Abstract: A signal processing device includes: signal processing circuits. The signal processing circuit includes an input/output circuit configured by an input circuit serving as an input interface of a signal of a predetermined frequency band and/or an output circuit serving as an output interface of a signal of the frequency band and performs transmission of a signal of the frequency band between the signal processing circuit and another signal processing circuit. The output circuits of one and another signal processing circuits include circuits having the same configuration. The input circuits of the one and another signal processing circuits include other circuits having the same configurations. The input/output circuits of the one and another signal processing circuits can perform transmission of a signal of the predetermined frequency band even when any one of transmission media having mutually different characteristics is mediated.

Abstract: A recording apparatus includes a recording unit, a waveguide forming unit, a communication unit, and a memory controller. The recording unit is configured to record and hold data. The waveguide forming unit is configured to function as a transmission path that transmits the data. The communication unit is configured to communicate with the waveguide forming unit. The memory controller is configured to control input and output of the data to and from the recording unit.

Abstract: A data bus system includes a plurality of recording apparatuses, a transmission path, and a management apparatus. The plurality of recording apparatuses are configured to record and hold data. The transmission path is connected to the plurality of recording apparatuses by wireless communication and configured to transmit the data. The management apparatus is configured to manage the plurality of recording apparatuses and the transmission path.

Abstract: A wireless transmission system includes: a communication unit for transmission; and a communication unit for reception. The communication units for transmission and reception are housed in a housing of the same electronic apparatus, or the communication unit for transmission is housed in a housing of first electronic apparatus and the communication unit for reception is housed in a housing of second electronic apparatus and a wireless signal transmission path enabling wireless information transmission between the communication units is formed between the communication units when the first and the second electronic apparatus are disposed at given positions to be integrated with each other. The communication unit for transmission includes a first carrier signal generating unit and a first frequency converter, and the communication unit for reception includes a second carrier signal generating unit, and a second frequency converter.

Abstract: A signal processor includes: a plurality of frequency converters which perform frequency conversion of input signals to output converted signals; and an output section which combines the converted signals output from the plurality of frequency converters and outputs a composite signal, wherein the plurality of frequency converters are formed in a one-chip semiconductor chip, and the plurality of frequency converters perform frequency conversion into converted signals in different frequency bands.

Abstract: An electronic part including an electronic part main body and an external electrode on the surface of the electronic part main body. The external electrode includes at least one alloy layer selected from among a Cu—Ni alloy layer and a Cu—Mn alloy layer, and an antioxidant film formed on the outer side of the alloy layer. The antioxidant film is one of a Sn-containing film, a noble metal film, and an organic substance film.

Abstract: A semiconductor device includes: a first circuit; a first power switch provided either between a power supply potential terminal and a power supply potential node of the first circuit or between a reference potential terminal and a reference potential node of the first circuit; a power switch control circuit configured to control a voltage of a control terminal of the first power switch; a test terminal; and a first test control circuit configured to control connection of the test terminal and the control terminal of the first power switch.

Abstract: The semiconductor intergrated circuit comprises: a circuit that executes a predetermined process and a switching circuit that selects a power impedance, The switching circuit selects the power impedance, in accordance with a variation in voltage supplied to the circuit, so that a resonant frequency of the semiconductor integrated circuit is different from a operation frequency of the circuit.

Abstract: An electronic part that includes an electronic part main body and an external electrode on the surface of the electronic part main body. The external electrode includes at least one alloy layer selected from among a Cu—Ni alloy layer and a Cu—Mn alloy layer, and a Sn-containing layer on the outer side of the alloy layer. The Sn-containing layer is the outermost layer of the external electrode. The Sn-containing layer is in contact with the alloy layer.

Abstract: A semiconductor device includes a plurality of internal circuits, a plurality of low drop output regulators, and a power management unit. The plurality of low drop output regulators are configured to reduce a power source voltage applied from an outside and generate supply voltages which are to be supplied to the plurality of internal circuits. The power management unit is configured to change a voltage value of the power source voltage in accordance with a state of combination of voltage values of the plurality of supply voltages generated by the plurality of low drop output regulators.

Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

Abstract: A circuit including: an input stage that includes a first input unit into which input data is input and a pair of first output units and is driven by a first power-supply voltage; a pair of first gate elements that includes first transistors, and is driven by a clock that includes a second power-supply voltage that is lower than the first power-supply voltage; a first latch circuit that includes a pair of second input units, and is driven by the first power-supply voltage; a pair of second gate elements that includes second transistors, and is driven by an inverted clock of the clock; and a second latch circuit that includes a pair of third input units, and a third output unit that outputs one of a pair of pieces of data, and is driven by the first power-supply voltage.

Abstract: A digital data signal, such as a digital video signal, is intentionally pre-distorted before being sent over a network. In one embodiment, this pre-distortion may be performed in accordance with a pre-distortion pattern or algorithm which is shared with only intended receivers. The pre-distortion pattern may be used to vary the pre-distortion on a periodic basis, as frequently as on a symbol-by-symbol basis. The pre-distortion function may include distorting the phase and/or the amplitude of the digital signal's modulation.

Abstract: A wireless transmission system includes: a communication unit for transmission; and a communication unit for reception. The communication units for transmission and reception are housed in a housing of the same electronic apparatus, or the communication unit for transmission is housed in a housing of first electronic apparatus and the communication unit for reception is housed in a housing of second electronic apparatus and a wireless signal transmission path enabling wireless information transmission between the communication units is formed between the communication units when the first and the second electronic apparatus are disposed at given positions to be integrated with each other. The communication unit for transmission includes a first carrier signal generating unit and a first frequency converter, and the communication unit for reception includes a second carrier signal generating unit, and a second frequency converter.

Abstract: A signal transmission system includes: a transmitting section including a first carrier signal generating section configured to generate a carrier signal for modulation and a first frequency converting section configured to generate a transmission signal by frequency-converting a transmission object signal by the carrier signal for modulation, the carrier signal for modulation being generated by the first carrier signal generating section; and a receiving section including a second carrier signal generating section configured to generate a carrier signal for demodulation and a second frequency converting section configured to frequency-convert the transmission signal received by the carrier signal for demodulation, the carrier signal for demodulation being generated by the second carrier signal generating section.

Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

Abstract: A digital data signal, such as a digital video signal, is intentionally pre-distorted before being sent over a network. In one embodiment, this pre-distortion may be performed in accordance with a pre-distortion pattern or algorithm which is shared with only intended receivers. The pre-distortion pattern may be used to vary the pre-distortion on a periodic basis, as frequently as on a symbol-by-symbol basis. The pre-distortion function may include distorting the phase and/or the amplitude of the digital signal's modulation.

Abstract: A semiconductor device whose operational state is switched between a test state and a normal operational state according to a logical value of a signal input from the outside is provided. The semiconductor device includes a first power line, a second power line, a switch that is controlled by a signal line to couple/isolate the first power line to/from the second power line, a control circuit that outputs a control signal, and a state switching circuit that drives the signal line to couple/isolate the first power line to/from the second power line according to a logical value of the control signal when the input signal is one of logical values, whereas the state switching circuit drives the signal line to couple the first power line to the second power line when the first signal is the other logical value.

Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

Abstract: A voltage fluctuation detection circuit includes an oscillation circuit configured to receive an operation voltage and perform an oscillation operation, an operation voltage generation unit configured to reduce a detection target voltage and generate the operation voltage, and a fluctuation detection unit configured to measure an oscillation frequency of the oscillation circuit and detect a fluctuation of the detection target voltage.