Patents by Inventor Kenichi Kawabata

Kenichi Kawabata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9078594
    Abstract: Provided is an ultrasound diagnostic and treatment device for tumors which is used in combination with a phase-shift ultrasound contrast agent. By using a phase-shift ultrasound contrast agent, irradiating phase-shift ultrasonic waves from a phase-shift ultrasonic wave transmitter (18), irradiating ultrasonic waves for holding microbubbles from an ultrasonic wave transmitter (29) for holding microbubbles, and using a phase-shift detecting ultrasonic wave transceiver (19) to observe the phase shift, the ultrasound diagnostic and treatment device generates and holds the microbubbles in advance on the entire site (16) requiring treatment, and irradiates ultrasonic waves for treatment having a moderate intensity of 1 kW/cm2 or lower on the entire site (16) requiring treatment with the microbubbles as the target from a ultrasonic wave transmitter (20) for treatment.
    Type: Grant
    Filed: April 5, 2011
    Date of Patent: July 14, 2015
    Assignee: HITACHI, LTD.
    Inventors: Kenichi Kawabata, Rei Asami
  • Patent number: 9067053
    Abstract: There is provided an ultrasonic treatment device that is minimally-invasive and that achieves embolization treatment having a high blood flow blocking effect. To this end, the ultrasonic treatment device is provided with a function to transmit to a target area of a subject both a bubble generation pulse that vaporizes a contrast agent, and a bubble generation pulse that causes the diameter of the formed bubble to increase.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: June 30, 2015
    Assignee: HITACHI, LTD.
    Inventors: Rei Asami, Kenichi Kawabata
  • Publication number: 20150052743
    Abstract: A manufacturing method of electronic module components according to the present invention includes: forming a plurality of module components on a principal surface of a substrate; forming a groove by dicing between the module components; spraying a conductive paste toward the principal surface of the substrate; and separating the module components. The spraying is performed so that an angle formed between a spray direction and the principal surface is an angle ?. The angle ? is set so as to satisfy the following expression (1), assuming that a depth of the groove is D and a width of the groove is w.
    Type: Application
    Filed: July 18, 2014
    Publication date: February 26, 2015
    Applicant: TDK Corporation
    Inventors: Kenichi KAWABATA, Seiko Komatsu
  • Patent number: 8929089
    Abstract: An electronic circuit module component includes an electronic component, a substrate, a first resin, a second resin, a metal layer, and an opening. The electronic component is mounted on the substrate. The first resin has pores and is in contact with at least a part of the electronic component. The second resin covers a surface of the first resin and has porosity which is lower than that of the first resin. The metal layer covers the first resin and the second resin and is electrically connected to a ground of the substrate. The opening is provided in the metal layer and allows a part of the first resin to be exposed to an outside at least of the metal layer.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: January 6, 2015
    Assignee: TDK Corporation
    Inventors: Shigeru Asami, Seiichi Tajima, Hiroki Hara, Shuichi Takizawa, Masumi Kameda, Kenichi Kawabata
  • Patent number: 8926948
    Abstract: Provided are a preparation process of a diagnostic or therapeutic agent having a step of adding, to a first fine emulsion having a particle size of 0.5 ?m or less prepared by applying a predetermined pressure to a first mixture containing a first hydrophobic compound, an emulsifying agent, and an aqueous phase, a second hydrophobic compound compatible with the first hydrophobic compound, thereby preparing a second mixture; and a step of stirring and shaking the second mixture in a hermetically sealed state, thereby embedding the second hydrophobic compound in the first fine emulsion to prepare a second fine emulsion having a particle size of 0.5 ?m or less; a diagnostic or therapeutic agent prepared by the process; and an apparatus for carrying out the process.
    Type: Grant
    Filed: June 27, 2008
    Date of Patent: January 6, 2015
    Assignee: Hitachi, Ltd.
    Inventors: Rei Asami, Kenichi Kawabata
  • Patent number: 8911372
    Abstract: A diagnostic imaging apparatus for imaging information changing with time and displaying it in real time, composed of an ultrasonic probe (2), having piezoelectric elements arranged in an array form that transmit ultrasonic waves to a target object (1) and acquires a reflection signal from the target object; a body movement measuring unit (12) that constitutes a two-dimensional ultrasonic image using the reflection signal acquired by the ultrasonic probe, sets, in the image plane, a plurality of measuring areas used for measuring the body movement of the target object, and measures the body movement and deformation amounts in the measuring areas; and an image accumulating (subtracting) unit for accumulating or subtracting images using body movement measured by the body movement measurement unit.
    Type: Grant
    Filed: May 28, 2013
    Date of Patent: December 16, 2014
    Assignee: Hitachi Medical Corporation
    Inventors: Hideki Yoshikawa, Takashi Azuma, Kenichi Kawabata, Kazuaki Sasaki, Shinichiro Umemura
  • Publication number: 20140356967
    Abstract: A tissue mimicking phantom for ultrasonic treatment and a calibration device of an ultrasonic treatment device using the phantom are aimed to be provided. In order to dissolve the above-mentioned problems, the tissue mimicking phantom in accordance with the present invention is characterized by including an indicator agent which is denatured by an increase in temperature and which simulates an ultrasonic treatment effect, and a denaturation sensitivity controlling agent which is a different component from that of the indicator agent, which serves as a nucleus of cavitation at the time of ultrasonic irradiation, and which supports the increase in temperature and the denaturation of the indicator agent. The configuration makes it possible to obtain an tissue mimicking phantom which resolves the shortage of sensitivity, and which has excellent stability.
    Type: Application
    Filed: December 21, 2012
    Publication date: December 4, 2014
    Inventors: Kenichi Kawabata, Rei Asami
  • Publication number: 20140293561
    Abstract: A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating on the inner wall of the via formation hole.
    Type: Application
    Filed: June 12, 2014
    Publication date: October 2, 2014
    Applicant: TDK Corporation
    Inventors: Hiroyuki UEMATSU, Kenichi KAWABATA
  • Patent number: 8822837
    Abstract: A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating an the inner wall of the via formation hole.
    Type: Grant
    Filed: December 5, 2011
    Date of Patent: September 2, 2014
    Assignee: TDK Corporation
    Inventors: Hiroyuki Uematsu, Kenichi Kawabata
  • Publication number: 20140153196
    Abstract: An electronic module is provided with a circuit board 2, a chip component 3 surface-mounted on the circuit board 2 and a mold member 4 that seals the chip component 3. The circuit board 2 includes a land 7 and a resist pattern 8A that partially covers the land 7. The chip component 3 has a bottom electrode 6b and a side electrode 6c. The resist pattern 8A has an overlapped portion overlapped with the bottom electrode 6b of the chip component 3 in a planar view. A portion of the mold member 4 is filled at least in a first gap D1 between the resist pattern 8A and the first solder portion 10a.
    Type: Application
    Filed: November 26, 2013
    Publication date: June 5, 2014
    Applicant: TDK Corporation
    Inventors: Shuichi Takizawa, Kenichi Kawabata
  • Patent number: 8742589
    Abstract: A semiconductor embedded module 1 of the present invention has a configuration in which a semiconductor device 20, which is an electronic component such as a semiconductor IC (die) in a bare chip state, is embedded in a resin layer 10 (second insulating layer). In the semiconductor device 20, a redistribution layer 22 is connected to land electrodes. A protective layer 24 (first insulating layer) is provided on the redistribution layer 22, and is provided with openings such that external connection pads P of the redistribution layer 22 are exposed. Also, the resin layer 10 is formed to cover the protective layer 24, and vias V are formed at the positions of the respective external connection pads P of the redistribution layer 22. The grinding rate of the resin layer 10 is larger than that of the protective layer 24.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: June 3, 2014
    Assignee: TDK Corporation
    Inventors: Kenichi Kawabata, Toshikazu Endo
  • Patent number: 8613441
    Abstract: A sheet transport device and an image forming apparatus using the sheet transport device are disclosed. The sheet transport device includes a transport belt rotating around rollers that transports a sheet by attaching the sheet to the transport belt by an electrostatic force, and charging unit that is unitized by including a charging member for charging the transport belt. The charging unit includes a unit case containing springs for pushing the charging member onto the transport belt. An Ac bias voltage is applied to the transport belt via the charging member.
    Type: Grant
    Filed: April 11, 2012
    Date of Patent: December 24, 2013
    Assignee: Ricoh Company, Ltd.
    Inventor: Kenichi Kawabata
  • Patent number: 8591750
    Abstract: Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned.
    Type: Grant
    Filed: March 24, 2010
    Date of Patent: November 26, 2013
    Assignee: TDK Corporation
    Inventors: Hiroyuki Uematsu, Kenichi Kawabata, Kenji Nagase
  • Publication number: 20130256848
    Abstract: An electromagnetic component module includes: a molding resin provided so as to cover electronic components mounted on a substrate and a surface of the substrate; and a conductive shield formed so as to further cover the molding resin. The conductive shield includes a first filler and a second filler which are different from each other and the conductive shield is connected to ground wires exposed on lateral surfaces of the substrate. The average particle diameter of the first filler is ½ or less of the thickness of the ground wires and the second filler forms a metallic bond in the temperature range of 250 degrees Celsius or lower.
    Type: Application
    Filed: March 28, 2013
    Publication date: October 3, 2013
    Applicant: TDK CORPORATION
    Inventors: Kenichi KAWABATA, Seiko KOMATSU
  • Publication number: 20130261451
    Abstract: A diagnostic imaging apparatus for imaging information changing with time and displaying it in real time, composed of an ultrasonic probe (2), having piezoelectric elements arranged in an array form that transmit ultrasonic waves to a target object (1) and acquires a reflection signal from the target object; a body movement measuring unit (12) that constitutes a two-dimensional ultrasonic image using the reflection signal acquired by the ultrasonic probe, sets, in the image plane, a plurality of measuring areas used for measuring the body movement of the target object, and measures the body movement and deformation amounts in the measuring areas; and an image accumulating (subtracting) unit for accumulating or subtracting images using body movement measured by the body movement measurement unit.
    Type: Application
    Filed: May 28, 2013
    Publication date: October 3, 2013
    Applicant: Hitachi Medical Corporation
    Inventors: Hideki YOSHIKAWA, Takashi AZUMA, Kenichi KAWABATA, Kazuaki SASAKI, Shinichiro UMEMURA
  • Patent number: 8530752
    Abstract: A multilayer circuit board comprises core layers 101 and 102 made of a core material impregnated with resin, resin layers 111 and 112 interposed between the core layers 101 and 102, a wiring pattern 140 embedded in the resin layers 111 and 112. The core layers 101 and 102 have a thickness of 100 ?m or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layers 111 and 112 are interposed between the hard core layers 101 and 102, whereby the entire board has increased strength.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: September 10, 2013
    Assignee: TDK Corporation
    Inventors: Kenichi Kawabata, Takaaki Morita
  • Patent number: 8502081
    Abstract: The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board 100 includes an insulating layer 21 on one surface of a substantially rectangular-shaped substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer 21. The plate-like integrated frame 51 has a plurality of concave portions 53 arranged in parallel at its inner periphery wall 52a, and arranged on a non-placing area of the electronic components 41 so as to surround a plurality of the electronic components 41 (groups).
    Type: Grant
    Filed: July 21, 2008
    Date of Patent: August 6, 2013
    Assignee: TDK Corporation
    Inventors: Yoshikazu Kanemaru, Kenichi Kawabata
  • Patent number: 8492659
    Abstract: The present invention provides a printed wiring board which can prevent a plating failure in a connection hole such as a via to be formed in the printed wiring board, thereby can enhance the connection reliability and a manufacturing method therefor. The printed wiring board 100 includes a thermosetting resin sheet 16 (insulation layer) having a via hole 20 (through hole) constituted by inner wall parts having different taper angles from each other, a copper foil 17 (conductor layer) provided on the thermosetting resin sheet 16, and a wiring pattern 13 (wiring layer) which is provided so as to be exposed from the via hole 20 and is electrically connected with the copper foil 17 through the via hole 20.
    Type: Grant
    Filed: February 18, 2009
    Date of Patent: July 23, 2013
    Assignee: TDK Corporation
    Inventors: Kenji Nagase, Hiroyuki Uematsu, Kenichi Kawabata
  • Patent number: 8460191
    Abstract: An diagnostic imaging apparatus for imaging information changing with time and displaying it in real time, composed of an ultrasonic probe (2), having piezoelectric elements arranged in an array form that transmit ultrasonic waves to a target object (1) and acquires a reflection signal from the target object; a body movement measuring unit (12) that constitutes a two-dimensional ultrasonic image using the reflection signal acquired by the ultrasonic probe, sets, in the image plane, a plurality of measuring areas used for measuring the body movement of the target object, and measures the body movement and deformation amounts in the measuring areas; and an image accumulating (subtracting) unit for accumulating or subtracting images using body movement measured by the body movement measurement unit.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: June 11, 2013
    Assignee: Hitachi Medical Corporation
    Inventors: Hideki Yoshikawa, Takashi Azuma, Kenichi Kawabata, Kazuaki Sasaki, Shinichiro Umemura
  • Publication number: 20130053691
    Abstract: Provided is an ultrasound diagnostic and treatment device for tumors which is used in combination with a phase-shift ultrasound contrast agent. By using a phase-shift ultrasound contrast agent, irradiating phase-shift ultrasonic waves from a phase-shift ultrasonic wave transmitter (18), irradiating ultrasonic waves for holding microbubbles from an ultrasonic wave transmitter (29) for holding microbubbles, and using a phase-shift detecting ultrasonic wave transceiver (19) to observe the phase shift, the ultrasound diagnostic and treatment device generates and holds the microbubbles in advance on the entire site (16) requiring treatment, and irradiates ultrasonic waves for treatment having a moderate intensity of 1 kW/cm2 or lower on the entire site (16) requiring treatment with the microbubbles as the target from a ultrasonic wave transmitter (20) for treatment.
    Type: Application
    Filed: April 5, 2011
    Publication date: February 28, 2013
    Inventors: Kenichi Kawabata, Rei Asami