Patents by Inventor Kenichi Kawabata

Kenichi Kawabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200352061
    Abstract: A method of forming a metal magnetic film includes forming the metal magnetic film by a plating process, wherein the metal magnetic film comprises a permalloy and carbon atoms and a content of the carbon atoms is 0.3 to 3.0 at % based on a total amount of the carbon atoms and metal elements.
    Type: Application
    Filed: July 17, 2020
    Publication date: November 5, 2020
    Applicant: TDK CORPORATION
    Inventors: Takashi YAMADA, Miyuki YANAGIDA, Atsushi SATO, Kenichi KAWABATA
  • Patent number: 10799217
    Abstract: A sinogram is corrected in a form that can use a straight-ray type reconstruction method while considering trajectory of refracted waves. Specifically, based on the sequentially estimated path information of the virtual waves, an arrival time difference sinogram is corrected by a difference or a ratio between “shortest arrival time of wave” and “arrival time of the wave through the shortest path” to each detection element.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: October 13, 2020
    Assignee: Hitachi, Ltd.
    Inventors: Yushi Tsubota, Kenichi Kawabata, Atsurou Suzuki, Takahide Terada, Wenjing Wu, Kazuhiro Yamanaka
  • Publication number: 20200143979
    Abstract: In a coil component, a shield layer is provided after the unevenness of the surface of an element body is smoothened by the surface being covered with an insulating layer. A Cu layer of the shield layer is provided on a smooth surface, and thus a thickness variation can be suppressed and the Cu layer can be formed with a substantially uniform thickness. In the coil component, a point where the shield layer is thin or a point lacking the shield layer is unlikely to be generated and a functional degradation of the shield layer is effectively suppressed.
    Type: Application
    Filed: October 24, 2019
    Publication date: May 7, 2020
    Applicant: TDK CORPORATION
    Inventors: Hitoshi OHKUBO, Masazumi ARATA, Kenichi KAWABATA, Atsushi SATO
  • Patent number: 10638605
    Abstract: A circuit board design device judging whether a circuit board has a pair of via holes which are adjacent within a solder bridge formation distance within which a solder bridge can be formed; when the affirmative, the circuit board design device judging whether each of the pair of via holes is electrically connected in parallel to other via hole with a land not coated with solder resist; when the circuit board design device judges that at least one of the pair of via holes is electrically connected in parallel to the other via hole with a land not coated with solder resist, the circuit board design device determining the at least one of the pair of via holes which is electrically connected in parallel to the other via hole with a land not coated with solder resist as a coated via hole with a land coated with solder resist.
    Type: Grant
    Filed: July 23, 2018
    Date of Patent: April 28, 2020
    Assignee: DENSO TEN Limited
    Inventors: Tamaki Kawabata, Kenichi Osakabe
  • Patent number: 10615089
    Abstract: Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the composite magnetic sealing material is 15 ppm/° C. or less.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: April 7, 2020
    Assignee: TDK CORPORATION
    Inventor: Kenichi Kawabata
  • Publication number: 20200107479
    Abstract: A metal magnetic film includes a permalloy and a carbon atom, wherein a content of the carbon atom is 0.3 to 3.0 at % based on a total amount of the carbon atom and metal elements.
    Type: Application
    Filed: September 27, 2018
    Publication date: April 2, 2020
    Applicant: TDK CORPORATION
    Inventors: Takashi YAMADA, Miyuki YANAGIDA, Atsushi SATO, Kenichi KAWABATA
  • Publication number: 20200008784
    Abstract: The invention is to provide an ultrasonic image with a clear tissue structure while reducing speckle noise of the ultrasonic image. An ultrasonic wave is transmitted from the transducer to the subject, and an echo generated in the subject is received. The first ultrasonic image and the second ultrasonic image are generated using a reception signal. The second ultrasonic image is an image smoother than the first ultrasonic image. The image processing unit calculates filter coefficients using pixel values of corresponding pixels of the first ultrasonic image and the second ultrasonic image, and generates an output image by processing one of the first ultrasonic image and the second ultrasonic image using the filter coefficients.
    Type: Application
    Filed: April 11, 2019
    Publication date: January 9, 2020
    Inventors: Kazuhiro YAMANAKA, Kenichi KAWABATA
  • Patent number: 10491292
    Abstract: According to one embodiment, a communication repeater system includes a master station device, slave station devices, and radio frequency units which convert a signal from each base station system into an optical digital signal for transmission to the master station device. The base station systems establish communication by time-division duplex scheme. The communication repeater system repeats communication between a mobile communication terminal device and each base station system via a corresponding one of the slave station devices. The radio frequency units each include a detector that detects transmission/reception switching timing between the master station device and each of the radio frequency units. The slave station devices each include a setter that sets reference transmission/reception switching timing on the basis of acquired reference time information.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: November 26, 2019
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Infrastructure Systems & Solutions Corporation
    Inventors: Kensei Kawabata, Toshinori Doi, Kenichi Ohno
  • Patent number: 10448546
    Abstract: Disclosed is a noise suppression sheet 1 including a resin layer 2, a non-magnetic metal layer 3, and a metal magnetic layer 4 in this order.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: October 15, 2019
    Assignee: TDK CORPORATION
    Inventors: Takashi Yamada, Miyuki Yanagida, Atsushi Sato, Kenichi Kawabata
  • Publication number: 20190290223
    Abstract: The ultrasonic CT device includes: a first water tank configured such that an object is inserted therein, the first water tank being filled with a medium through which an ultrasonic wave passes; a ring array that irradiates an ultrasonic wave to the object and detects an ultrasonic wave reflected by the object while moving on an outer surface of the first water tank; and a signal processing unit that generates a tomographic image of the object based on a signal obtained by the ring array. The ultrasonic CT device further includes: a second water tank that houses the first water tank and the ring array; and a lid having a hole or a notch which is provided on a side of the object in the second water tank and which drains the medium.
    Type: Application
    Filed: February 11, 2019
    Publication date: September 26, 2019
    Inventors: Yushi TSUBOTA, Masakazu SUGAYA, Hideo KASHIMA, Takahide TERADA, Kenichi KAWABATA, Wenjing WU, Kazuhiro YAMANAKA, Ai MASUDA
  • Patent number: 10403582
    Abstract: Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, an electronic component mounted on a surface of the substrate, and a composite molding member having conductivity that covers the surface of the substrate so as to embed the electronic component and that is connected to the power supply pattern. The composite molding member includes a resin material and a first filler blended in the resin material and containing 32 to 39 wt. % of a metal material composed mainly of Ni in Fe.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: September 3, 2019
    Assignee: TDK CORPORATION
    Inventor: Kenichi Kawabata
  • Patent number: 10373917
    Abstract: Disclosed herein is an electronic circuit package that includes a substrate having a power supply pattern, an electronic component mounted on a surface of the substrate; and a molding member having conductivity that covers the surface of the substrate so as to embed the electronic component therein. The power supply pattern includes a first power supply pattern exposed to the surface of the substrate, and the molding member contacts the first power supply pattern.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: August 6, 2019
    Assignee: TDK CORPORATION
    Inventor: Kenichi Kawabata
  • Publication number: 20190223833
    Abstract: Provided is a device that transmits and receives an ultrasonic wave to and from an entire periphery of a specimen while preventing a movement of the specimen. An ultrasonic wave transmission and reception device includes: an oscillator array that is arrayed with an oscillator, the oscillator transmitting and receiving an ultrasonic wave; a fixing tool that is disposed between the oscillator array and the specimen and retains the specimen; and a drive mechanism that presses at least a part of the fixing tool against the specimen as to retain the specimen. An ultrasonic wave transmitted by the oscillator array passes through the fixing tool and irradiates on the specimen, and as for the oscillator array, the oscillator array and the fixing tool are disposed in a positional relationship such that the ultrasonic wave reflected by and/or passing through by the specimen and passing through the fixing tool is received.
    Type: Application
    Filed: January 10, 2019
    Publication date: July 25, 2019
    Applicant: HITACHI, LTD.
    Inventors: Kazuhiro YAMANAKA, Kenichi KAWABATA, Takahide TERADA, Atsurou SUZUKI, Yushi TSUBOTA, Wenjing WU
  • Patent number: 10362686
    Abstract: First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: July 23, 2019
    Assignee: TDK CORPORATION
    Inventors: Tsutomu Yasui, Hisayuki Abe, Kenichi Kawabata, Tomoko Kitamura
  • Publication number: 20190172791
    Abstract: Disclosed herein is an electronic circuit package that includes a substrate having a power supply pattern, an electronic component mounted on a surface of the substrate; and a molding member having conductivity that covers the surface of the substrate so as to embed the electronic component therein. The power supply pattern includes a first power supply pattern exposed to the surface of the substrate, and the molding member contacts the first power supply pattern.
    Type: Application
    Filed: December 5, 2017
    Publication date: June 6, 2019
    Applicant: TDK Corporation
    Inventor: Kenichi Kawabata
  • Patent number: 10301703
    Abstract: Disclosed is a high-strength welded steel pipe for airbag inflators that has high toughness and workability. A base material portion of the steel pipe has a composition containing, in mass %, C: 0.02 to 0.08%, Si: 0.001 to 1.0%, Mn: 0.1 to 2.0%, P: 0.1% or less, Al: 0.01 to 0.1%, N: 0.01% or less, Ti: 0.01 to 0.20%, and V: 0.01 to 0.50%, with the balance being Fe and incidental impurities. The base material portion has a structure that includes a ferrite phase having an average grain size of 10 ?m or less at an area fraction of 90% or more and a Ti, V-based carbide having an average grain size of 10 nm or less and dispersed in the ferrite phase. The welded steel pipe has a high tensile strength TS of 780 MPa or more and a strength-elongation balance TS×El of 15,000 MPa % or more. The difference ?HV in Vickers hardness between the base material portion and the welded portion is 60 points or less.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: May 28, 2019
    Assignee: JFE STEEL CORPORATION
    Inventors: Masatoshi Aratani, Yoshikazu Kawabata, Kenichi Iwazaki, Ryoji Matsui
  • Patent number: 10269726
    Abstract: Disclosed herein is an electronic circuit package includes a substrate having a power supply pattern, a first electronic component mounted on a first region of a front surface of the substrate, a mold resin that covers the front surface of the substrate so as to embed the first electronic component therein, and a laminated film covering an upper surface of the mold resin, the laminated film including a magnetic film and a first metal film. The first metal film is connected to the power supply pattern. The magnetic film is selectively thick on the first region.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: April 23, 2019
    Assignee: TDK CORPORATION
    Inventors: Kenichi Kawabata, Toshio Hayakawa, Toshiro Okubo
  • Patent number: 10269727
    Abstract: Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blend ratio of 50 vol. % or more and 85 vol. % or less. The filler includes a first magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material composed mainly of Ni, the first magnetic filler having a first grain size distribution, and a second magnetic filler having a second grain size distribution different from the first grain size distribution.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: April 23, 2019
    Assignee: TDK CORPORATION
    Inventor: Kenichi Kawabata
  • Patent number: 10256194
    Abstract: Disclosed herein is an electronic circuit package includes a substrate, an electronic component mounted on a surface of the substrate, and a magnetic mold resin covering the surface of the substrate so as to embed therein the electronic component. The magnetic mold resin includes a resin material and a filler blended in the resin material in a blended ratio of 30 vol. % or more to 85 vol. % or less. The filler includes a magnetic filler containing Fe and 32 wt. % or more and 39 wt. % or less of a metal material contained mainly of Ni, thereby a thermal expansion coefficient of the magnetic mold resin is 15 ppm/° C. or less.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: April 9, 2019
    Assignee: TDK CORPORATION
    Inventor: Kenichi Kawabata
  • Patent number: D884899
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: May 19, 2020
    Assignee: Hitachi, Ltd.
    Inventors: Ai Masuda, Jiwon Hong, Akira Kojima, Takashi Yamamoto, Kenichi Kawabata, Takahide Terada, Wenjing Wu, Yushi Tsubota