obtained by applying a predetermined tension to a cold drawn NiTi-based alloy wire and mechanical straightening it under conditions of a predetermined torsional shear strain and temperature and shows superior pushability, torque transmission, and reinsertability as a medical guidewire, so is preferable for a catheter guidewire, endoscope guidewire, etc.

Abstract: A condenser angle of 0.5 mrad or below is set with respect to a specimen. Electron-beam diameter of 20 to 100 nm &phgr; is set onto the surface of the specimen. A flux of highly parallel electron beams is irradiated onto the specimen having a strained layer quantum well structure. An image of electrons diffracted from the specimen is recorded onto an imaging plate. The recorded image is analyzed. Lattice constants and strains of layers of the strained layer quantum well structure are measured based on a result of this analysis.

Abstract: An Ni—Ti—Cu shape memory alloy electrothermal actuator element that recovers its original shape by electrical heating, having a wire diameter of 0.5 mm or less, comprising an Ni—Ti—Cu shape memory alloy wire which contains 49.0 to 51.0 at % of Ti, and 5.0 to 12.0 at % of Cu, with the balance being made of Ni, wherein the actuator element has a deterioration rate of shape strain recovery of 0.5% or less after repeating desired times of shape recovery movement.

Abstract: The present invention provides a Ni--Ti--Pd superelastic alloy material of a composition consisting of, by atomic percent, 34 to 49% nickel, 48 to 52% titanium and 3 to 14% palladium. Optionally, in a part of nickel and/or titanium of this alloy is replaced with one or more elements selected from a group of Cr, Fe, Co, V, Mn, B, Cu, Al, Nb, W and Zr such that these elements to be replaced amount to 2% or less in total (by atomic percent), wherein a stress hysteresis between the loading and unloading stresses in the stress-strain curve at temperatures between Af and Af+5.degree. is as small as 50 to 150 MPa. Since the Ni--Ti--Pd superelastic alloy material having the above composition is excellent in hot workability, it can be hot-worked into a wire having a diameter up to the range from 1 to 5 mm and manufactured at a low cost. Then, a final heat-treatment is given to the hot-worked material at a temperature in the range from 300 to 700.degree. C.

Abstract: The present invention provides a Ni--Ti--Pd superelastic alloy material of a composition consisting of, by atomic percent, 34 to 49% nickel, 48 to 52% titanium and 3 to 14% palladium. Optionally, a part of nickel and/or titanium of this alloy is replaced with one or more elements selected from a group of Cr, Fe, Co, V, Mn, B, Cu, Al, Nb, W and Zr such that these elements to be replaced amount to 2% or less in total (by atomic percent), wherein a stress hysteresis between the loading and unloading stresses in the stress-strain curve at temperatures between Af and Af+5.degree. is as small as 50 to 150 MPa. Since the Ni--Ti--Pd superelastic alloy material having the above composition is excellent in hot workability, it can be hot-worked into a wire having a diameter up to the range from 1 to 5 mm and manufactured at a low cost. Then, a final heat-treatment is given to the hot-worked material at a temperature in the range from 300.degree. to 700.degree. C.

Abstract: A method of manufacturing a high-temperature shape memory alloy includes the steps of cold-working a high-temperature shape memory alloy, in which a reverse martensite transformation start temperature (As) in a first heating after cold working reaches 350.degree. C. or above. Thereafter, the cold-worked alloy undergoes a first heat treatment for a period of time within the incubation time required for recrystallization or less, and at a temperature higher than a reverse martensite transformation finish temperature (Af). Finally, the resultant alloy is annealed with a second heat treatment, at a temperature which is not less than the plastic strain recovery temperature and not more than the recrystallization temperature. Specifically, the first heat treatment is performed for a period of three minutes or less at a temperature which exceeds 500.degree. C. and which is lower than the melting point of the alloy. The composition of the high-temperature shape memory alloy is Ti.sub.50 Ni.sub.50-x Pd.sub.