Abstract: An electric power conversion apparatus according the present disclosure includes: voltage detection means which detects the voltages of both bridge circuits, and a control device which controls the semiconductor switching elements of both bridge circuits. The control device includes a phase difference operation part which calculates a phase difference between the output of the first bridge circuit and the output of the second bridge circuit, based on the voltage values of both bridge circuits which are detected by the voltage detection means and an electric power command value; a compensation amount operation part which calculates a compensation amount which compensates an error due to the phase difference; and a PWM signal generation part which generates gate signals of the semiconductor switching elements, from a first operation result of the phase difference operation part and a second operation result of the compensation amount operation part.

Abstract: An imaging module includes: a planar light emitter that includes a light-emitting face and a light-emitter terminal; a power supply cable that is connected to the light-emitter terminal and that supplies electric power to the planar light emitter; a solid-state image sensing device that captures an image of an illumination object that is irradiated with light emitted from the light-emitting face; a coaxial cable that is electrically connected to the solid-state image sensing device; a light shield that is disposed between the solid-state image sensing device and the planar light emitter; and a light guide that guides light emitted from the light-emitting face to an outside of the imaging module. The planar light emitter, the solid-state image sensing device, part of the light shield, and the light guide constitute a rigid portion of the imaging module.

Abstract: An imaging module includes: a planar light emitter that includes a light-emitting face and a light-emitter terminal; a power supply cable that is connected to the light-emitter terminal and that supplies electric power to the planar light emitter; a solid-state image sensing device that captures an image of an illumination object that is irradiated with light emitted from the light-emitting face; a coaxial cable that is electrically connected to the solid-state image sensing device; a light shield that is disposed between the solid-state image sensing device and the planar light emitter; and a light guide that guides light emitted from the light-emitting face to an outside of the imaging module. The planar light emitter, the solid-state image sensing device, part of the light shield, and the light guide constitute a rigid portion of the imaging module.

Abstract: An imaging module includes: a support substrate that includes a first surface, a second surface on an opposite side of the first surface, and a first mounting terminal disposed on the first surface; a planar light emitter including a light-emitting face, and a light-emitter terminal disposed on the first surface of the support substrate and connected to the first mounting terminal; and a solid-state image sensing device disposed adjacent to the planar light emitter and that includes a light-incident surface that has a quadrangular shape in plan view and that captures an image of an imaging object that is irradiated with light emitted from the light-emitting face.

Abstract: The present invention provides a method for quantitatively detecting ?-1,3-1,6-glucan separately from ?-1,3-glucan and ?-1,3-1,4-glucan. The present invention is a method for measuring ?-1,3-1,6-glucan, the method including: a step for mixing ?-glucan in a test sample, a molecule that specifically binds to a ?-(1?3) bond, and a molecule that specifically binds to a ?-(1?6) bond to form a complex containing the molecule that specifically binds to a ?-(1?3) bond and the molecule that specifically binds to a ?-(1?6) bond; a step for detecting the complex; and a step for measuring the amount of ?-1,3-1,6-glucan in the test sample, on the basis of the results of the detection.

Abstract: An imaging module of the invention includes: an imaging element; and a substrate positioned on a rear surface opposite to an imaging surface of the imaging element and provided to extend from the rear surface to a side opposite to the imaging surface. An electrode pad provided on the rear surface of the imaging element and a front end portion of an electrode pad provided on a main surface of the substrate at a position close to the imaging element are electrically connected via a conductive connecting material portion. A notch portion recessed from a distal end of the front end portion is formed at the front end portion of the electrode pad of the substrate.

Abstract: An imaging module includes: a support substrate that includes a first surface, a second surface on an opposite side of the first surface, and a first mounting terminal disposed on the first surface; a planar light emitter including a light-emitting face, and a light-emitter terminal disposed on the first surface of the support substrate and connected to the first mounting terminal; and a solid-state image sensing device disposed adjacent to the planar light emitter and that includes a light-incident surface that has a quadrangular shape in plan view and that captures an image of an imaging object that is irradiated with light emitted from the light-emitting face.

Abstract: An imaging module includes: an image-sensing device; a first substrate; a signal cable; a second substrate; and a flexible linear structure. Each of the first substrate and the second substrate includes a wiring and a cable terminal electrically connected to the signal cable on only one surface of the substrate. Each of the wiring of the first substrate and the wiring of the second substrate is electrically connected to the signal line via the cable terminal. The flexible linear structure extends in a direction along the signal cable from a front-end portion of the flexible linear structure supported by a structure-front-end support including the first substrate, and the flexible linear structure is disposed on a side of the signal cable where the first substrate and the second substrate are disposed.

Abstract: An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element, and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with adhesive resin in which a glass-transition temperature is 135° C. or less.

Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body that includes a plurality of surfaces, an electrode terminal, a first cable terminal disposed on only one of the plurality of surfaces of the first insulating substrate main body; a second substrate including a second insulating substrate main body and a second cable terminal; and a signal cable disposed between the first substrate and the second substrate, that electrically connects the first cable terminal to the second cable terminal. The one of the plurality of surfaces of the first insulating substrate main body where the first cable terminal is connected to the signal cable and a surface of the second insulating substrate main body where the second cable terminal is connected to the signal cable are disposed on a same plane.

Abstract: An endoscope includes: an imaging device chip having a chip connection portion; a tubular housing tube used to a scope tip portion of an endoscope; a substrate to which the imaging device chip is fixed, the substrate having a substrate connection portion, the substrate being capable of bending at near the substrate connection portion when the substrate is inserted into the housing tube; a lead wire connecting the substrate connection portion and the chip connection portion; flexible and non-conductive resin covering an entirety of the lead wire; and an imaging module including the substrate provided with the imaging device chip thereon, the imaging module inserted into the housing tube.

Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body; a second substrate including a second insulating substrate main body; and a signal cable disposed between the first substrate and the second substrate, that electrically connects a first cable terminal to a second cable terminal. In the imaging module, D1 is a length of a first diagonal line on a light-receiving face of the image-sensing device, D2 is a length of a second diagonal line on an end face of the second insulating substrate main body, and D2 is less than or equal to D1.

Abstract: A method of manufacturing an electric wire includes providing wire rods made of aluminum alloy, forming aluminum alloy wires by drawing the wire rods to a final wire diameter without heat treatment, and forming a conductor by twisting together the aluminum alloy wires with a twist pitch of 7 to 36 times a predetermined diameter of the conductor. A composition of the aluminum alloy contains 0.1 to less than 1.0% by weight of Fe, 0 to 0.08% by weight of Zr, 0.02 to 2.8% by weight of Si, and 0.05 to 0.63% by weight of Cu and/or 0.03 to 0.45% by weight of Mg, with the remainder being Al and unavoidable impurities.

Abstract: An imaging module is capable of being used a two or more limited number of times. The imaging module includes: a CMOS imaging sensor; and a counter memory in which the number of use times is stored, the number of use times being the number of times the imaging sensor is used.

Abstract: Crystals of a quinazoline derivative are provided. The present invention relates to an acid addition salt of a compound represented by Formula (I): a pharmaceutical composition containing it, and the like.

Abstract: Crystals of a quinazoline derivative are provided. The present invention relates to an acid addition salt of a compound represented by Formula (I): a pharmaceutical composition containing it, and the like.

Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body; a second substrate including a second insulating substrate main body; and a signal cable disposed between the first substrate and the second substrate, that electrically connects a first cable terminal to a second cable terminal. In the imaging module, D1 is a length of a first diagonal line on a light-receiving face of the image-sensing device, D2 is a length of a second diagonal line on an end face of the second insulating substrate main body, and D2 is less than or equal to D1.

Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body that includes a plurality of surfaces, an electrode terminal, a first cable terminal disposed on only one of the plurality of surfaces of the first insulating substrate main body; a second substrate including a second insulating substrate main body and a second cable terminal; and a signal cable disposed between the first substrate and the second substrate, that electrically connects the first cable terminal to the second cable terminal. The one of the plaurality of surfaces of the first insulating substrate main body where the first cable terminal is connected to the signal cable and a surface of the second insulating substrate main body where the second cable terminal is connected to the signal cable are disposed on a same plane.

Abstract: An imaging module includes: an image-sensing device; a first substrate; a signal cable; a second substrate; and a flexible linear structure. Each of the first substrate and the second substrate includes a wiring and a cable terminal electrically connected to the signal cable on only one surface of the substrate. Each of the wiring of the first substrate and the wiring of the second substrate is electrically connected to the signal line via the cable terminal. The flexible linear structure extends in a direction along the signal cable from a front-end portion of the flexible linear structure supported by a structure-front-end support including the first substrate, and the flexible linear structure is disposed on a side of the signal cable where the first substrate and the second substrate are disposed.

Abstract: An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction moving away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with an adhesive resin in which the rate of volumetric shrinkage in curing is 3% or more.