Patents by Inventor Kenichi Ishibashi

Kenichi Ishibashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12149066
    Abstract: The present disclosure suppresses increase in device cost in a DC power distribution system that can disconnect a distribution line on which a short-circuit failure has occurred, from an output path. This DC power distribution system includes: a plurality of power conversion devices; one DC busbar; a plurality of distribution lines; a plurality of first current interruption portions respectively connected to input sides of the power conversion devices; a plurality of second current interruption portions connected between the power conversion devices and the DC busbar; and a plurality of third current interruption portions respectively provided on the distribution lines. Interruption current values of the third current interruption portions are set to smaller values than a maximum allowable current value of the power conversion device in which short-circuit current will reach the maximum allowable current value in a shortest time.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: November 19, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kenichi Fukuno, Hayato Takeuchi, Takaharu Ishibashi, Takushi Jimichi
  • Publication number: 20240316712
    Abstract: A temperature control device includes a machine body temperature sensor which measures a machine body temperature at a portion separated from a spindle device, a return oil temperature sensor which measures a temperature of cooling oil which circulates in a machine tool and which is collected by the temperature control device, an oil controller which includes at least two oil control modules, each having a cooler and which control the temperature of the cooling oil so that the temperature of the cooling oil detected by the return temperature sensor is synchronized with a reference temperature set based on a machine body temperature, in which tanks thereof communicate with each other, and the at least two oil control modules are connected in parallel to the machine tool, and a piping connection manifold for uniformizing convergence of the cooling oil to the machine tool and branching to each of the oil control modules.
    Type: Application
    Filed: June 29, 2022
    Publication date: September 26, 2024
    Applicant: MAKINO MILLING MACHINE CO., LTD.
    Inventors: Kiyoteru ISHIBASHI, Junya OMATA, Kenichi FUJIKAWA
  • Patent number: 11857168
    Abstract: An imaging module includes: a planar light emitter that includes a light-emitting face and a light-emitter terminal; a power supply cable that is connected to the light-emitter terminal and that supplies electric power to the planar light emitter; a solid-state image sensing device that captures an image of an illumination object that is irradiated with light emitted from the light-emitting face; a coaxial cable that is electrically connected to the solid-state image sensing device; a light shield that is disposed between the solid-state image sensing device and the planar light emitter; and a light guide that guides light emitted from the light-emitting face to an outside of the imaging module. The planar light emitter, the solid-state image sensing device, part of the light shield, and the light guide constitute a rigid portion of the imaging module.
    Type: Grant
    Filed: January 30, 2019
    Date of Patent: January 2, 2024
    Assignee: Fujikura Ltd.
    Inventors: Takeshi Ishizuka, Kenichi Ishibashi, Daisuke Murakami, Yoshinobu Numasawa
  • Publication number: 20230200635
    Abstract: An imaging module includes: a planar light emitter that includes a light-emitting face and a light-emitter terminal; a power supply cable that is connected to the light-emitter terminal and that supplies electric power to the planar light emitter; a solid-state image sensing device that captures an image of an illumination object that is irradiated with light emitted from the light-emitting face; a coaxial cable that is electrically connected to the solid-state image sensing device; a light shield that is disposed between the solid-state image sensing device and the planar light emitter; and a light guide that guides light emitted from the light-emitting face to an outside of the imaging module. The planar light emitter, the solid-state image sensing device, part of the light shield, and the light guide constitute a rigid portion of the imaging module.
    Type: Application
    Filed: January 30, 2019
    Publication date: June 29, 2023
    Applicant: Fujikura Ltd.
    Inventors: Takeshi Ishizuka, Kenichi Ishibashi, Daisuke Murakami, Yoshinobu Numasawa
  • Patent number: 11558534
    Abstract: An imaging module includes: a support substrate that includes a first surface, a second surface on an opposite side of the first surface, and a first mounting terminal disposed on the first surface; a planar light emitter including a light-emitting face, and a light-emitter terminal disposed on the first surface of the support substrate and connected to the first mounting terminal; and a solid-state image sensing device disposed adjacent to the planar light emitter and that includes a light-incident surface that has a quadrangular shape in plan view and that captures an image of an imaging object that is irradiated with light emitted from the light-emitting face.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: January 17, 2023
    Assignee: FUJIKURA LTD.
    Inventors: Yoshinobu Numasawa, Kenichi Ishibashi, Daisuke Murakami, Takeshi Ishizuka
  • Publication number: 20220276231
    Abstract: The present invention provides a method for quantitatively detecting ?-1,3-1,6-glucan separately from ?-1,3-glucan and ?-1,3-1,4-glucan. The present invention is a method for measuring ?-1,3-1,6-glucan, the method including: a step for mixing ?-glucan in a test sample, a molecule that specifically binds to a ?-(1?3) bond, and a molecule that specifically binds to a ?-(1?6) bond to form a complex containing the molecule that specifically binds to a ?-(1?3) bond and the molecule that specifically binds to a ?-(1?6) bond; a step for detecting the complex; and a step for measuring the amount of ?-1,3-1,6-glucan in the test sample, on the basis of the results of the detection.
    Type: Application
    Filed: May 18, 2022
    Publication date: September 1, 2022
    Applicants: OLYMPUS CORPORATION, Tokyo University of Pharmacy & Life Sciences
    Inventors: Hidetaka NAKATA, Yoshiyuki ADACHI, Kenichi ISHIBASHI, Daisuke YAMANAKA, Naohito OHNO
  • Patent number: 11337597
    Abstract: An imaging module of the invention includes: an imaging element; and a substrate positioned on a rear surface opposite to an imaging surface of the imaging element and provided to extend from the rear surface to a side opposite to the imaging surface. An electrode pad provided on the rear surface of the imaging element and a front end portion of an electrode pad provided on a main surface of the substrate at a position close to the imaging element are electrically connected via a conductive connecting material portion. A notch portion recessed from a distal end of the front end portion is formed at the front end portion of the electrode pad of the substrate.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: May 24, 2022
    Assignee: FUJIKURA LTD.
    Inventors: Takeshi Ishizuka, Kenichi Ishibashi, Hideaki Usuda
  • Publication number: 20210037169
    Abstract: An imaging module includes: a support substrate that includes a first surface, a second surface on an opposite side of the first surface, and a first mounting terminal disposed on the first surface; a planar light emitter including a light-emitting face, and a light-emitter terminal disposed on the first surface of the support substrate and connected to the first mounting terminal; and a solid-state image sensing device disposed adjacent to the planar light emitter and that includes a light-incident surface that has a quadrangular shape in plan view and that captures an image of an imaging object that is irradiated with light emitted from the light-emitting face.
    Type: Application
    Filed: November 7, 2018
    Publication date: February 4, 2021
    Applicant: Fujikura Ltd.
    Inventors: Yoshinobu Numasawa, Kenichi Ishibashi, Daisuke Murakami, Takeshi Ishizuka
  • Patent number: 10757309
    Abstract: An imaging module includes: an image-sensing device; a first substrate; a signal cable; a second substrate; and a flexible linear structure. Each of the first substrate and the second substrate includes a wiring and a cable terminal electrically connected to the signal cable on only one surface of the substrate. Each of the wiring of the first substrate and the wiring of the second substrate is electrically connected to the signal line via the cable terminal. The flexible linear structure extends in a direction along the signal cable from a front-end portion of the flexible linear structure supported by a structure-front-end support including the first substrate, and the flexible linear structure is disposed on a side of the signal cable where the first substrate and the second substrate are disposed.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: August 25, 2020
    Assignee: Fujikura Ltd.
    Inventors: Yoshinobu Numasawa, Kenichi Ishibashi, Shingo Ishii, Daisuke Murakami, Takeshi Ishizuka, Hideaki Usuda
  • Patent number: 10660507
    Abstract: An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element, and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with adhesive resin in which a glass-transition temperature is 135° C. or less.
    Type: Grant
    Filed: March 2, 2016
    Date of Patent: May 26, 2020
    Assignee: FUJIKURA LTD.
    Inventors: Takahiro Shimono, Hideo Shiratani, Kenichi Ishibashi
  • Patent number: 10560658
    Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body that includes a plurality of surfaces, an electrode terminal, a first cable terminal disposed on only one of the plurality of surfaces of the first insulating substrate main body; a second substrate including a second insulating substrate main body and a second cable terminal; and a signal cable disposed between the first substrate and the second substrate, that electrically connects the first cable terminal to the second cable terminal. The one of the plurality of surfaces of the first insulating substrate main body where the first cable terminal is connected to the signal cable and a surface of the second insulating substrate main body where the second cable terminal is connected to the signal cable are disposed on a same plane.
    Type: Grant
    Filed: August 29, 2018
    Date of Patent: February 11, 2020
    Assignee: Fujikura Ltd.
    Inventors: Takeshi Ishizuka, Kenichi Ishibashi, Shingo Ishii, Daisuke Murakami, Yoshinobu Numasawa, Hideaki Usuda
  • Patent number: 10510918
    Abstract: An endoscope includes: an imaging device chip having a chip connection portion; a tubular housing tube used to a scope tip portion of an endoscope; a substrate to which the imaging device chip is fixed, the substrate having a substrate connection portion, the substrate being capable of bending at near the substrate connection portion when the substrate is inserted into the housing tube; a lead wire connecting the substrate connection portion and the chip connection portion; flexible and non-conductive resin covering an entirety of the lead wire; and an imaging module including the substrate provided with the imaging device chip thereon, the imaging module inserted into the housing tube.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: December 17, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Wei-Zhi Hu, Kenichi Nakatate, Takeshi Segi, Kenichi Ishibashi, Fumihiko Nishimura, Satoshi Hida, Hitoe Iikura, Hideo Shiratani
  • Patent number: 10462342
    Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body; a second substrate including a second insulating substrate main body; and a signal cable disposed between the first substrate and the second substrate, that electrically connects a first cable terminal to a second cable terminal. In the imaging module, D1 is a length of a first diagonal line on a light-receiving face of the image-sensing device, D2 is a length of a second diagonal line on an end face of the second insulating substrate main body, and D2 is less than or equal to D1.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: October 29, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Hideaki Usuda, Kenichi Ishibashi, Daisuke Murakami, Takeshi Ishizuka, Yoshinobu Numasawa, Shingo Ishii
  • Patent number: 10453581
    Abstract: A method of manufacturing an electric wire includes providing wire rods made of aluminum alloy, forming aluminum alloy wires by drawing the wire rods to a final wire diameter without heat treatment, and forming a conductor by twisting together the aluminum alloy wires with a twist pitch of 7 to 36 times a predetermined diameter of the conductor. A composition of the aluminum alloy contains 0.1 to less than 1.0% by weight of Fe, 0 to 0.08% by weight of Zr, 0.02 to 2.8% by weight of Si, and 0.05 to 0.63% by weight of Cu and/or 0.03 to 0.45% by weight of Mg, with the remainder being Al and unavoidable impurities.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: October 22, 2019
    Assignee: YAZAKI CORPORATION
    Inventors: Kenichi Ishibashi, Kazumi Mochizuki, Yasunobu Kondo
  • Patent number: 10420455
    Abstract: An imaging module is capable of being used a two or more limited number of times. The imaging module includes: a CMOS imaging sensor; and a counter memory in which the number of use times is stored, the number of use times being the number of times the imaging sensor is used.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: September 24, 2019
    Assignee: FUJIKURA LTD.
    Inventors: Kenichi Ishibashi, Kenichi Nakatate
  • Publication number: 20190256506
    Abstract: Crystals of a quinazoline derivative are provided. The present invention relates to an acid addition salt of a compound represented by Formula (I): a pharmaceutical composition containing it, and the like.
    Type: Application
    Filed: May 2, 2019
    Publication date: August 22, 2019
    Applicant: Shionogi & Co., Ltd.
    Inventors: Yukio TADA, Yuusuke TAMURA, Shuji YONEZAWA, Kenichi ISHIBASHI, Yuki MURAKAMI
  • Patent number: 10329285
    Abstract: Crystals of a quinazoline derivative are provided. The present invention relates to an acid addition salt of a compound represented by Formula (I): a pharmaceutical composition containing it, and the like.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: June 25, 2019
    Assignee: SHIONOGI & CO., LTD.
    Inventors: Yukio Tada, Yuusuke Tamura, Shuji Yonezawa, Kenichi Ishibashi
  • Publication number: 20190068858
    Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body; a second substrate including a second insulating substrate main body; and a signal cable disposed between the first substrate and the second substrate, that electrically connects a first cable terminal to a second cable terminal. In the imaging module, D1 is a length of a first diagonal line on a light-receiving face of the image-sensing device, D2 is a length of a second diagonal line on an end face of the second insulating substrate main body, and D2 is less than or equal to D1.
    Type: Application
    Filed: August 28, 2018
    Publication date: February 28, 2019
    Applicant: FUJIKURA LTD.
    Inventors: Hideaki Usuda, Kenichi Ishibashi, Daisuke Murakami, Takeshi Ishizuka, Yoshinobu Numasawa, Shingo Ishii
  • Publication number: 20190068859
    Abstract: An imaging module includes: an image-sensing device; a first substrate; a signal cable; a second substrate; and a flexible linear structure. Each of the first substrate and the second substrate includes a wiring and a cable terminal electrically connected to the signal cable on only one surface of the substrate. Each of the wiring of the first substrate and the wiring of the second substrate is electrically connected to the signal line via the cable terminal. The flexible linear structure extends in a direction along the signal cable from a front-end portion of the flexible linear structure supported by a structure-front-end support including the first substrate, and the flexible linear structure is disposed on a side of the signal cable where the first substrate and the second substrate are disposed.
    Type: Application
    Filed: August 29, 2018
    Publication date: February 28, 2019
    Applicant: FUJIKURA LTD.
    Inventors: Yoshinobu Numasawa, Kenichi Ishibashi, Shingo Ishii, Daisuke Murakami, Takeshi Ishizuka, Hideaki Usuda
  • Publication number: 20190068917
    Abstract: An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body that includes a plurality of surfaces, an electrode terminal, a first cable terminal disposed on only one of the plurality of surfaces of the first insulating substrate main body; a second substrate including a second insulating substrate main body and a second cable terminal; and a signal cable disposed between the first substrate and the second substrate, that electrically connects the first cable terminal to the second cable terminal. The one of the plaurality of surfaces of the first insulating substrate main body where the first cable terminal is connected to the signal cable and a surface of the second insulating substrate main body where the second cable terminal is connected to the signal cable are disposed on a same plane.
    Type: Application
    Filed: August 29, 2018
    Publication date: February 28, 2019
    Applicant: FUJIKURA LTD.
    Inventors: Takeshi Ishizuka, Kenichi Ishibashi, Shingo Ishii, Daisuke Murakami, Yoshinobu Numasawa, Hideaki Usuda