Patents by Inventor Kenji Nishiyama

Kenji Nishiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080160178
    Abstract: A surface acoustic wave device includes a piezoelectric substrate made of LiTaO3 or LiNbO3 having an electromechanical coefficient of about 15% or more, at least one electrode which is disposed on the piezoelectric substrate and which is a laminate film having a metal layer defining a primary metal layer primarily composed of a metal having a density higher than that of Al or an alloy of the metal and a metal layer which is laminated on the primary metal layer and which is composed of another metal, and a first SiO2 layer which is disposed in a remaining area other than that at which the at least one electrode is located and which has a thickness approximately equivalent to that of the electrode. In the surface acoustic wave device described above, the density of the electrode is at least about 1.5 times that of the first SiO2 layer.
    Type: Application
    Filed: December 19, 2007
    Publication date: July 3, 2008
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Kenji NISHIYAMA, Eiichi TAKATA, Takeshi NAKAO, Michio KADOTA
  • Patent number: 7327071
    Abstract: A surface acoustic wave device includes a piezoelectric substrate made of LiTaO3 or LiNbO3 having an electromechanical coefficient of about 15% or more, at least one electrode which is disposed on the piezoelectric substrate and which is a laminate film having a metal layer defining a primary metal layer primarily composed of a metal having a density higher than that of Al or an alloy of the metal and a metal layer which is laminated on the primary metal layer and which is composed of another metal, and a first SiO2 layer which is disposed in a remaining area other than that at which the at least one electrode is located and which has a thickness approximately equivalent to that of the electrode. In the surface acoustic wave device described above, the density of the electrode is at least about 1.5 times that of the first SiO2 layer.
    Type: Grant
    Filed: September 1, 2006
    Date of Patent: February 5, 2008
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kenji Nishiyama, Eiichi Takata, Takeshi Nakao, Michio Kadota
  • Publication number: 20070214622
    Abstract: In a manufacturing method for a SAW apparatus a first insulating layer is formed on the entire surface of a piezoelectric LiTaO3 substrate. By using a resist pattern used for forming an IDT electrode, the first insulating layer in which the IDT electrode is to be formed is removed. An electrode film made of a metal having a density higher than Al or an alloy primarily including such a metal is disposed in the area in which the first insulating layer is removed so as to form the IDT electrode. The resist pattern remaining on the first insulating layer is removed. A second insulating layer is formed to cover the first insulating layer and the IDT electrode.
    Type: Application
    Filed: May 3, 2007
    Publication date: September 20, 2007
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Kenji NISHIYAMA, Takeshi NAKAO, Michio KADOTA
  • Publication number: 20070132339
    Abstract: In a manufacturing method for a SAW apparatus a first insulating layer is formed on the entire surface of a piezoelectric LiTaO3 substrate. By using a resist pattern used for forming an IDT electrode, the first insulating layer in which the IDT electrode is to be formed is removed. An electrode film made of a metal having a density higher than Al or an alloy primarily including such a metal is disposed in the area in which the first insulating layer is removed so as to form the IDT electrode. The resist pattern remaining on the first insulating layer is removed. A second insulating layer is formed to cover the first insulating layer and the IDT electrode.
    Type: Application
    Filed: February 14, 2007
    Publication date: June 14, 2007
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Kenji NISHIYAMA, Takeshi NAKAO, Michio KADOTA
  • Patent number: 7230365
    Abstract: In a manufacturing method for a SAW apparatus a first insulating layer is formed on the entire surface of a piezoelectric LiTaO3 substrate. By using a resist pattern used for forming an IDT electrode, the first insulating layer in which the IDT electrode is to be formed is removed. An electrode film made of a metal having a density higher than Al or an alloy primarily including such a metal is disposed in the area in which the first insulating layer is removed so as to form the IDT electrode. The resist pattern remaining on the first insulating layer is removed. A second insulating layer is formed to cover the first insulating layer and the IDT electrode.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: June 12, 2007
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kenji Nishiyama, Takeshi Nakao, Michio Kadota
  • Publication number: 20060290233
    Abstract: A surface acoustic wave device includes a piezoelectric substrate made of LiTaO3 or LiNbO3 having an electromechanical coefficient of about 15% or more, at least one electrode which is disposed on the piezoelectric substrate and which is a laminate film having a metal layer defining a primary metal layer primarily composed of a metal having a density higher than that of Al or an alloy of the metal and a metal layer which is laminated on the primary metal layer and which is composed of another metal, and a first SiO2 layer which is disposed in a remaining area other than that at which the at least one electrode is located and which has a thickness approximately equivalent to that of the electrode. In the surface acoustic wave device described above, the density of the electrode is at least about 1.5 times that of the first SiO2 layer.
    Type: Application
    Filed: September 1, 2006
    Publication date: December 28, 2006
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Kenji NISHIYAMA, Eiichi TAKATA, Takeshi NAKAO, Michio KADOTA
  • Patent number: 7109634
    Abstract: A surface acoustic wave device with improved reflection characteristics, in which an insulating film is formed so as to cover an electrode film, and the electrode film is made from Al or an Al alloy, includes a piezoelectric substrate, an electrode film which is formed of Al or an alloy including Al as a major component on the piezoelectric substrate and which defines at least one interdigital transducer, and an insulating film arranged on the piezoelectric substrate so as to cover the electrode film, the average density of the electrode film is less than or equal to about 1.5 times the density of the insulating film, wherein the top surface of the insulating film is planarized.
    Type: Grant
    Filed: December 15, 2003
    Date of Patent: September 19, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takeshi Nakao, Kenji Nishiyama, Tetsuya Kimura, Michio Kadota
  • Patent number: 6831112
    Abstract: The present invention relates to polyether compounds, active hydrogen compounds and resin-forming compositions composed of the polyols, and methods for producing foams by employing the active hydrogen components. These polyether compounds have a decreased number of moles of added EO thereby maintaining the hydrophobicity and have sufficient reactivity as polyol components of resins, thereby having high reaction rates. Therefore, it is possible to provide resins having excellent resin properties (tensile strength, flexural strength, water-absorption swelling ratio, etc.).
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: December 14, 2004
    Assignee: Sanyo Chemical Industries, Ltd.
    Inventors: Motonao Kaku, Hidefumi Ohta, Hideo Kitagawa, Kenji Nishiyama, Munekazu Satake, Kunikiyo Yoshio, Koji Tsutsui
  • Publication number: 20040164644
    Abstract: In a manufacturing method for a SAW apparatus a first insulating layer is formed on the entire surface of a piezoelectric LiTaO3 substrate. By using a resist pattern used for forming an IDT electrode, the first insulating layer in which the IDT electrode is to be formed is removed. An electrode film made of a metal having a density higher than Al or an alloy primarily including such a metal is disposed in the area in which the first insulating layer is removed so as to form the IDT electrode. The resist pattern remaining on the first insulating layer is removed. A second insulating layer is formed to cover the first insulating layer and the IDT electrode.
    Type: Application
    Filed: May 30, 2003
    Publication date: August 26, 2004
    Inventors: Kenji Nishiyama, Takeshi Nakao, Michio Kadota
  • Publication number: 20040140734
    Abstract: A surface acoustic wave device with improved reflection characteristics, in which an insulating film is formed so as to cover an electrode film, and the electrode film is made from Al or an Al alloy, includes a piezoelectric substrate, an electrode film which is formed of Al or an alloy including Al as a major component on the piezoelectric substrate and which defines at least one interdigital transducer, and an insulating film arranged on the piezoelectric substrate so as to cover the electrode film, the average density of the electrode film is less than or equal to about 1.5 times the density of the insulating film, wherein the top surface of the insulating film is planarized.
    Type: Application
    Filed: December 15, 2003
    Publication date: July 22, 2004
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Takeshi Nakao, Kenji Nishiyama, Tetsuya Kimura, Michio Kadota
  • Publication number: 20030100623
    Abstract: The present invention relates to polyether compounds, active hydrogen compounds and resin-forming compositions composed of the polyols, and methods for producing foams by employing the active hydrogen components. These polyether compounds have a decreased number of moles of added EO thereby maintaining the hydrophobicity and have sufficient reactivity as polyol components of resins, thereby having high reaction rates. Therefore, it is possible to provide resins having excellent resin properties (tensile strength, flexural strength, water-absorption swelling ratio, etc.).
    Type: Application
    Filed: May 24, 2002
    Publication date: May 29, 2003
    Inventors: Motonao Kaku, Hidefumi Ohta, Hideo Kitagawa, Kenji Nishiyama, Munekazu Satake, Kunikiyo Yoshio, Koji Tsutsui
  • Patent number: 5778365
    Abstract: The present invention provides a file management device for managing a file accessed by a plurality of users which comprises setting means for setting a plurality of attribute values related to a particular attribute of the file, and for setting access rights in accordance with the plurality of attribute values related to the attribute, storing means for storing a result set by the setting means, and changing means for changing the access rights for the file corresponding to attribute values specified in the group of the plurality of attribute values based on the contents stored in the storing means.
    Type: Grant
    Filed: March 15, 1995
    Date of Patent: July 7, 1998
    Assignee: Fuji Xerox Co., Ltd.
    Inventor: Kenji Nishiyama
  • Patent number: D258057
    Type: Grant
    Filed: October 25, 1978
    Date of Patent: January 27, 1981
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mitsuo Takanaga, Yasunobu Nakamura, Kazuhiko Nagata, Kenji Nishiyama
  • Patent number: D264584
    Type: Grant
    Filed: April 24, 1980
    Date of Patent: May 25, 1982
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuhiko Nagata, Kenji Nishiyama, Shinji Makino, Mitsuo Takanaga
  • Patent number: D264585
    Type: Grant
    Filed: April 25, 1980
    Date of Patent: May 25, 1982
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Mitsuo Takanaga, Kazuhiko Nagata, Kenji Nishiyama, Shinji Makino
  • Patent number: D303796
    Type: Grant
    Filed: September 5, 1986
    Date of Patent: October 3, 1989
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Nishiyama, Hanji Takahashi, Yoshitomo Itakura
  • Patent number: D304031
    Type: Grant
    Filed: October 16, 1986
    Date of Patent: October 17, 1989
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kenji Nishiyama, Hanji Takahashi, Yoshitomo Itakura
  • Patent number: D330373
    Type: Grant
    Filed: September 24, 1990
    Date of Patent: October 20, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshitomo Itakura, Kenji Nishiyama, Hanji Takahashi, Sadayoshi Azuma, Toshiyuki Itabashi
  • Patent number: D330374
    Type: Grant
    Filed: September 24, 1990
    Date of Patent: October 20, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshitomo Itakura, Kenji Nishiyama, Hanji Takahashi, Sadayoshi Azuma, Toshiyuki Itabashi
  • Patent number: D330375
    Type: Grant
    Filed: September 24, 1990
    Date of Patent: October 20, 1992
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Yoshitomo Itakura, Kenji Nishiyama, Hanji Takahashi, Sadayoshi Azuma, Toshiyuki Itabashi