Abstract: A semiconductor device includes a die pad including a first surface and a second surface opposite to the first surface, a first chip arranged in a first area on the first surface, the first chip including a first side and a second side crossing to the first side, a second chip arranged in a second area on the first surface, the second chip including a third side and a fourth side crossing to the third side, a plurality of first marks formed on the first surface, the first marks including a third mark and a fourth mark, a plurality of second marks formed on the first surface, the second marks including a fifth mark and sixth mark. The semiconductor device also includes a wire and a resin encapsulating the first chip, the second chip, and the wire.

Abstract: The removal starting position (8S1) of a first removal process and the four removal starting positions (8S21-8S24) in a second removal process are established on an imaginary circle (7I) with a prescribed radius (R) that is inscribed in the apex (7C) of an incomplete thread part (7a). In each removal process, the tip of the screw thread cutting tool shaves off the apex (7C) of the incomplete thread part (7a) into respective recesses, contacting the imaginary inscribed circle (7I) from the outside (above). The multiple cutting surfaces of the apex (7C) are formed in parallel helices (that is, as mutually adjacent helical recesses) from the starting position to the ending position of the incomplete thread part. Points and burrs in the incomplete thread part can thereby be eliminated or reduced without loss of the ability to screw together with a partner threaded fastener (threaded portion).

Abstract: A first base radiation element has a first end connected to the feed point, and a second end. A second base radiation element has a first end connected to the ground point, and a second end. The first and second base radiation elements respectively include portions extending in a first direction and close to each other. The first base radiation element is branched into first and second branch radiation elements at a first branch point located at the second end of the first base radiation element, the first branch radiation element includes a portion extending in the first direction, and the second branch radiation element includes a portion extending in a second direction opposite to the first direction. The end of the second base radiation element is connected to a connecting point different from the first branch point of the first branch radiation element.

Abstract: A method according to the invention has a bonding process of mounting a semiconductor chip on an upper surface of a die pad that has the upper surface whose area is larger than a reverse side of the semiconductor chip. It also has a sealed body formation process of sealing the semiconductor chip so that an undersurface opposite to the upper surface of the die pad may be exposed after the bonding process. Here, the upper surface of the die pad is arranged around an area over which the semiconductor chip is mounted, and has a hollow part arrangement area in which a groove or multiple holes are formed. Moreover, surface roughness of the upper surface is made coarser than surface roughness of the undersurface.

Abstract: A rear surface opposite to one plane of a die pad is formed to be exposed from one plane of a sealing resin. In addition, a concave portion disposed to be parallel with at least a first side of an outermost edge of a central structure and a second side adjacent to the first side, respectively, is formed in the one plane of the sealing resin. Here, a depth of the concave portion is equal to or greater than a height of the outermost edge of the central structure.

Abstract: A semiconductor device includes a die pad including a first surface and a second surface opposite to the first surface, a first chip arranged in a first area on the first surface, the first chip including a first side and a second side crossing to the first side, a second chip arranged in a second area on the first surface, the second chip including a third side and a fourth side crossing to the third side, a plurality of first marks formed on the first surface, the first marks including a third mark and a fourth mark, a plurality of second marks formed on the first surface, the second marks including a fifth mark and sixth mark. The semiconductor device also includes a wire and a resin encapsulating the first chip, the second chip, and the wire.

Abstract: Electronic equipment is provided with a board 24a that includes an antenna circuit for transmitting and receiving a wireless signal and a ground pattern 24c for electrically grounding the antenna circuit, and a second casing 23 formed integrally with an antenna holding portion 23f for holding the board 24a. At least the antenna holding portion 23f in the second casing 23 is formed of a conductor. A clip 40 sandwiches the antenna holding portion 23f and the board 24a in a state where the ground pattern 24c and the antenna holding portion 23f are in contact with each other.

Abstract: A semiconductor device includes a die pad, the die pad including a first surface and a second surface, a first chip arranged on the first surface, the first chip including a first side and a second side crossing to the first side, a second chip arranged on the first surface, a plurality of first recesses formed on the first surface, a plurality of second recesses formed on the first surface, the plurality of second recesses being different from the first plurality of recesses in at least one of size and geometry, a wire, a resin, and a lead, one end of the lead being connected to another end of the wire and a part the lead being encapsulated by the resin. The plurality of first recesses includes a third recess and a fourth recess, and the first chip is arranged in a first area.

Abstract: An information processing unit is configured so that in a case where a display-rotating button 4 or 11b is operated by a user so as to select a second display mode, and where either a communication unit 5 or 13 is in an activated state and the user does not halt the action of the communication unit 5 or 13, the display mode is shifted to a mode other than the second display mode. Thereby, it is possible to urge the user to change the posture of a main body 1.

Abstract: A semiconductor device includes a die pad, the die pad including a first surface and a second surface, a first chip arranged on the first surface, the first chip including a first side and a second side crossing to the first side, a second chip arranged on the first surface, a plurality of first recesses formed on the first surface, a plurality of second recesses formed on the first surface, the plurality of second recesses being different from the first plurality of recesses in at least one of size and geometry, a wire, a resin, and a lead, one end of the lead being connected to another end of the wire and a part the lead being encapsulated by the resin. The plurality of first recesses includes a third recess and a fourth recess, and the first chip is arranged in a first area.

Abstract: A leadframe has a die pad, first marks, and second marks, and the die pad allows thereon mounting of a first semiconductor chip. The first marks indicate a mounting region for the first semiconductor chip, the second marks indicate a mounting region for the second semiconductor chip, and the first marks and the second marks are different from each other in at least either one of size and geometry.

Abstract: A rear surface opposite to one plane of a die pad is formed to be exposed from one plane of a sealing resin. In addition, a concave portion disposed to be parallel with at least a first side of an outermost edge of a central structure and a second side adjacent to the first side, respectively, is formed in the one plane of the sealing resin. Here, a depth of the concave portion is equal to or greater than a height of the outermost edge of the central structure.

Abstract: Disclosed is a nozzle stub working system for a reactor vessel that performs work inside a nozzle stub of the reactor vessel, the nozzle stub working system for the reactor vessel including: a platform unit that is provided at an upper portion inside the reactor vessel and includes a substantially cylindrical side wall portion and a bottom portion blocking the lower end of the side wall portion; an access window that is provided at the side wall portion of the platform unit to allow the inside of the platform unit to communicate with the nozzle stub; an access window moving device that opens and closes the access window; a working device that advances from the inside of the platform unit to the inside of the nozzle stub to perform work inside the nozzle stub; and a control device that is provided at the outside of the reactor vessel and controls the access window moving device and the working device, wherein the control device drives the access window moving device to open the access window, drives the workin

Abstract: An opening and closing device that opens and closes an access port opened from a substantially cylindrical working platform disposed inside a reactor vessel and used to access a nozzle stub of the reactor vessel from the inside of the working platform, the opening and closing device includes: a cover that is slidable along an outer peripheral surface or an inner peripheral surface of the working platform from a closing position where the access port is closed to an opening position where the access port is opened; and moving device for sliding the cover.

Abstract: A weld zone of T-piping and its neighborhood are efficiently laser-heated to remove residual stress. For this purpose, the weld zone of a T-piping (50) is irradiated and heated with a laser beam emitted from a laser head (10) to remove residual stress. At this time, a rotating travel cart (3) travels along a ring rail (2) to adjust the position of the laser head (10) in a ?-direction, a vertical slide (4) slides to adjust the position of the laser head (10) in a Z-direction, a radial slide (5) slides to adjust the position of the laser head (10) in an L-direction, an arcuate piece slide (7) slides along an arcuate piece to adjust the ?-direction of the laser head (10), a laser head support portion (9) turns to adjust the ?-direction of the laser head (10), and oscillation adjusts the position of the laser head (10) in a ?-direction.

Abstract: A GPS antenna is provided with a reflective conductor portion. Thereby, an electromagnetic wave radiated from an antenna conductor portion in a predetermined direction can be grounded electrically, and thus radiation of the electromagnetic wave in a direction (arbitrary direction) opposite to the predetermined direction can be enhanced. As a result, the directivity of the electromagnetic wave in the arbitrary direction can be enhanced to improve the positioning accuracy.

Abstract: An information processing unit is configured so that in a case where a display-rotating button 4 or 11b is operated by a user so as to select a second display mode, and where either a communication unit 5 or 13 is in an activated state and the user does not halt the action of the communication unit 5 or 13, the display mode is shifted to a mode other than the second display mode. Thereby, it is possible to urge the user to change the posture of a main body 1.

Abstract: Electronic equipment is provided with a board 24a that includes an antenna circuit for transmitting and receiving a wireless signal and a ground pattern 24c for electrically grounding the antenna circuit, and a second casing 23 formed integrally with an antenna holding portion 23f for holding the board 24a. At least the antenna holding portion 23f in the second casing 23 is formed of a conductor. A clip 40 sandwiches the antenna holding portion 23f and the board 24a in a state where the ground pattern 24c and the antenna holding portion 23f are in contact with each other.

Abstract: A semiconductor package comprises a conduction member, a semiconductor chip mounted on and electrically connected to the conduction member, and a sealing body configured to seal the conduction member and the semiconductor chip. The conduction member comprises a power supply section configured to supply a power voltage to said semiconductor chip, a ground section configured to supply a ground voltage to the semiconductor chip, and a signal section connected to a signal terminal of the semiconductor chip. The power supply section, the ground section, and the signal section are arranged so as not to overlap each other. At least a part of said ground section is exposed on an under surface of the sealing body. The power supply section comprises an exposed region of which bottom surface is exposed on the under surface, and a plurality of power hanging-pin region configured to extend to a side of the sealing body from the exposed region.

Abstract: A leadframe has a die pad, first marks, and second marks, and the die pad allows thereon mounting of a first semiconductor chip. The first marks indicate a mounting region for the first semiconductor chip, the second marks indicate a mounting region for the second semiconductor chip, and the first marks and the second marks are different from each other in at least either one of size and geometry.