Patents by Inventor Kenji Kubota
Kenji Kubota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11973453Abstract: A first actuator and a second actuator each have a plurality of control calculation units provided redundantly and a plurality of motor drive units provided redundantly. In the first and the second actuators, the control calculation units of the systems paired with each other transmit and receive information to and from each other by a communication between the actuators. When a failure occurs in any system in either of the two actuators, or when a failure occurs in a communication between actuators in either system, the control calculation unit of each actuator of the system in which the failure occurred stops the motor drive control. Then, the motor drive control is continued by the control calculation unit of the normal system in both actuators.Type: GrantFiled: April 26, 2022Date of Patent: April 30, 2024Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA, JTEKT CORPORATIONInventors: Hiroki Tomizawa, Masaharu Yamashita, Kenji Shibata, Yosuke Yamashita, Shoji Kubota, Yugo Nagashima, Yuji Fujita, Kenichi Abe
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Publication number: 20240110121Abstract: A lubricating oil composition containing a base oil (A), a molybdenum-based friction modifier (B), a metal-based detergent (C), and a dispersant (D), in which the dispersant (D) contains a non-boron-modified polyisobutenyl succinic bisimide (D1). The IR spectrum of the non-boron-modified polyisobutenyl succinic bisimide (D1) is determined by an FT-IR method, having a ratio [Abs (1705 cm?1)/Abs (1390 cm?1)] of a peak intensity Abs (1705 cm?1) at 1705 cm?1 to a peak intensity Abs (1390 cm?1) at 1390 cm?1 is 7.5 or less. A content of the non-boron-modified polyisobutenyl succinic bisimide (D1) is 50 mass % or more based on a total amount of the dispersant (D), and contains a kinematic viscosity at 100° C. is 9.3 mm2/s or less. The lubricating oil composition has an excellent effect of reducing a friction coefficient while containing a molybdenum-based friction modifier and a succinimide compound.Type: ApplicationFiled: February 4, 2022Publication date: April 4, 2024Applicant: IDEMITSU KOSAN CO.,LTD.Inventors: Kenji SUNAHARA, Jun YAMASHITA, Masaya KUBOTA, Shoichiro FUJITA
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Publication number: 20240101924Abstract: A lubricating oil composition may contain a base oil (A) and a dispersant-type viscosity index improver (B), in which the nitrogen atom content based on the solid content of the dispersant-type viscosity index improver (B) is 0.50 to 1.50% by mass, and the weight-average molecular weight (Mw) thereof is 100,000 or more, and the content in terms of the solid content based on the total amount of the composition of the dispersant-type viscosity index improver (B) is more than 0.05% by mass and less than 5.0% by mass. The lubricating oil composition may exert excellent wear resistance in a state contaminated with soot.Type: ApplicationFiled: March 4, 2022Publication date: March 28, 2024Applicant: IDEMITSU KOSAN CO.,LTD.Inventors: Shoichiro FUJITA, Kenji SUNAHARA, Tsukasa YAMAGISHI, Masaya KUBOTA
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Patent number: 11938503Abstract: An ultrafine bubble (UFB)-containing liquid manufacturing apparatus includes a liquid ejecting unit having a thermal energy generating element, a flow path for leading liquid to the thermal energy generating element, a driving unit configured to drive the thermal energy generating element, and an ejection opening. The UFB-containing liquid manufacturing apparatus also includes a collecting unit configured to collect liquid ejected from the ejection opening. The driving unit drives the thermal energy generating element to cause film boiling in liquid led to the flow path and causes liquid containing ultrafine bubbles generated by the film boiling to be ejected from the ejection opening.Type: GrantFiled: August 22, 2018Date of Patent: March 26, 2024Assignee: Canon Kabushiki KaishaInventors: Kenji Takahashi, Masahiko Kubota, Ikuo Nakazawa, Akitoshi Yamada, Nobuhisa Tanahashi
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Patent number: 11926216Abstract: A vibration damping device including a vibration-damping device main unit inserted into a mounting space of a bracket from a lateral side and securely supported by the bracket. The bracket includes engaging pieces on respective opposed inside faces of the mounting space, and engaging action of the engaging pieces with respect to respective detent engaging faces formed on a fixture member of the vibration-damping device main unit prevents the vibration-damping device main unit from becoming dislodged from the mounting space of the bracket. Opposed walls of the mounting space are each penetrated by an aperture window, and inspection flat surfaces are separately provided to an outside surface of each engaging piece visible from an outside through the aperture window and a corresponding external side surface of the bracket that is off the aperture window. The inspection flat surfaces are parallel to each other.Type: GrantFiled: December 23, 2021Date of Patent: March 12, 2024Assignees: SUMITOMO RIKO COMPANY LIMITED, HONDA MOTOR CO., LTD.Inventors: Kenji Oki, Shingo Tanaka, Hiroki Kondo, Yusuke Arai, Kozo Kubota
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Patent number: 11901659Abstract: Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 ?m to 20 ?m inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.Type: GrantFiled: August 3, 2020Date of Patent: February 13, 2024Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshie Tarutani, Kenji Kubota
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Publication number: 20230411266Abstract: A heatsink-integrated insulating circuit board includes a heat sink including a radiating fin, an insulating resin layer formed on a top plate part of the heat sink, and a circuit layer arranged on one surface of the insulating resin layer. An angle ? formed between an end of the metal piece and a surface of the insulating resin layer is set to be 70° or more and 110° or less. Root-mean-square heights Sq1 and Rq1 in bonding surfaces to the insulating resin layer in the top plate part of the heat sink and the metal piece, and root-mean-square heights Sq2 and Rq1 in regions other than the bonding surfaces to the insulating resin layer in the top plate part of the heat sink and the metal piece have a relationship of Sq1>Sq2 or Rq1>Rq2.Type: ApplicationFiled: November 25, 2021Publication date: December 21, 2023Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshiaki Sakaniwa, Toyo Ohashi, Marina Sakamaki, Kenji Kubota
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Patent number: 11781234Abstract: A copper alloy plate including 0.3 mass % or more and 1.2 mass % or less of Mg, 0.001 mass % or more and 0.2 mass % or less of P, and the balance Cu with inevitable impurities in a thickness center portion in a plate thickness direction; Mg concentration on a plate surface is 30% or less of bulk Mg concentration at the thickness center portion; a surface layer part having a depth from the plate surface to where it is 90% of the bulk Mg concentration is provided; and in the surface layer part, the Mg concentration increases from the plate surface toward the thickness center portion with a concentration gradient 1.8 mass %/?m or more and 50 mass %/?m or less.Type: GrantFiled: December 18, 2019Date of Patent: October 10, 2023Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Naoki Miyashima, Kazunari Maki, Shinichi Funaki, Kenji Kubota
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Publication number: 20230299548Abstract: A base material at least a surface is made of copper or copper alloy and a silver-nickel-potassium alloy plating layer formed on at least a part of the base material are provided; the silver-nickel-potassium alloy plating layer has a film thickness of 0.5 ?m or more and 20.0 ?m or less, a nickel content of 0.02% by mass or more and 0.60% by mass or less, and a potassium content of 0.03% by mass or more and 1.00% by mass or less; and an average crystal grain size of the silver-nickel-potassium alloy plating layer is preferably 10 nm or more and 150 nm or less.Type: ApplicationFiled: February 24, 2021Publication date: September 21, 2023Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshie Tarutani, Naoki Katou, Kenji Kubota
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Patent number: 11761109Abstract: A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 µm or more and less than 0.50 µm and a nickel content 0.03 at% or more and 1.00 at% or less.Type: GrantFiled: January 28, 2021Date of Patent: September 19, 2023Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshie Tarutani, Kenji Kubota, Naoki Katou
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Patent number: 11753733Abstract: In a method for producing high-purity electrolytic copper, a first additive (A) containing an aromatic ring of a hydrophobic group and a polyoxyalkylene group of a hydrophilic group, a second additive (B) formed of polyvinyl alcohols, and a third additive (C) formed of tetrazoles are added to a copper electrolyte, copper electrolysis is performed by controlling each concentration of the first additive (A), the second additive (B), and the third additive (C), a current density and a bath temperature, and accordingly, electrolytic copper in which a concentration of Ag is less than 0.2 mass ppm, a concentration of S is less than 0.07 mass ppm, a concentration of all impurities is less than 0.2 mass ppm, and an area ratio of crystal grains having an average crystal grain misorientation (referred to as a GOS value) exceeding 2.5° is 10% or less is obtained.Type: GrantFiled: June 1, 2018Date of Patent: September 12, 2023Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshie Tarutani, Kenji Kubota, Kiyotaka Nakaya, Isao Arai
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Publication number: 20230257897Abstract: A corrosion-resistant terminal material for an aluminum core wire having a good adhesion of plating and a high effect of corrosion resistant, having a base material in which at least a surface is made of copper or copper alloy and a corrosion-resistant film formed on at least a part of the base material; the corrosion film having an intermediate alloy layer made of tin alloy, a zinc layer made of zinc or zinc alloy formed on the intermediate alloy layer, and a tin-zinc alloy layer made of tin alloy containing zinc and formed on the zinc layer; and a tin content in the intermediate alloy layer is 90 at % or less.Type: ApplicationFiled: June 16, 2021Publication date: August 17, 2023Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Takashi Tamagawa, Kenji Kubota
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Patent number: 11721923Abstract: Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 ?m to 20 ?m inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.Type: GrantFiled: August 3, 2020Date of Patent: August 8, 2023Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshie Tarutani, Kenji Kubota
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Patent number: 11661667Abstract: An anti-corrosion terminal material including a base material made of copper or copper alloy and a coating film laminated on the base material: the coating film includes: a first coating film, provided with a zinc layer made of zinc alloy and a tin layer made of tin or tin alloy which are laminated in this order, and formed at a planned core contact part; and a second coating film including the tin layer but not comprising the zinc layer, which is provided at a planned contact part being a contact part when the terminal is formed: and the zinc layer has a thickness not less than 0.1 ?m and not more than 5.0 ?m and zinc concentration not less than 30% by mass and not more than 95% by mass, and has any one or more of nickel, iron, manganese, molybdenum, cobalt, cadmium, lead and tin as a balance.Type: GrantFiled: October 25, 2018Date of Patent: May 30, 2023Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Kenji Kubota, Yoshie Tarutani, Takashi Tamagawa, Kiyotaka Nakaya
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Publication number: 20230111976Abstract: A terminal material for a connector provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy and formed on a surface of the base material, a silver-nickel alloy plating layer made of silver-nickel alloy and formed on at least a part of the nickel-plating layer, and a silver-plating layer made of silver and formed on the silver-nickel alloy plating layer; the silver-nickel alloy plating layer has a film thickness 0.05 µm or more and less than 0.50 µm and a nickel content 0.03 at% or more and 1.00 at% or less.Type: ApplicationFiled: January 28, 2021Publication date: April 13, 2023Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshie Tarutani, Kenji Kubota, Naoki Katou
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Patent number: 11530490Abstract: In a terminal material with a silver coating film including a silver layer on a surface, a terminal and a terminal material having high reliability are easily manufactured with low cost without a heat treatment. A base material formed of copper or a copper alloy; and nickel layer, an intermediate layer, and a silver layer laminated on the base material in this order are included, the nickel layer has a thickness of 0.05 ?m to 5.00 ?m and is formed of nickel or a nickel alloy, the intermediate layer has a thickness of 0.02 ?m to 1.00 ?m and is an alloy layer containing silver (Ag) and a substance X, and the substance X includes one or more kinds of tin, bismuth, gallium, indium, and germanium.Type: GrantFiled: August 8, 2018Date of Patent: December 20, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Kenji Kubota, Tooru Nishimura, Takashi Tamagawa, Kiyotaka Nakaya
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Patent number: 11453953Abstract: The present invention provides a high-purity electrolytic copper 10 having a Cu purity excluding gas components (O, F, S, C, and Cl) is 99.9999 mass % or more, a content of S is 0.1 mass ppm or less, and an area ratio of crystals having a (101)±10° orientation is less than 40%, when crystal orientation is measured by electron backscatter diffraction in a cross section along a thickness direction.Type: GrantFiled: June 1, 2018Date of Patent: September 27, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshie Tarutani, Kenji Kubota, Kiyotaka Nakaya, Isao Arai
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Publication number: 20220294140Abstract: Providing a terminal material for connectors provided with a base material in which at least a surface layer is made of copper or copper alloy, a nickel-plating layer made of nickel or nickel alloy coating a surface of the base material, and a silver-nickel alloy plating layer formed on at least a part of the nickel-plating layer, the silver-nickel alloy plating layer having a film thickness of 0.5 ?m to 20 ?m inclusive, a nickel content of 0.03 at % to 1.20 at % inclusive, and an average crystal grain size of 10 nm to 150 nm inclusive, to improve abrasion resistance and heat resistance.Type: ApplicationFiled: August 3, 2020Publication date: September 15, 2022Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshie Tarutani, Kenji Kubota
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Publication number: 20220081738Abstract: A copper alloy plate including 0.3 mass % or more and 1.2 mass % or less of Mg, 0.001 mass % or more and 0.2 mass % or less of P, and the balance Cu with inevitable impurities in a thickness center portion in a plate thickness direction; Mg concentration on a plate surface is 30% or less of bulk Mg concentration at the thickness center portion; a surface layer part having a depth from the plate surface to where it is 90% of the bulk Mg concentration is provided; and in the surface layer part, the Mg concentration increases from the plate surface toward the thickness center portion with a concentration gradient 1.8 mass %/?m or more and 50 mass %/?m or less.Type: ApplicationFiled: December 18, 2019Publication date: March 17, 2022Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Naoki Miyashima, Kazunari Maki, Shinichi Funaki, Kenji Kubota
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Publication number: 20220085526Abstract: Providing an anti-corrosion terminal material having high corrosion resistance effect and good adhesiveness of a film. A first film is formed on at least a part of a base material in which at least a surface is made of copper or copper alloy; in the first film, a zinc layer made of zinc or zinc alloy is formed on a mixed layer in which a copper-tin alloy region made of copper tin alloy and a tin region made of tin or tin alloy other than copper tin alloy are mixed; the zinc layer is in contact with both the copper-tin alloy region and the tin region of the mixed layer; a ratio R1/R2 is 0.05 or more and 2.5 or less where a length in contact with the copper-tin alloy region in a cross section along a thickness direction is R1 (?m) and a length in contact with the tin layer is R2 (?m).Type: ApplicationFiled: December 27, 2019Publication date: March 17, 2022Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Kenji Kubota, Takashi Tamagawa, Toru Nishimura, Yoshie Tarutani, Kiyotaka Nakaya