Abstract: The present disclosure relates to a signal processing apparatus, a signal processing method, a program, and an object detection system that enable an object detection to be accurately performed. A stereo camera performs imaging by a right camera and a left camera to thereby acquire a stereo image and a millimeter wave radar acquires a radar image in which a position of an object is detected in a radiation range of millimeter waves by using millimeter waves that are radio waves of a millimeter wave band. Then, by communication via a communication apparatus with a target in which positional information is known, it is determined whether or not the target is reliable, and in a case where it is determined that the target is reliable, calibration processing is performed for eliminating a deviation in coordinate systems generated in the stereo image and the radar image in which the target is detected.

Abstract: A measurement circuit measures a first integrated amount (integrated current amount) of a current which flows from a battery to a load. The first integrated amount is an amount in a first time period in which the measurement circuit operates. A detection circuit detects the number of operations of the load. A calculation circuit calculates a second integrated amount (total integrated-current amount) of the current on the basis of the number of operations and the first integrated amount. The second integrated amount is an amount in a third time period including a second time period in which the measurement circuit stops.

Abstract: A wireless transmission system includes: a communication unit for transmission; and a communication unit for reception. The communication units for transmission and reception are housed in a housing of the same electronic apparatus, or the communication unit for transmission is housed in a housing of first electronic apparatus and the communication unit for reception is housed in a housing of second electronic apparatus and a wireless signal transmission path enabling wireless information transmission between the communication units is formed between the communication units when the first and the second electronic apparatus are disposed at given positions to be integrated with each other. The communication unit for transmission includes a first carrier signal generating unit and a first frequency converter, and the communication unit for reception includes a second carrier signal generating unit, and a second frequency converter.

Abstract: An integrated current value measuring device includes a first element having a resistance value that changes in accordance with an integrated value of current flowing in the first element, a second element having a resistance value that changes in accordance with an integrated value of current flowing in the second element, and having a degree of the change in the resistance value that is smaller than that of the change in the resistance value of the first element, and an integrated value calculator configured to calculate an integrated current value based on the resistance value of the first element and the resistance value of the second element, the integrated current value being an integrated amount of current flowing in a current path in which the first element and the second element are inserted in series.

Abstract: A connector device according to the present disclosure includes a first connector section and a second connector section. The first connector section includes a waveguide for transmitting a high-frequency signal. The second connector section includes a waveguide for transmitting a high-frequency signal, a yoke disposed to cover the waveguide, and a magnet forming a magnetic circuit with the yoke, and is couplable to the first connector section by the attractive force of the magnet. A communication system according to the present disclosure includes two communication devices and a connector device. The connector device has the above-described configuration and transmits a high-frequency signal between the two communication devices.

Abstract: A wireless transmission system includes: a communication unit for transmission; and a communication unit for reception. The communication units for transmission and reception are housed in a housing of the same electronic apparatus, or the communication unit for transmission is housed in a housing of first electronic apparatus and the communication unit for reception is housed in a housing of second electronic apparatus and a wireless signal transmission path enabling wireless information transmission between the communication units is formed between the communication units when the first and the second electronic apparatus are disposed at given positions to be integrated with each other. The communication unit for transmission includes a first carrier signal generating unit and a first frequency converter, and the communication unit for reception includes a second carrier signal generating unit, and a second frequency converter.

Abstract: A connector device of the present disclosure includes two waveguides configured to transmit a radio-frequency signal, a state monitoring unit configured to monitor a connection state of the two waveguides, and a control unit that is provided on a side of the waveguide, which is on a transmission side to transmit a radio-frequency signal, between the two waveguides and that stops transmission of the radio-frequency signal according to the connection state of the two waveguides, the state being monitored by the state monitoring unit.

Abstract: The device includes: a signal generating unit generating a millimeter wave signal by signal processing of an input signal; a coupling circuit transmitting an electromagnetic wave from the millimeter wave signal generated by the signal generating unit to one end of a circuit board; a coupling circuit receiving the electromagnetic wave from the millimeter wave signal from the other end of the circuit board; and a signal generating unit that generates an output signal by signal processing of the millimeter wave signal from the electromagnetic wave received by the coupling circuit. Preferably, the circuit board is constituted by a dielectric material whose the dielectric loss tangent is relatively large, and a transmission line functioning as a millimeter wave transmission path is constituted within this circuit board. With this construction, extremely high-speed signals can be transmitted through a circuit board having a prescribed dielectric constant representing a large loss.

Abstract: An information processing apparatus includes a volatile memory, a nonvolatile memory, and a processor coupled to the volatile memory and the nonvolatile memory, the processor configured to make a selection of the volatile memory or the nonvolatile memory to be supplied power, based on a first difference between power consumption of the volatile memory and power consumption of the nonvolatile memory during standby, and a second difference between power consumption of the volatile memory and power consumption of the nonvolatile memory during an operation state, and switch between the volatile memory and the nonvolatile memory to be supplied power on the basis of the selection and whether the volatile memory or the nonvolatile memory being used currently by the processor.

Abstract: In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

Abstract: An electronic part including an electronic part main body and an external electrode on the surface of the electronic part main body. The external electrode includes at least one alloy layer selected from among a Cu—Ni alloy layer and a Cu—Mn alloy layer, and an antioxidant film formed on the outer side of the alloy layer. The antioxidant film is one of a Sn-containing film, a noble metal film, and an organic substance film.

Abstract: A semiconductor device includes: a first circuit; a first power switch provided either between a power supply potential terminal and a power supply potential node of the first circuit or between a reference potential terminal and a reference potential node of the first circuit; a power switch control circuit configured to control a voltage of a control terminal of the first power switch; a test terminal; and a first test control circuit configured to control connection of the test terminal and the control terminal of the first power switch.

Abstract: A wireless transmission system includes: a communication unit for transmission; and a communication unit for reception. The communication units for transmission and reception are housed in a housing of the same electronic apparatus, or the communication unit for transmission is housed in a housing of first electronic apparatus and the communication unit for reception is housed in a housing of second electronic apparatus and a wireless signal transmission path enabling wireless information transmission between the communication units is formed between the communication units when the first and the second electronic apparatus are disposed at given positions to be integrated with each other. The communication unit for transmission includes a first carrier signal generating unit and a first frequency converter, and the communication unit for reception includes a second carrier signal generating unit, and a second frequency converter.

Abstract: The device includes: a signal generating unit generating a millimeter wave signal by signal processing of an input signal; a coupling circuit transmitting an electromagnetic wave from the millimeter wave signal generated by the signal generating unit to one end of a circuit board; a coupling circuit receiving the electromagnetic wave from the millimeter wave signal from the other end of the circuit board; and a signal generating unit that generates an output signal by signal processing of the millimeter wave signal from the electromagnetic wave received by the coupling circuit. Preferably, the circuit board is constituted by a dielectric material whose the dielectric loss tangent is relatively large, and a transmission line functioning as a millimeter wave transmission path is constituted within this circuit board. With this construction, extremely high-speed signals can be transmitted through a circuit board having a prescribed dielectric constant representing a large loss.

Abstract: The device includes: a signal generating unit generating a millimeter wave signal by signal processing of an input signal; a coupling circuit transmitting an electromagnetic wave from the millimeter wave signal generated by the signal generating unit to one end of a circuit board; a coupling circuit receiving the electromagnetic wave from the millimeter wave signal from the other end of the circuit board; and a signal generating unit that generates an output signal by signal processing of the millimeter wave signal from the electromagnetic wave received by the coupling circuit. Preferably, the circuit board is constituted by a dielectric material whose the dielectric loss tangent is relatively large, and a transmission line functioning as a millimeter wave transmission path is constituted within this circuit board. With this construction, extremely high-speed signals can be transmitted through a circuit board having a prescribed dielectric constant representing a large loss.

Abstract: An electronic circuit includes: a semiconductor chip provided with a single-ended I/F including a pad on which single-ended signals are exchanged; and a mounting unit on which a differential transmission path transmitting a differential signal is formed, and on which the semiconductor chip is mounted so that the pad of the single-ended I/F is directly electrically connected to a conductor configuring the differential transmission path.

Abstract: A recording apparatus includes a recording unit, a waveguide forming unit, a communication unit, and a memory controller. The recording unit is configured to record and hold data. The waveguide forming unit is configured to function as a transmission path that transmits the data. The communication unit is configured to communicate with the waveguide forming unit. The memory controller is configured to control input and output of the data to and from the recording unit.

Abstract: A wireless transmission system includes: a communication unit for transmission; and a communication unit for reception. The communication units for transmission and reception are housed in a housing of the same electronic apparatus, or the communication unit for transmission is housed in a housing of first electronic apparatus and the communication unit for reception is housed in a housing of second electronic apparatus and a wireless signal transmission path enabling wireless information transmission between the communication units is formed between the communication units when the first and the second electronic apparatus are disposed at given positions to be integrated with each other. The communication unit for transmission includes a first carrier signal generating unit and a first frequency converter, and the communication unit for reception includes a second carrier signal generating unit, and a second frequency converter.

Abstract: In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.

Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.