Abstract: A method of manufacturing an antenna comprising: providing a millimeter wave (MMW) antenna attached to a signal pad on an integrated circuit mounted on a substrate, and adjusting one or more parameters of the antenna to conform to predetermined desired thresholds, levels or ranges, wherein the adjustment is selected from the group consisting of: locating a conducting or dielectric object at a desired tuner location in proximity to the antenna to tune the central signal frequency, locating a conducting reflector at a desired reflector location in proximity to the antenna to tune the radiation direction or pattern, and selecting a conducting patch or object as a radiator/detector element to modify the bandwidth. Also a millimeter wave (MMW) antenna.

Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

Abstract: The semiconductor circuit device includes a power line receiving first voltage; each of internal circuits being provided with different operating voltages by the operation mode; a power supply circuit connected with one of internal circuits and the power line to provide second voltage lower than the first voltage to the one of internal circuits; and a control circuit controlling the power supply circuit in accordance with each of the operation modes, wherein when a change of a operation mode is performed, if a operating voltage after the change of a operation mode is higher than a operating voltage before the change of a operation mode, firstly the control circuit controls the power supply circuit to supply a second voltage higher than the operating voltage and secondly the control circuit controls the power supply circuit to supply the operation voltage after the change of a operation mode to the internal circuit.

Abstract: A laminated electronic component includes a component body including a plurality of laminated functional layers, a plurality of internal conductors provided inside the component body, and an external terminal electrode that is electrically connected to an internal conductor via an exposed portion of the internal conductor and that is defined by a direct plating film. An average grain diameter of metal grains defining the plating film is about 0.1 ?m or less.

Abstract: A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.

Abstract: In a method for manufacturing a multilayer electronic component, after a plating layer for forming an external electrode is formed on an end surface of a laminate, conditions for heat-treating the laminate are set such that interdiffusion layers have ends which face internal electrodes and which are spaced from the end surface of the laminate at a distance of about 0.5 ?m to about 1.9 ?m.

Abstract: A ceramic electronic component includes a ceramic body and a plurality of external electrodes disposed at a surface of the ceramic body. The external electrodes include a plating layer containing glass particles each coated with a metal film. The plating layer is formed by co-deposition of a plating metal and the metal-coated glass particles.

Abstract: An information communication method includes transmitting a millimeter-band radio wave from a reception side, reflecting the transmitted radio wave at a transmission side while vibrating the transmitted radio wave corresponding to first information transmitted by the transmission side, and receiving the reflected radio wave at the reception side and reconstructing the first information based on a phase difference between the transmitted radio wave and the received radio wave.

Abstract: A signal generation unit 107 and a first set value processing unit 7100 are included in a preceding stage of a transmission path connection unit 108 at a transmission side, and a signal generation unit 207 and a second set value processing unit 7200 are included in a subsequent stage of a transmission path connection unit 208 at a receiving side. The signal generation unit 107 or the signal generation unit 207 performs prescribed signal processing based on a set value. The first set value processing unit 7100 inputs a set value, that has been prescribed for the signal generation unit 107, to the signal generation unit 107, and the second set value processing unit 7200 inputs a set value, that has been prescribed for the signal generation unit 207, to the signal generation unit 207.

Abstract: A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in which an end of each of the plurality of internal electrodes is exposed at a predetermined surface corresponding to one of the first and second end surfaces; a step of forming external electrodes on the predetermined surfaces; and a step of forming thick-film edge electrodes at edge portions. The step of forming external electrodes includes a step of attaching a plurality of conductive particles having a particle size of about 1 ?m or more to the predetermined surfaces of the laminate, and a step of performing plating directly on the predetermined surfaces to which the conductive particles are attached.

Abstract: A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.

Abstract: In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.

Abstract: A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

Abstract: Disclosed herein is a transmission apparatus including a first transmission block configured to modulate a carrier-wave signal having a predetermined frequency on the basis of a first input signal, thereby outputting a first transmission signal; and a second transmission block configured to modulate a carrier-wave signal having a predetermined frequency on the basis of a second input signal, thereby outputting a second transmission signal; wherein a first input point for inputting the first transmission signal outputted from the first transmission block into a waveguide and a second input point for inputting the second transmission signal outputted from the second transmission block into the waveguide are shifted by a distance for providing a predetermined phase difference between the first transmission signal and the second transmission signal.

Abstract: Techniques for sending and receiving signals include pre-distorting signals before transmission across a communication path. The signals are pre-distorted as a function of a distortion on the communication path. In one embodiments, transmitter a broadcasts to receiver b and there is also a transmitter b broadcasting to receiver a. This return channel enables both transmitters a and b to have a priori information regarding the transmission medium and path the signal takes. In this way, the nature of the distortion or interference is known to the transmitter, therefore, it pre-distorts the transmitted signal to compensate for the receiver exceeding its capabilities in recovering signal.

Abstract: A wireless receiver of a directional signal such as a 60 GHz signal can have a low power standby mode in which the linear oscillator (radio) portion of the receiver is deenergized. A DC detect circuit can detect the DC portion of an incoming signal, at which time the DC detect circuit energizes the remaining portions of the receiver.

Abstract: A laminated electronic component includes outer terminal electrodes including lower plating films including metal particles having an average size of 0.5 ?m or less, the lower plating films being formed by directly plating an outer surface of an electronic component body such that the lower plating films are electrically connected to exposed portions of inner conductors. The outer terminal electrodes may further include upper plating films formed on the lower plating films, the upper plating films being defined by one or more layers. Metal particles defining the upper plating films may have an average size of 0.5 ?m or less. The metal particles defining the lower plating films may be Cu particles.

Abstract: A semiconductor device includes an internal circuit; a plurality of power switches arranged in parallel configured to supply a current to the internal circuit; an instruction circuit configured to output a instruction signal for controlling power supply to the internal circuit; a variation detection circuit configured to detect the current and to output a detection result; and a logic circuit configured to control a timing when the plurality of power switches becomes a conducting state in accordance with the detection result and the instruction signal.

Abstract: A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.

Abstract: A multilayer electronic component includes a laminate including insulating layers that are laminated to each other and internal electrodes provided along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate and an external electrode provided on the predetermined surface. The external electrode includes a plated film which is directly provided on the predetermined surface of the laminate so as to electrically connect edges of the internal electrodes exposed at the predetermined surface of the laminate, and at a boundary portion between each of the internal electrodes and the plated film, a counter diffusion layer is provided, in which a metal component in the plated film and a metal component in the internal electrodes are both detectable, and extend to both sides of the internal electrodes and the plated film, and, at a side of the internal electrodes.