Abstract: The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.

Abstract: The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip.

Abstract: A desmear treatment method for a wiring board material is provide that is capable of performing desmear treating on the interior of a through hole formed in an insulating layer without requiring complicated steps and obtaining an insulating layer having appropriate surface roughness. The desmear treatment method comprises forming a hole passing through an insulating layer, wherein the insulating layer is made of a resin containing a filler, and desmear treating the wiring board material with radicals. The wiring board material includes a depletable resist layer formed on the insulating layer, and the depletable resist layer is made of a resin to be depleted in the desmear treatment step. A method of manufacturing a wiring board material to be subjected to the desmear treatment method and a composite insulating layer forming material used in the manufacturing method are also disclosed.

Abstract: A paper sheets pre-processing apparatus of an embodiment includes a large band remover, a small bundle coupler, a small band remover and an accumulator. The large band remover conveys a bundle in which a plurality of paper sheets are bound by small bands and a predetermined number of small bundles are bound by a large band, and removes the large band from the bundle. The small bundle coupler conveys the predetermined number of small bundles included in the bundle from which the large band is removed by the large band remover, and couples the predetermined number of small bundles to each other. The small band remover separates a single small bundle from the small bundles coupled by the small bundle coupler and removes the small band from the small bundle. The accumulator accumulates the paper sheets from which the small band is removed by the small band remover.

Abstract: Disclosed is a separator for semiconductor wafers vertically stacked in that the stacked wafers do not contact with each other, or the wafer does not contact to an inner top surface or an inner bottom surface of a conveyance container of the semiconductor wafer, the separator being interposed between two of the wafers neighboring vertically, between the wafer and an inner top surface, or between the wafer and an inner bottom surface of the container. The separator includes: a flat annular body; an annular convex portion having a wafer support surface coming into contact with a peripheral line of the wafer along a peripheral edge portion of the flat annular body, the annular convex portion forming cutout portions in a suitable number of places; and shock-absorbing function pieces neighboring to the cutout portions and extending diagonally upward or diagonally downward from a separator reference plane.

Abstract: Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.

Abstract: According to one embodiment, a paper sheet processing apparatus includes a supply unit, a pick-up mechanism, an inspection device, a stacking device, and a wrapping device configured to wind a band around a stacked paper sheet bundle and wrap the stacked paper sheet bundle. The wrapping device includes a clamp mechanism configured to curve the stacked paper sheet bundle by pressing both side portions of the stacked paper sheet bundle, a band winding device configured to wind a wrapper band around the curved stacked paper sheet bundle, and a heater configured to heat-seal an end of the wrapper band. The clamp mechanism includes a press member configured to adjust a degree of curvature of the stacked paper sheet bundle.

Abstract: The present invention relates to a copolymer containing a constitutional unit derived from acrylic acid cesium salt or acrylic acid rubidium salt and a constitutional unit derived from vinyl alcohol, a resin composition containing the copolymer, a carbon dioxide gas separation membrane which can be manufactured with the resin composition, a carbon dioxide gas separation membrane module having the separation membrane, and a carbon dioxide gas separation apparatus including at least one type of the module.

Abstract: A light irradiating apparatus that may include: an ultraviolet light emission lamp configured to emit vacuum ultraviolet light toward a workpiece to be disposed in an atmosphere of a treatment gas including oxygen; a light passing window adapted to be disposed between the workpiece and the ultraviolet light emission lamp and configured to allow the vacuum ultraviolet light from the ultraviolet light emission lamp to pass therethrough, in which the light passing window has a light-exiting surface; and a spacer adapted to be disposed between the light passing window and the workpiece, to apply a pressing force onto the workpiece and to form a gap that allows a distance from the light-exiting surface of the light passing window to a surface of the workpiece to be of a uniform size over the entire surface of the workpiece.

Abstract: According to one embodiment, a stacking/wrapping apparatus includes a stacking device configured to stack paper sheets in a predetermined number on a stacking unit, a wrapping device configured to wrap a bundle of the stacked paper sheets by winding a band thereon, and a transport carrier configured to receive the paper sheet bundle and transport the paper sheet bundle to the wrapping device. The wrapping device includes a hand assembly, a hand drive mechanism configured to open and close the hand assembly and reciprocate the hand assembly at right angles to the stacking direction, and a band winding device configured to wind a wrapper band around the paper sheet bundle drawn into the binding position.

Abstract: According to one embodiment, a stacking/wrapping apparatus includes a stacking device configured to stack paper sheets in a predetermined number on a stacking unit, a wrapping device configured to wrap a bundle of the stacked paper sheets by winding a band thereon, and a transport carrier configured to receive the paper sheet bundle and transport the paper sheet bundle to the wrapping device. The wrapping device includes a hand assembly, a hand drive mechanism configured to open and close the hand assembly and reciprocate the hand assembly at right angles to the stacking direction, and a band winding device configured to wind a wrapper band around the paper sheet bundle drawn into the binding position.

Abstract: A light irradiation apparatus that can uniformly treat the entire to-be-treated surface of a to-be-treated subject having a light irradiation apparatus including: a treatment chamber in which a to-be-treated subject is disposed; an ultraviolet emitting lamp for emitting vacuum ultraviolet rays to the to-be-treated subject; and gas supply means for supplying a treatment gas containing a source of active species to the treatment chamber. A gas supply port for supplying the treatment gas to the treatment chamber and a gas discharge port for discharging the gas in the treatment chamber are provided on respective sides of a to-be-treated subject placement area in the treatment chamber so as to form a gas flow channel through which the treatment gas flows from the gas supply port toward the gas discharge port in the treatment chamber. How much of a gas amount at the gas supply port reaches the gas discharge port is controlled to be 60 to 95%.

Abstract: Disclosed are a desmear treatment method for a wiring board material that can sufficiently perform a desmear treatment on the interior of a through hole formed in an insulating layer without requiring a complicated step and can obtain an insulating layer having appropriate surface roughness, a method of manufacturing a wiring board material to be subjected to the desmear treatment method, and a composite insulating layer forming material used in the manufacturing method. The desmear treatment method of the present invention is a desmear treatment method for a wiring board material in which an insulating layer made of a resin containing a filler is layered on a conductive layer. The desmear treatment method includes: a hole forming step of forming a hole passing through the insulating layer in a thickness direction thereof; and a desmear treatment step of treating the wiring board material having undergone the hole forming step with radicals.

Abstract: A paper sheets pre-processing apparatus of an embodiment includes a large band remover, a small bundle coupler, a small band remover and an accumulator. The large band remover conveys a bundle in which a plurality of paper sheets are bound by small bands and a predetermined number of small bundles are bound by a large band, and removes the large band from the bundle. The small bundle coupler conveys the predetermined number of small bundles included in the bundle from which the large band is removed by the large band remover, and couples the predetermined number of small bundles to each other. The small band remover separates a single small bundle from the small bundles coupled by the small bundle coupler and removes the small band from the small bundle. The accumulator accumulates the paper sheets from which the small band is removed by the small band remover.

Abstract: An ashing apparatus includes a treatment chamber having an object to be processed therein, and a lamp chamber having an ultraviolet lamp that radiates the object with an ultraviolet beam. The ashing apparatus is configured to accurately maintain an irradiation distance between a light source and the object. Thus, it is possible to efficiently remove a smear from a wiring board. The treatment chamber and the lamp chamber are moved relative to each other and in parallel to a surface of the object to be processed. The treatment chamber has a stage that supports the object, a gas inlet opening for supplying a treatment gas into the treatment chamber, and a gas outlet opening for discharging the treatment gas. An ultraviolet transmitting window member that partitions the treatment chamber and the lamp chamber from each other is fixed to the treatment chamber.

Abstract: Provided is a machine control program generation device for generating a machine control program to be executed on a controller for controlling a machine component, including: a connected device selector for selecting a connected device to be connected to the controller; and a connector identifier assignor for assigning, when the connected device selector selects the connected device, a new connector identifier for identifying a connector for connecting the controller and the selected connected device to each other to the selected connected device.

Abstract: An ashing apparatus includes a treatment chamber having an object to be processed therein, and a lamp chamber having an ultraviolet lamp that radiates the object with an ultraviolet beam. The ashing apparatus is configured to accurately maintain an irradiation distance between a light source and the object. Thus, it is possible to efficiently remove a smear from a wiring board. The treatment chamber and the lamp chamber are moved relative to each other and in parallel to a surface of the object to be processed. The treatment chamber has a stage that supports the object, a gas inlet opening for supplying a treatment gas into the treatment chamber, and a gas outlet opening for discharging the treatment gas. An ultraviolet transmitting window member that partitions the treatment chamber and the lamp chamber from each other is fixed to the treatment chamber.

Abstract: A light irradiating apparatus that may include: an ultraviolet light emission lamp configured to emit vacuum ultraviolet light toward a workpiece to be disposed in an atmosphere of a treatment gas including oxygen; a light passing window adapted to be disposed between the workpiece and the ultraviolet light emission lamp and configured to allow the vacuum ultraviolet light from the ultraviolet light emission lamp to pass therethrough, in which the light passing window has a light-exiting surface; and a spacer adapted to be disposed between the light passing window and the workpiece, to apply a pressing force onto the workpiece and to form a gap that allows a distance from the light-exiting surface of the light passing window to a surface of the workpiece to be of a uniform size over the entire surface of the workpiece.

Abstract: Provided are a desmearing method and a desmearing device which are able to reliably remove a smear derived from any of an inorganic substance and an organic substance, and eliminate the need to use a chemical that requires a waste liquid treatment. The desmearing method of the present invention is directed to a desmearing method for a wiring substrate material that is a laminated body of insulating layers made from resin containing a filler and a conductive layer, and includes an ultraviolet irradiation treatment step for irradiating the wiring substrate material with ultraviolet beams with a wavelength of 220 nm or less, and a physical vibration treatment step for applying physical vibrations to the wiring substrate material which has undergone the ultraviolet irradiation treatment step.

Abstract: Provided is a controller configured to control a device including a servo axis based on a time chart, including: a time chart execution unit configured to output a control signal serving as a signal for controlling an operation of the device based on a description for controlling the operation of the device included in the time chart; an internal time counter configured to count an internal time corresponding to a time on a time axis of the time chart; and an internal time stopper configured to stop, for at least one device as the device, the counting of the internal time conducted by the internal time counter until an operation of the at least one device is finished when the operation of the at least one device has not been finished after a scheduled finish time point of the operation of the at least one device on the time chart.