Abstract: A heating apparatus for performing heat treatment on a wafer applied with a resist before or after exposure includes a heating plate for heating a wafer which is placed on the heating plate, a light intensity detecting apparatus for irradiating light on the wafer to detect intensity of reflected light from the resist on the wafer, and a control section for controlling heating performed by the heating plate on the basis of the detected intensity of reflected light so that heating amount applied to a plurality of wafers becomes constant. Accordingly, the heating amount of the wafer can be controlled to be constant and variations in dimension of resist patterns can be reduced.

Abstract: A pattern size evaluation apparatus comprising an illumination optical system for projecting parallel light rays of a predetermined wavelength on a monitoring area formed on an object, the monitoring area being formed at a position different from a device pattern formed on the object, a light intensity detection optical system for detecting diffracted light from the monitoring area, and a device pattern size evaluation section for evaluating a size of the device pattern based on an intensity of diffracted light from the monitoring area.

Abstract: A verification data generating apparatus generates data that can be stored in a terminal device without sustaining unauthorized operations and has assured continuity in the order of being output. In the apparatus, a verification data holding element holds a verification data. A data generation element generates a data body at a predetermined timing. Whenever the data body is generated, a verification value generation element generates a new verification value based on the verification value held in the verification value holding element and the data body newly generated. The verification value held in the verification value holding element is then updated with the new verification value. A data storage element stores the data bodies generated by the data generating element in order.

Abstract: In an optical element (B1) prepared by integrally forming, on surfaces of a transparent member, a refracting surface (R2) for receiving a light beam, a plurality of reflecting surfaces (R3, R4, R5) with curvatures, and a refracting surface (R6) for outputting the light beam reflected by the plurality of reflecting surfaces, a reference portion (7) for defining the position of the optical element in a predetermined direction with respect to a Y′-Z′ plane including an incident reference axis (5) and an exit reference axis (5) of at least one reflecting surface of the optical element (B1) is formed on the optical element.

Abstract: A semiconductor integrated device has a detection cell arranged in a power-supply line in the semiconductor integrated device and detecting a power-supply voltage. Further, a detection circuit detects a voltage drop of the power-supply voltage detected by the detection cell. Connection wiring connects the detection cell and the detection circuit and outputs the power-supply voltage detected by the detection cell to the detection circuit.

Abstract: A control method for an exposure apparatus, in which an exposure amount and a focus value are set in transferring a circuit pattern on a mask onto a resist formed on a wafer by the exposure apparatus, includes the steps of arranging, on the mask, an exposure amount monitor mark and a focus monitor mark used to separately monitor the effective exposure amount and the focus value on the wafer, transferring the exposure amount monitor mark and the focus monitor mark onto the resist to form an exposure amount monitor pattern and a focus monitor pattern, measuring the states of the exposure amount monitor pattern and the focus monitor pattern at least at one of timings after exposure, after post exposure baking, during a cooling process after baking, during a process after cooling, during development, and after development, on the basis of the measurement results, calculating the difference between an optimum exposure amount value and an exposure amount set value set in the exposure apparatus and the difference be

Abstract: In an optical element composed of an entrance refractive surface, an exit refractive surface and a plurality of internal reflective surfaces provided between the entrance refractive surface and the exit refractive surface, a structure is provided for enabling the optical element to turn around a reference axis of the entrance refractive surface. Further, in such an optical element, an diaphragm member is disposed adjacent to the entrance refractive surface and is arranged to vary an aperture diameter thereof according to a movement thereof.

Abstract: A light-quantity controlling device includes a driving source, a first light-quantity controlling member driven by the driving source and having a first elongated opening extending in a direction of movement of the first light-quantity controlling member, and a second light-quantity controlling member driven by the driving source in a direction substantially perpendicular to the direction of movement of the first light-quantity controlling member and having a second elongated opening extending in the direction of movement of the second light-quantity controlling member. The light-quantity controlling device also includes a supporting member configured to support the first and second light-quantity controlling members and having an opening therein. The first and second elongated openings intersect each other at the opening provided in the supporting member when the first and second light-quantity controlling members are driven by the driving source.

Abstract: An optical element is provided that allows accurate measurement of the shapes of the element and its surfaces which light is bound to strike, a jig is provided for holding the optical element, and an apparatus such as an image pickup apparatus or display apparatus is provided which includes the optical element. This optical element is characterized in that it includes surfaces which light is bound to strike and reference portions indicating the reference positions of the shapes of the surfaces, and the reference portions have curved surfaces defining points corresponding to the reference positions.

Abstract: In an optical element (B1) prepared by integrally forming, on surfaces of a transparent member, a refracting surface (R2) for receiving a light beam, a plurality of reflecting surfaces (R3, R4, R5) with curvatures, and a refracting surface (R6) for outputting the light beam reflected by the plurality of reflecting surfaces, a reference portion (7) for defining the position of the optical element in a predetermined direction with respect to a Y′-Z′ plane including an incident reference axis (5) and an exit reference axis (5) of at least one reflecting surface of the optical element (B1) is formed on the optical element.

Abstract: A verification data generating apparatus generates data that can be stored in a terminal device without sustaining unauthorized operations and has assured continuity in the order of being output.

Abstract: An image input apparatus has a pan head for mounting an image pickup device thereon and for changing the image pickup direction of the image pickup device. The image pickup device has an engaging device, and control terminals capable of transmitting specification information about an operation of the pan head from the image pickup device to the pan head. The pan head has a holding device to be engaged with the engaging device so as to interchangeably hold the image pickup device, identifying terminals capable of receiving the specification information when the image pickup device is held by the holding device, and a selection circuit for selecting an operation of the pan head corresponding to the held image pickup device based on the received specification information.

Abstract: In an optical element (B1) prepared by integrally forming, on surfaces of a transparent member, a refracting surface (R2) for receiving a light beam, a plurality of reflecting surfaces (R3, R4, R5) with curvatures, and a refracting surface (R6) for outputting the light beam reflected by the plurality of reflecting surfaces, a reference portion (7) for defining the position of the optical element in a predetermined direction with respect to a Y′-Z′ plane including an incident reference axis (5) and an exit reference axis (5) of at least one reflecting surface of the optical element (B1) is formed on the optical element.

Abstract: In an optical element (B1) prepared by integrally forming, on surfaces of a transparent member, a refracting surface (R2) for receiving a light beam, a plurality of reflecting surfaces (R3, R4, R5) with curvatures, and a refracting surface (R6) for outputting the light beam reflected by the plurality of reflecting surfaces, a reference portion (7) for defining the position of the optical element in a predetermined direction with respect to a Y′-Z′ plane including an incident reference axis (5) and an exit reference axis (5) of at least one reflecting surface of the optical element (B1) is formed on the optical element.

Abstract: A heating apparatus for performing heat treatment on a wafer applied with a resist before or after exposure includes a heating plate for heating a wafer which is placed on the heating plate, a light intensity detecting apparatus for irradiating light on the wafer to detect intensity of reflected light from the resist on the wafer, and a control section for controlling heating performed by the heating plate on the basis of the detected intensity of reflected light so that heating amount applied to a plurality of wafers becomes constant. Accordingly, the heating amount of the wafer can be controlled to be constant and variations in dimension of resist patterns can be reduced.

Abstract: According to the present invention, piracy of secret data is prevented without an attack detecting circuit or data deleting circuit. In a secret data processing unit, a cell contains fluid in a sealed space. Code generators arranged in the sealed space receive a code generation request to generate codes specified by the pressure value of the fluid. A key generator disposed in the sealed space generates encryption keys/decryption keys specified by the generated codes. An encryptor/decryptor also disposed in the sealed space receives requests for secret data encryption/requests for encrypted secret data decryption, and outputs code generation requests to the code generator to encrypt the secret data/decrypt the encrypted secret data by using the generated encryption key/decryption key. Both codes and encryption keys/decryption keys generated and used, are not statically stored in the cryptographic processing unit.

Abstract: A method of testing a semiconductor integrated circuit device including a defective chip recognition circuit unit so that in testing a DRAM unit, if the DRAM unit cannot be made to conform to a specification, even using a redundancy circuit, defective data can be written in the defective chip recognition circuit unit. The method includes deciding whether a DRAM unit conforms and deciding whether a DRAM unit judged imperfect can be conformed using a redundancy circuit; deciding whether the semiconductor integrated circuit device is defective when the DRAM unit has been judged defective and writing the defective decision data into a defective chip recognition circuit unit; reading the defective decision data in the defective chip recognition circuit unit and deciding whether to test the logic unit; testing the logic unit when the test of the logic unit is to be performed; and deciding whether the logic unit conforms.

Abstract: A heating apparatus for performing heat treatment on a wafer applied with a resist before or after exposure includes a heating plate for heating a wafer which is placed on the heating plate, a light intensity detecting apparatus for irradiating light on the wafer to detect intensity of reflected light from the resist on the wafer, and a control section for controlling heating performed by the heating plate on the basis of the detected intensity of reflected light so that heating amount applied to a plurality of wafers becomes constant. Accordingly, the heating amount of the wafer can be controlled to be constant and variations in dimension of resist patterns can be reduced.

Abstract: A resist pattern forming method according to this invention is characterized by forming a resist film to have different thicknesses in one region and the other region in accordance with the pattern size or pattern density of a photomask. The resist pattern forming method according to this invention is characterized by selectively forming a resist film in part of a substrate region by applying a resist in part of the region without applying the resist in the remaining region. The resist pattern forming method according to this invention is characterized by selectively forming a resist film on part of a substrate on the basis of the intensity of exposure light observed at the resist film.

Abstract: A wideband semiconductor electro-absorption optical modulator including a semiconductor core shorter in absorption-peak wavelength than a wavelength of optical signal, and an electrode for applying an electric signal to absorb the optical signal by shifting the absorption-peak wavelength to a long wavelength region when a voltage is applied, wherein an electric signal input port and an electric signal output port are disposed so that the electrode is constructed in the form of a traveling-wave electrode, and a total thickness of non-doped layers including the semiconductor core is reduced to decrease a driving voltage. Degradation of optical modulation bandwidth and reflection characteristics of the electric signal caused by mismatching of characteristic impedance to an outer circuit are reduced by decreasing an interaction length of the electric signal and the optical signal.