Abstract: A semiconductor device includes: a plurality of semiconductor chips spaced apart from one another; and a conductive part. The plurality of semiconductor chips include respective semiconductor switching elements. The conductive part connects the plurality of semiconductor chips in parallel. A material of the semiconductor switching elements of the plurality of semiconductor chips includes a wide bandgap semiconductor. At least one of the semiconductor switching elements has a channel length of 1.5 ?m or less.

Abstract: An object is to provide a technique that enables suppression of oscillation of a gate signal waveform. A power semiconductor device includes a power semiconductor chip, a plurality of collector main terminals and a plurality of emitter main terminals electrically connected to the power semiconductor chip, and a signal line. The plurality of collector main terminals and the plurality of emitter main terminals have protrusion portions which protrude from a disposition surface of the power semiconductor chip, respectively, and the signal line surrounds, with respect to these protrusion portions, an entire circumference of all the protrusion portions and is spaced apart therefrom in plan view.

Abstract: An information processing apparatus includes a storage unit configured to store a face dictionary for performing face authentication, and a processing unit configured to update the face dictionary stored in the storage unit, wherein the processing unit controls updating of the face dictionary based on the number of images from among stored images corresponding to a person registered with the face dictionary.

Abstract: An object is to provide a technique that enables suppression of oscillation of a gate signal waveform. A power semiconductor device includes a power semiconductor chip, a plurality of collector main terminals and a plurality of emitter main terminals electrically connected to the power semiconductor chip, and a signal line. The plurality of collector main terminals and the plurality of emitter main terminals have protrusion portions which protrude from a disposition surface of the power semiconductor chip, respectively, and the signal line surrounds, with respect to these protrusion portions, an entire circumference of all the protrusion portions and is spaced apart therefrom in plan view.

Abstract: A power semiconductor chip and a low-power portion that has power consumption lower than that of the power semiconductor chip are located on a predetermined surface side of a heat sink having conductivity. A first plate-shaped insulating member extends between the power semiconductor chip and the heat sink. A second plate-shaped insulating member extends between the low-power portion and the heat sink. A portion, which faces the low-power portion, of the second plate-shaped insulating member is thicker than a portion, which faces the power semiconductor chip, of the first plate-shaped insulating member.

Abstract: To provide a function of easily preventing burn-in at low cost without disturbing mixed reality being experienced by a user, a mixed reality presenting system includes a display control unit configured to display a confirmation image on a display unit when a first time period has elapsed since the display control unit had performed control to start display on the display unit, and to control display on the display unit in response to an operation performed on the confirmation image by a user of the mixed reality presenting system.

Abstract: A power semiconductor device includes a resistance control structure disposed in a central portion of a semiconductor substrate having a resistance to a current higher than in a peripheral portion of the substrate surrounding the central portion. The semiconductor includes a first semiconductor layer of a first conductivity type which extends laterally to run across the central portion and the peripheral portion, and a second semiconductor layer of a second conductivity type which faces the first semiconductor layer in a thickness direction and extends laterally to run across the central portion and the peripheral portion. A lifetime control layer is provided in the first semiconductor layer, extends laterally to run across the central portion and the peripheral portion and has a higher lifetime killer concentration in the central portion than the peripheral portion. The resistance control structure includes the lifetime control layer.

Abstract: A power semiconductor chip and a low-power portion that has power consumption lower than that of the power semiconductor chip are located on a predetermined surface side of a heat sink having conductivity. A first plate-shaped insulating member extends between the power semiconductor chip and the heat sink. A second plate-shaped insulating member extends between the low-power portion and the heat sink. A portion, which faces the low-power portion, of the second plate-shaped insulating member is thicker than a portion, which faces the power semiconductor chip, of the first plate-shaped insulating member.

Abstract: Provided is a power semiconductor device including a semiconductor substrate, in which a current flows in a thickness direction of the semiconductor substrate. The semiconductor substrate includes a resistance control structure configured so that a resistance to the current becomes higher in a central portion of the semiconductor substrate than a peripheral portion of the semiconductor substrate.

Abstract: A personal computer holds data of a plurality of types in a content storage unit and transfers items of data related across the types of data to a digital camera as group data. The digital camera stores the group data, which is received from the personal computer, in a content memory unit.

Abstract: To provide a function of easily preventing burn-in at low cost without disturbing mixed reality being experienced by a user, a mixed reality presenting system includes a display control unit configured to display a confirmation image on a display unit when a first time period has elapsed since the display control unit had performed control to start display on the display unit, and to control display on the display unit in response to an operation performed on the confirmation image by a user of the mixed reality presenting system.

Abstract: Provided is a power semiconductor device including a semiconductor substrate, in which a current flows in a thickness direction of the semiconductor substrate. The semiconductor substrate includes a resistance control structure configured so that a resistance to the current becomes higher in a central portion of the semiconductor substrate than a peripheral portion of the semiconductor substrate.

Abstract: An information processing apparatus is arranged to determine whether or not the software is installed from any one of the updater from the recording medium and the downloaded updater, in accordance with a type of the updater determined by a server based on version information of the software stored in the external recording medium and is also arranged to operate such that when the updater type includes a full updater, the software in the external recording medium is not installed but the full updater is downloaded from the server apparatus and installed, and when the updater type does not include the full updater, the software in the external recording medium is installed and a difference data is downloaded from the server and installed concurrently with it.

Abstract: An information processing apparatus includes a storage unit configured to store a face dictionary for performing face authentication, and a processing unit configured to update the face dictionary stored in the storage unit, wherein the processing unit controls updating of the face dictionary based on the number of images from among stored images corresponding to a person registered with the face dictionary.

Abstract: Provided is a power semiconductor device including a semiconductor substrate, in which a current flows in a thickness direction of the semiconductor substrate. The semiconductor substrate includes a resistance control structure configured so that a resistance to the current becomes higher in a central portion of the semiconductor substrate than a peripheral portion of the semiconductor substrate.

Abstract: A boot control method of a program in an information processing apparatus to which a device can be connected, the method including a search step of searching for a running program that is running on the information processing apparatus when the device is connected, a determination step of determining whether the running program found in the search step includes a program unfit for concurrent running that is unsuited for concurrent running with preset device-corresponding software that is booted in response to connection of the device, and a boot step of booting the device-corresponding software if the running program does not include the program unfit for concurrent running and performing control so as not to boot the device-corresponding software if the running program includes the software unfit for concurrent running.

Abstract: Provided is a power semiconductor device including a semiconductor substrate, in which a current flows in a thickness direction of the semiconductor substrate. The semiconductor substrate includes a resistance control structure configured so that a resistance to the current becomes higher in a central portion of the semiconductor substrate than a peripheral portion of the semiconductor substrate.