Abstract: A method of forming an electronic component includes laminating ceramic green sheets on a support film to obtain a ceramic green sheet laminate, forming through holes through the ceramic green sheet laminate at positions where via hole electrodes are to be located, applying conductive material into the through holes so as to fill the through holes and so as to be located on the upper surface of the ceramic green sheet laminate to form via hole electrodes, and sintering the ceramic green sheet laminate to form a substrate and so as to form protruding portions of the via hole electrodes which protrude upward from the upper surface of the substrate.

Abstract: A laminated ceramic electronic component includes an embedded portion formed in the periphery of an external terminal electrode so as to extend and be embedded in a component main member defined by ceramic layers, whereby affects of a small edge angle are eliminated.

Abstract: A laminated ceramic electronic component includes an embedded portion formed in the periphery of an external terminal electrode so as to extend and be embedded in a component main member defined by ceramic layers, whereby affects of a small edge angle are eliminated.

Abstract: An electronic component includes a package member; a via hole electrode extending through the package member and protruding from a first surface of the package member; an electronic component located on the first surface of the package member with a space located between the package member and the electronic component. The space between the electronic component and the first surface of the package member is provided by a protruding portion of the via hole electrode which extends from the surface of the package member and a joining member joining the electronic component with the via hole electrode.

Abstract: An electronic component includes a package member; a via hole electrode extending through the package member and protruding from a first surface of the package member; an electronic component located on the first surface of the package member with a space located between the package member and the electronic component. The space between the electronic component and the first surface of the package member is provided by a protruding portion of the via hole electrode which extends from the surface of the package member and a joining member joining the electronic component with the via hole electrode.

Abstract: In cleaning by sodium hypochlorite, filtration membrane cartridges are immersed in a washing tank storing a solution of sodium hypochlorite to decompose and remove organic contaminants clogging the pores of filtration membranes by oxidation of sodium hypochlorite; in rinsing with water, the cartridges are immersed in a washing tank storing a rinsing water to wash away the sodium hypochlorite attached to the filtration membrane by the rinsing water; in cleaning by oxalic acid, the cartridges are immersed in a washing tank storing oxalic acid to wash away ferrous substances attached to the filtration membrane by oxalic acid; and in giving hydrophilic property by a hydrophilic agent, the cartridges are immersed in a washing tank storing a solution of the hydrophilic agent so as to apply the hydrophilic agent to the filtration membranes in preparation for dry lay-up.

Abstract: In cleaning by sodium hypochlorite, filtration membrane cartridges are immersed in a washing tank storing a solution of sodium hypochlorite to decompose and remove organic contaminants clogging the pores of filtration membranes by oxidation of sodium hypochlorite; in rinsing with water, the cartridges are immersed in a washing tank storing a rinsing water to wash away the sodium hypochlorite attached to the filtration membrane by the rinsing water; in cleaning by oxalic acid, the cartridges are immersed in a washing tank storing oxalic acid to wash away ferrous substances attached to the filtration membrane by oxalic acid; and in giving hydrophilic property by a hydrophilic agent, the cartridges are immersed in a washing tank storing a solution of the hydrophilic agent so as to apply the hydrophilic agent to the filtration membranes in preparation for dry lay-up.

Abstract: A bridge of shock-absorbing construction is disclosed, which includes horizontal members arranged in series, vertical members supporting the horizontal members, and connectors for connecting the adjacent horizontal members or for connecting the horizontal member and the vertical member, wherein shock absorbers formed from a material with an elastic modulus in flexure over 200 kgf/cm2 and each having a wall structure in a shock-loading direction are disposed on the connectors or at the points of contact between the horizontal members or between the horizontal member and the vertical member.

Abstract: Disclosed is an earth structure which can be easily attached without degrading the antenna performance. The earth structure for grounding a feeder line for transmitting a signal received from an antenna to a receiver or the like has a long earth member having a predetermined length and one end connected to a ground wire of the feeder line. A portion from one end to the other end of the long earth member is not grounded, and the other end is open.

Abstract: A glass antenna having a high reception sensitivity while not blocking a driver's sight. On a window glass, a longitudinal length y of a pattern of the glass antenna is set so as to satisfy y.ltoreq..lambda./4.multidot..alpha. (.lambda.: reception frequency wavelength; .alpha.: glass reduction ratio), and a transversal length x of the pattern is set so as to satisfy 60 cm-y.gtoreq.x.

Abstract: A glass antenna has a rectangular loop antenna element which is extended on the upper region of a windshield glass where no heating wires of a defogger are arranged, and is capacitively coupled to the uppermost heating wire of the defogger at a predetermined capacitance, and a T-shaped second antenna element which is arranged on a region where the defogger is arranged, and is capacitively coupled to the uppermost heating wire of the defogger.

Abstract: A glass antenna system with good rear visibility. A glass antenna has a first antenna conductor element extending on a blank region where no defogger hot wires extend, a second antenna conductor element which is capacitively coupled to the first antenna conductor element in a defogger region, a third antenna conductor element which extends at a position substantially symmetrical to the first antenna conductor element about the central line of the defogger, and a fourth antenna conductor element which extends at a position substantially symmetrical to the second antenna conductor element about the central line, and is capacitively coupled to the third antenna conductor element.

Abstract: A vehicle glass antenna for receiving FM and AM radio waves, includes a first antenna line which vertically extends on a glass of the vehicle so as to receive the FM radio waves, and has a feeding point on the edge of the glass, and a second antenna line which is connected to the first antenna line at a position in the neighborhood of the feeding point so as to receive the radio waves in the AM band, and extends by a predetermined length in a loop pattern along the edge of the glass.

Abstract: A glass antenna having a defogger and an antenna conductor each extending on a glass comprises a first antenna conductor element extending along the glass surface and a second antenna conductor element which extends upward and downward along the glass surface substantially at the center of the defogger in a vehicle width direction in the region to which the defogger extends and a portion of which is coupled to a heating wire of the defogger through a direct current, wherein the first antenna conductor element is disposed to the defogger so that the heating wire connected the second antenna conductor element is coupled to the first antenna conductor element through capacitive coupling with a capacitance of about 40 pF or less.

Abstract: In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

Abstract: A multilayer electronic component having reduced arrangement pitches for external electrodes is formed by providing via holes in a mother laminate with conductive materials. The mother laminate is obtained by stacking a plurality of insulating sheets with interposition of conductor films in positions that are parted by cutting. The conductive materials define external electrodes for individual multilayer electronic components which are obtained by cutting the mother laminate. A specific step for forming the external electrodes is not required, and characteristics of each multilayer electronic component can be efficiently measured while each multilayer electronic component is still part of the mother laminate.

Abstract: In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

Abstract: In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

Abstract: In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

Abstract: A method of manufacturing a multilayer electronic component having one major surface which can be completely used as a mounting surface for another electronic component to form a composite component includes the steps of forming a groove in the mother laminate along a cutting line, forming external electrodes on side surfaces of the groove and then dividing the mother laminate along the cutting line to divide the groove thereby forming a plurality of multilayer electronic components that are independent of each other. The method of forming the electronic components allows for measuring electrical characteristics of the individual multilayer electronic components while the components are still part of the mother laminate.