Abstract: A measurement result receiving apparatus receives measurement results transmitted from a plurality of measuring devices, the measurement results obtained by conducting a measurement at a predetermined sampling interval according to a reference clock of each measuring device. The measurement result receiving apparatus includes a receiving section that receives the measurement results from the plurality of measuring devices; and a sampling interval converting section that converts the measurement results into measurement values associated with a common sampling interval.

Abstract: A packaged electronic device includes a substrate comprising a die pad and a lead spaced apart from the die. An electronic device is attached to the die pad top side. A conductive clip is connected to the substrate and the electronic device, and the conductive clip comprises a plate portion attached to the device top side with a conductive material, a clip connecting portion connected to the plate portion and the lead, and channels disposed to extend inward from a lower side of the plate portion above the device top side. The conductive material is disposed within the channels. In another example, the plate portion comprises a lower side having a first sloped profile in a first cross-sectional view such that an outer section of the first sloped profile towards a first edge portion of the plate portion is spaced away from the electronic device further than an inner section of the first sloped profile towards a central portion of the plate portion. Other examples and related methods are also disclosed herein.

Abstract: Provided is a tool wear monitoring device configured to input a plurality of pieces of image data captured with a microscope camera while changing an angle, and to monitor tool wear. The tool wear monitoring device includes a data analysis unit configured to analyze image data. The data analysis unit binarizes the plurality of pieces of image data captured while changing an angle, extracts data in which a worn region has a maximum area among the plurality of pieces of image data, and analyzes the amount of wear from the extracted data with the maximum area.

Abstract: An antenna unit includes a plate-shaped dielectric substrate, as well as an antenna element and a stub element. The dielectric substrate has a first edge extending along a longitudinal direction of the dielectric substrate and a second edge extending along the longitudinal direction of the dielectric substrate, and the second edge is opposite to the first edge. The antenna element is disposed along the longitudinal direction of the dielectric substrate. The Antenna element has a first end containing a feedpoint and a second end containing an open end. The stub element is disposed between a section of the antenna element having a predetermined length containing the first end of the antenna element and the first edge of the dielectric substrate along the longitudinal direction of the dielectric substrate. The stub element has a first end connected to a reference potential and a second end containing an open end.

Abstract: The present invention provides: an aminocoumarin compound having a structure represented by the following formula (1); and an aminocoumarin compound-containing resin particle containing the aminocoumarin compound and a resin particle containing the aminocoumarin compound. In formula (1), Rs each independently represent a hydrogen atom or a methyl group, Q represents a sulfur atom, an oxygen atom, or N—R1, and R1 represents a hydrogen atom or a methyl group. The aminocoumarin compound of the present invention is a fluorescent dye that has a longer excitation wavelength than a conventionally known sulfonated coumarin-based compound and is effectively excited at a wavelength of 475 nm or more, particularly at a wavelength around 500 nm.

Abstract: A multiband compatible antenna that resonates at a first frequency and a second frequency includes: a planar conductor including a feeding portion to which a signal is supplied, a grounding portion, and a slit between the feeding portion and grounding portion. The slit includes a first slit portion extending in a first direction and a second slit portion extending in a second direction intersecting the first direction from an end of the first slit portion. The first slit portion is disposed closer to one edge than a center of the planar conductor in the second direction, and the feeding portion is disposed to a side of the first slit portion closer to the one edge. The planar conductor includes a first element portion and a second frequency portion that resonate at the first frequency and the second frequency, respectively. The second slit portion is disposed in the first element portion.

Abstract: Provided is a tool state detection system capable of improving usability. A tool state detection system that detects a state of a tool attached to a machining device includes: a detection device which is formed separately from a tool holder that holds the tool and is detachably attached to the tool holder, the detection device being configured to detect the state of the tool and output measurement data; and a data analysis device which provided to be communicable with the detection device, the data analysis device being configured to analyze the measurement data from the detection device. As a result, usability for a user is improved since the detection device can be formed separately from the tool holder and be detachably attached to the tool holder.

Abstract: A measurement result receiving apparatus receives measurement results transmitted from a plurality of measuring devices, the measurement results obtained by conducting a measurement at a predetermined sampling interval according to a reference clock of each measuring device. The measurement result receiving apparatus includes a receiving section that receives the measurement results from the plurality of measuring devices; and a sampling interval converting section that converts the measurement results into measurement values associated with a common sampling interval.

Abstract: Information useful for diagnosis or treatment is acquired by quantitatively evaluating the expression levels of each of a plurality of mutually different domains in the same protein in a human tissue slice, by providing: a staining process of using a plurality of staining reagents having mutually different colorings to stain the plurality of different domains in the same protein; a quantifying step of quantifying the expression levels of each of the plurality of domains; and a calculating step of calculating the ratios between the expression levels of the plurality of domains.

Abstract: A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate. The lead frame includes a die mount structure, signal leads, a first shield lead, a second shield lead, and a first shield mount that spans the first and second shield leads. The electronic device can be mounted to the die mount structure and can be coupled to the signal leads. The package body encapsulates the electronic device and the lead frame such that (i) each of the first shield lead, the second shield lead, and the signal leads includes an external portion that extends beyond the exterior surface of the package body, and (ii) the first shield mount extends beyond the exterior surface of the package body. The first shield plate can be coupled to the first shield mount.

Abstract: The present invention provides: an aminocoumarin compound having a structure represented by the following formula (1); and an aminocoumarin compound-containing resin particle containing the aminocoumarin compound and a resin particle containing the aminocoumarin compound. In formula (1), Rs each independently represent a hydrogen atom or a methyl group, Q represents a sulfur atom, an oxygen atom, or N—R1, and R1 represents a hydrogen atom or a methyl group. The aminocoumarin compound of the present invention is a fluorescent dye that has a longer excitation wavelength than a conventionally known sulfonated coumarin-based compound and is effectively excited at a wavelength of 475 nm or more, particularly at a wavelength around 500 nm.

Abstract: An antenna unit includes a plate-shaped dielectric substrate, as well as an antenna element and a stub element. The dielectric substrate has a first edge extending along a longitudinal direction of the dielectric substrate and a second edge extending along the longitudinal direction of the dielectric substrate, and the second edge is opposite to the first edge. The antenna element is disposed along the longitudinal direction of the dielectric substrate. The Antenna element has a first end containing a feedpoint and a second end containing an open end. The stub element is disposed between a section of the antenna element having a predetermined length containing the first end of the antenna element and the first edge of the dielectric substrate along the longitudinal direction of the dielectric substrate. The stub element has a first end connected to a reference potential and a second end containing an open end.

Abstract: An antenna unit includes a plate-shaped dielectric substrate, as well as an antenna element and a stub element. The dielectric substrate has a first edge extending along a longitudinal direction of the dielectric substrate and a second edge extending along the longitudinal direction of the dielectric substrate, and the second edge is opposite to the first edge. The antenna element is disposed along the longitudinal direction of the dielectric substrate. The Antenna element has a first end containing a feedpoint and a second end containing an open end. The stub element is disposed between a section of the antenna element having a predetermined length containing the first end of the antenna element and the first edge of the dielectric substrate along the longitudinal direction of the dielectric substrate. The stub element has a first end connected to a reference potential and a second end containing an open end.

Abstract: A packaged electronic device includes a substrate comprising a die pad and a lead spaced apart from the die. An electronic device is attached to the die pad top side. A conductive clip is connected to the substrate and the electronic device, and the conductive clip comprises a plate portion attached to the device top side with a conductive material, a clip connecting portion connected to the plate portion and the lead, and channels disposed to extend inward from a lower side of the plate portion above the device top side. The conductive material is disposed within the channels. In another example, the plate portion comprises a lower side having a first sloped profile in a first cross-sectional view such that an outer section of the first sloped profile towards a first edge portion of the plate portion is spaced away from the electronic device further than an inner section of the first sloped profile towards a central portion of the plate portion. Other examples and related methods are also disclosed herein.

Abstract: An electronic apparatus includes: a first antenna board having a plate shape and extending with a first length; a second antenna board having a plate shape and extending with a second length; and a rectangular parallelepiped upper casing for accommodating the first antenna board and the second antenna board. The first antenna board and the second antenna board are arranged such that a longitudinal direction of the first antenna board and a longitudinal direction of the second antenna board are parallel to one side of one main surface of the rectangular parallelepiped upper casing. The first antenna board and the second antenna board are arranged parallel to each other.

Abstract: A packaged electronic device includes a substrate comprising a die pad and a lead spaced apart from the die. An electronic device is attached to the die pad top side. A conductive clip is connected to the substrate and the electronic device, and the conductive clip comprises a plate portion attached to the device top side with a conductive material, a clip connecting portion connected to the plate portion and the lead, and channels disposed to extend inward from a lower side of the plate portion above the device top side. The conductive material is disposed within the channels. In another example, the plate portion comprises a lower side having a first sloped profile in a first cross-sectional view such that an outer section of the first sloped profile towards a first edge portion of the plate portion is spaced away from the electronic device further than an inner section of the first sloped profile towards a central portion of the plate portion. Other examples and related methods are also disclosed herein.

Abstract: A semiconductor device includes a lead frame, an electronic device, a package body, and a first shield plate. The lead frame includes a die mount structure, signal leads, a first shield lead, a second shield lead, and a first shield mount that spans the first and second shield leads. The electronic device can be mounted to the die mount structure and can be coupled to the signal leads. The package body encapsulates the electronic device and the lead frame such that (i) each of the first shield lead, the second shield lead, and the signal leads includes an external portion that extends beyond the exterior surface of the package body, and (ii) the first shield mount extends beyond the exterior surface of the package body. The first shield plate can be coupled to the first shield mount.

Abstract: A packaged electronic device includes a substrate comprising a die pad and a lead spaced apart from the die. An electronic device is attached to the die pad top side. A conductive clip is connected to the substrate and the electronic device, and the conductive clip comprises a plate portion attached to the device top side with a conductive material, a clip connecting portion connected to the plate portion and the lead, and channels disposed to extend inward from a lower side of the plate portion above the device top side. The conductive material is disposed within the channels. In another example, the plate portion comprises a lower side having a first sloped profile in a first cross-sectional view such that an outer section of the first sloped profile towards a first edge portion of the plate portion is spaced away from the electronic device further than an inner section of the first sloped profile towards a central portion of the plate portion. Other examples and related methods are also disclosed herein.

Abstract: An antenna unit includes a plate-shaped dielectric substrate, as well as an antenna element and a stub element. The dielectric substrate has a first edge extending along a longitudinal direction of the dielectric substrate and a second edge extending along the longitudinal direction of the dielectric substrate, and the second edge is opposite to the first edge. The antenna element is disposed along the longitudinal direction of the dielectric substrate. The Antenna element has a first end containing a feedpoint and a second end containing an open end. The stub element is disposed between a section of the antenna element having a predetermined length containing the first end of the antenna element and the first edge of the dielectric substrate along the longitudinal direction of the dielectric substrate. The stub element has a first end connected to a reference potential and a second end containing an open end.

Abstract: An electronic apparatus includes: a first antenna board having a plate shape and extending with a first length; a second antenna board having a plate shape and extending with a second length; and a rectangular parallelepiped upper casing for accommodating the first antenna board and the second antenna board. The first antenna board and the second antenna board are arranged such that a longitudinal direction of the first antenna board and a longitudinal direction of the second antenna board are parallel to one side of one main surface of the rectangular parallelepiped upper casing. The first antenna board and the second antenna board are arranged parallel to each other.