Abstract: A liquid ejection head includes a liquid ejection board and a liquid ejection head component disposed on the liquid ejection board. The liquid ejection board includes a substrate, an energy generating device on the substrate, a channel defining member defining a liquid channel and having a liquid ejection opening in communication with the liquid channel, a liquid supply passage in communication with the liquid channel, a liquid supply opening in communication with the liquid supply passage and having a smaller opening cross-sectional area taken in a direction perpendicular to a flow direction of a liquid than the liquid supply passage, and an opening in communication with the liquid channel. The liquid channel allows a liquid to be in contact with the energy generating device. The liquid ejection opening allows a liquid to be ejected therethrough. The liquid ejection head component closes at least a portion of the opening.

Abstract: A CPU acquires factor information for a degree of arteriosclerosis, stores a plurality of pseudo blood flow waveforms, generates a waveform estimated as a blood flow waveform by compositing the plurality of pseudo blood flow waveforms based on the factor information, decomposes a pulse waveform into waveforms of an ejected wave and a reflected wave using the pulse waveform and the waveform estimated as the blood flow waveform, and calculates an index of the degree of arteriosclerosis from a relationship between the ejected wave and the reflected wave obtained by decomposing the pulse waveform.

Abstract: A method for manufacturing a liquid ejection head includes the steps of: preparing a substrate including an energy-generating element disposed on a first surface of the substrate and a supply path for liquid; disposing a dry film on the first surface of the substrate in such a manner that the dry film partially enters the supply path; etching the dry film from a side of the dry film facing the first surface of the substrate so that the dry film has an etched surface substantially in parallel with the first surface and covers the supply path; forming a resin layer to be a flow path member on the dry film covering the supply path; and removing the dry film covering the supply path.

Abstract: A liquid ejection head includes a substrate having an energy generating element arranged therein and an ejection port forming member laid as superposed above the substrate. At least one ejection port is formed so as to run through the ejection port forming member. The ejection port forming member has a concave portion including the ejection port formed therein on the surface thereof opposite to the surface thereof facing the substrate, and has a convex portion on the surface of the ejection port forming member facing the substrate so as to correspond to the concave portion.

Abstract: A blood pressure measurement device includes a cuff, a display, a distance sensor, an acceleration sensor, and a CPU. The display displays a positional relationship between the patient's heart and the device, which includes a flat screen. The distance sensor measures a distance between the device and the patient, and detects a subject to be measured on a line perpendicular to the flat screen of the display and measures the distance. The acceleration sensor measures an angle of inclination of the device when mounted on the patient's wrist. The CPU calculates a positional relationship between the patient's heart and the device based on the distance between the device and the subject to be measured, the angle of inclination of the device mounted on the patient's wrist, the length of the patient's forearm and upper arm, and a vertical distance between the patient's shoulder and heart.

Abstract: A process for producing a liquid discharge head including a substrate having a liquid supply path passing through from its first surface to second surface and an discharge port forming member having a discharge port communicating with the supply path through a flow path, the process including providing a first layer of photosensitive resin in a region covering an opening of the supply path in the first surface; forming a latent image of a pattern of the flow path in the first layer by exposure; providing a second layer of negative photosensitive resin on the first layer; curing a portion, opposing to the opening of the supply path in the first surface, of the second layer; forming a latent image of a pattern of the discharge port in the second layer by exposure; and developing latent images of patterns of the flow path and discharge port.

Abstract: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

Abstract: An emission signal visualization device includes a front video camera for photographing a measured object from the front, a signal detecting sensor for detecting an emission signal generated from the measured object, a lateral video camera for photographing the signal detecting sensor from a lateral, a spectrum analyzer, and an analyzing body unit, and records and analyzes the state of the spatial distribution of signals detected by the signal detecting sensor.

Abstract: The present invention provides an electronic device that is able to achieve an improvement in yield or an electronic device that is able to prevent a sealing resin from exfoliating from a sub-electrode. The electronic device is provided with an electronic element and a wire bonded to the electronic element. The electronic element includes a bonding pad to which the wire is bonded. The bonding pad includes a Pd layer that directly contacts the wire.

Abstract: Insulator that forms an insulating layer on a surface of a plurality of stacked stator cores includes protruding part extending from an outer circumference of stator cores on a substantially same face as one end face of stator cores in a stacking direction. Protruding part includes hooks that fixedly holds connector having a plurality of connector terminals for feeding power from outside. Connector is fixedly held by hooks, winding is wound around each slot of stator cores via insulator, and connector terminals are fixedly press-fitted to connector. A tip of each of connector terminals on a side of winding is bent into a substantially L-shape, winding end in each phase of winding is directly tied to L-shaped tip of connector terminal and connected thereto by soldering.

Abstract: A semiconductor device includes: a semiconductor element having a functional surface formed with a functional circuit and a reverse surface opposite to the functional surface; an electroconductive support member supporting the semiconductor element and electrically connected to the semiconductor element; and a resin package covering the semiconductor element and at least a part of the electroconductive support member. The semiconductor element is provided with an electrode including a projection on the functional surface and with a reinforcing layer formed on the functional surface. The semiconductor device further includes a solid-state welded portion formed by solid state welding of at least a part of the projection of the electrode and at least a part of the electroconductive support member.

Abstract: A blood pressure measurement device includes a cuff, inflation/deflation unit, pressure detection unit, volume detection unit, and control unit. The control unit determines values of an arterial volume signal detected by the volume detection unit, changes a prescribed control target value from the determined value at a time of diastolic blood pressure to a vicinity of the value at the time of systolic blood pressure during a rise time, changes the prescribed control target value from the determined value at the time of systolic blood pressure to a vicinity of the value at the time of diastolic pressure during a fall time, and adjusts the pressure of the cuff by controlling the inflation/deflation unit such that the volume indicated by the arterial volume signal detected by the volume detection unit matches the prescribed control target value. Thus, by applying a control target value, blood pressure can be measured.

Abstract: A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

Abstract: A core-shell gel particle of the invention contains a crosslinked hyaluronic acid, has a higher equilibrium swelling capacity at the surface than at the center, the equilibrium swelling capacity showing a change curve with an inflection point from the center to the surface, and has a probe pushing force of 20 nN or less from the surface to a depth of 800 nm.

Abstract: A method of manufacturing a substrate for a liquid ejection head including an ejection port forming member which has formed therein ejection ports, includes the steps of: forming a first layer by using a first layer forming member; forming a second layer on the first layer by using a second layer forming member; and hardening a partial region of each of the first layer and the second layer and removing a region different from the partial region so as to form the ejection ports, resulting in that the first layer and the second layer constitute the ejection port forming member, and a member containing a solvent to dissolve the first layer forming member and a photo-acid-generating agent having an acid strength weaker than an acid strength of the photo-acid-generating agent contained in the first layer forming member is used as the second layer forming member.

Abstract: A segment for a rehabilitation pipe is formed of an inner surface plate having an inner circumferential surface, and side plates and end plates provided upright on a peripheral edge of the inner surface plate. The inner surface plate, the side plates, and the end plates are formed integrally from a plastic material, and a number of such segments are linked in circumferential and pipe-length directions to form the rehabilitation pipe. Each of the side plates is provided with at least one hole through which a linking member is inserted for linking the segments in the pipe-length direction, and is provided separately from the hole with an opening at an end in the vicinity of the end plate for a linking operation of the segments in the circumferential direction and for passing therethrough a filler material injected into a space between the existing pipe and the rehabilitation pipe.

Abstract: A semiconductor device includes first and semiconductor elements, an electroconductive support member including electroconductive elements, and a resin package. The first semiconductor element includes a first active surface and first electrodes formed on the first active surface. The second semiconductor element includes a second active surface and second electrodes formed on the second active surface. The electroconductive support member is electrically connected to the first and second semiconductor elements and support these elements. The resin package covers the first and second semiconductor elements. The second semiconductor element is located between the first semiconductor element and the electroconductive support member. The first electrodes of the first semiconductor element and the electroconductive elements are connected by wire.

Abstract: A medical-image processing apparatus according to an embodiment includes a reconstructing circuitry and a display control circuitry. The reconstructing circuitry performs a volume rendering operation on volume data while moving the viewpoint position by a predetermined parallactic angle, and generates a parallax image group that includes a plurality of parallax images with different viewpoint positions. The display control circuitry causes a stereoscopic display monitor to display the parallax image group as a stereoscopic image. With regard to the volume data that is acquired by each of the multiple types of medical-image diagnostic apparatus, the reconstructing circuitry adjusts each parallactic angle during generation of the parallax image group and, in accordance with each of the adjusted parallactic angles, generates each parallax image group on the basis of the volume data that is acquired by each of the multiple types of medical-image diagnostic apparatus.

Abstract: A liquid discharge head provided with a member having discharge ports formed configured to discharge liquid thereon, wherein a discharge port surface of the member having discharge ports arrayed thereon includes fumed silica.

Abstract: A process for producing a semiconductor chip having a substrate and a bump formed on the substrate including (1) forming, on a substrate, a conductor gold for plating to be a base of plating growth; (2) forming a mask for plating on the conductor gold for plating; (3) performing plating using the mask for plating to form the bump and a dummy pattern; (4) removing the mask for plating; (5) etching the conductor gold for plating; and (6) applying a shock to at least the dummy pattern. The amount of side etching of the conductor gold for plating is grasped from a state of separation of the dummy pattern due to the shock in the step (6).