Abstract: A method of processing a plate-shaped workpiece that includes on a face side thereof layered bodies containing metal which are formed in superposed relation to projected dicing lines includes the steps of holding a face side of the workpiece on a holding table, thereafter, applying a laser beam having a wavelength that is absorbable by the workpiece to a reverse side thereof along the projected dicing lines to form laser-processed grooves in the workpiece which terminate short of the layered bodies, and thereafter, cutting bottoms of the laser-processed grooves with a cutting blade to sever the workpiece together with the layered bodies along the projected dicing lines. The step of cutting bottoms of the laser-processed grooves includes the step of cutting bottoms of the laser-processed grooves while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

Abstract: A cutting blade for cutting a workpiece includes a base and a cutting edge fixed to a peripheral portion of the base. The cutting edge is formed by bonding a mixture of abrasive grains and photocatalyst particles with a binder. In cutting the workpiece by using the cutting blade, a cutting water is supplied to the cutting blade and light is applied to the cutting blade to excite the photocatalyst particles. The cutting water supplied to the cutting blade comes into contact with the photocatalyst particles excited, so that the cutting water is given an oxidizing power due to hydroxy radicals.

Abstract: A method of processing a plate-shaped workpiece that includes on a reverse side thereof a layered body containing metal which is formed in superposed relation to projected dicing lines includes the steps of holding the reverse side of the workpiece on a holding table, thereafter, applying a laser beam having a wavelength that is absorbable by the workpiece to a face side thereof along the projected dicing lines to form laser-processed grooves in the workpiece which terminate short of the layered body, and thereafter, cutting bottoms of the laser-processed grooves with a cutting blade to sever the workpiece together with the layered body along the projected dicing lines. The step of cutting bottoms of the laser-processed grooves includes the step of cutting bottoms of the laser-processed grooves while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

Abstract: A processing apparatus includes: a holding unit that holds a workpiece; a processing mechanism that processes the workpiece held by the holding unit; a processing liquid supplying mechanism that supplies a processing liquid containing an oxidizing agent to at least the workpiece held by the holding unit at the time of processing the workpiece by the processing means; a processing waste liquid recovery section that recovers a processing waste liquid containing the processing liquid supplied from the processing liquid supplying mechanism to the workpiece; a discharge passage through which the processing waste liquid is discharged from the processing waste liquid recovery section to the outside of the processing apparatus; and a waste liquid treatment mechanism that is disposed in the discharge passage and that decomposes the processing liquid contained in the processing waste liquid while the processing waste liquid flows through the discharge passage.

Abstract: Cutting apparatus includes a chuck table for holding a workpiece, a cutting unit for cutting the workpiece held on the chuck table, and a feeding mechanism for relatively moving the chuck table and the cutting unit. The cutting unit includes a spindle adapted to be rotationally driven, a rotatable cutting blade mounted on the spindle and having a peripheral cutting edge, a cutting water nozzle for supplying a cutting water to the cutting blade, a photocatalyst member provided so as to come into contact with the cutting water supplied from the cutting water nozzle, and a light applying unit for exciting the photocatalyst member to thereby give an oxidizing power due to hydroxy radicals to the cutting water.

Abstract: A method of processing a plate-shaped workpiece that includes layered bodies containing metal which are formed in superposed relation to projected dicing lines, includes the steps of holding the workpiece on a holding table, and thereafter, cutting the workpiece along the projected dicing lines with an annular cutting blade, thereby separating the layered bodies. The cutting blade has a groove defined in a face side or a reverse side of an outer peripheral portion thereof that cuts into the workpiece in the step of cutting the workpiece. The step of cutting the workpiece includes the step of cutting the workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

Abstract: A method of processing a workpiece with a cutting blade, the workpiece having a body of metal disposed in superposed relation to projected dicing lines, including: a first metal burr removing step of moving the cutting blade through first cut grooves while the cutting blade is positioned at such a height that a lowermost end of the cutting blade is lower than an upper end of the body of metal; and a second metal burr removing step of moving the cutting blade through the second cut grooves while the cutting blade is positioned at such a height that the lowermost end of the cutting blade is lower than the upper end of the body of metal. A liquid containing an organic acid and an oxidizing agent is supplied to the workpiece in the first metal burr removing step and the second metal burr removing step.

Abstract: A grinding apparatus includes a table that holds a workpiece, and a grinding unit including a grinding wheel mounted to a spindle. The grinding wheel has a grindstone formed by binding abrasive grains with a bonding agent. In addition, the grinding apparatus further includes: a supply unit that supplies grinding water to at least the grindstone when grinding the workpiece; and a light applying unit that is disposed adjacent to the table and that applies light to a grinding surface of the grindstone grinding the workpiece held by the table. The light applying unit includes a light emission section that emits light, and a diffusion preventive wall that surrounds the light emission section and prevents diffusion of the light.

Abstract: A grinding apparatus includes a table that holds a workpiece, and a grinding unit including a grinding wheel mounted to a spindle. The grinding wheel has a grindstone formed by binding abrasive grains with a bonding agent. In addition, the grinding apparatus further includes: a grinding water supply unit that supplies grinding water to at least the grindstone; a light applying unit that is disposed adjacent to the table and that applies light to a grinding surface of the grindstone grinding the workpiece held by the table; and a light applying unit moving section by which the light applying unit can be positioned at a first position on a rotational trajectory of the grinding wheel in the case where the grinding wheel has a first diameter and a second position on a rotational trajectory of the grinding wheel in the case where the grinding wheel has a second diameter.

Abstract: A grinding apparatus includes: a holding table for holding a workpiece thereon; a grinding unit including a grinding wheel for grinding the workpiece held on the holding table, the grinding wheel including a grinding stone made of abrasive grains and grains of photocatalyst bonded by a vitrified bonding material; a grinding water supply unit configured to supply grinding water to the grinding stone when the workpiece held on the holding table is ground by the grinding unit; and a light applying unit disposed adjacent to the holding table and configured to apply light to a grinding surface of the grinding stone while the workpiece held on the holding table being ground.

Abstract: A method of processing a workpiece with a cutting blade, the workpiece having a body of metal disposed in superposed relation to projected dicing lines, including: a first metal burr removing step of moving the cutting blade through first cut grooves while the cutting blade is positioned at such a height that a lowermost end of the cutting blade is lower than an upper end of the body of metal; and a second metal burr removing step of moving the cutting blade through the second cut grooves while the cutting blade is positioned at such a height that the lowermost end of the cutting blade is lower than the upper end of the body of metal. A liquid containing an organic acid and an oxidizing agent is supplied to the workpiece in the first metal burr removing step and the second metal burr removing step.

Abstract: A method for processing a plate-shaped workpiece having a division line and a metal member formed on the division line or in an area corresponding to the division line includes a holding step of holding the plate-shaped workpiece on a chuck table where the metal member is exposed, a first cutting step of cutting the plate-shaped workpiece along the division line by using a first cutting blade after performing the holding step, thereby forming a first cut groove dividing the metal member, and a second cutting step of cutting the plate-shaped workpiece along the first cut groove by using a second cutting blade after performing the first cutting step, thereby forming a second cut groove fully cutting the plate-shaped workpiece. The first cutting step includes the step of supplying a cutting fluid containing an organic acid and an oxidizing agent to the plate-shaped workpiece.

Abstract: A method of processing a plate-shaped workpiece that includes layered bodies containing metal which are formed in superposed relation to projected dicing lines, includes the steps of holding the workpiece on a holding table, and thereafter, cutting the workpiece along the projected dicing lines with an annular cutting blade, thereby separating the layered bodies. The cutting blade has a groove defined in a face side or a reverse side of an outer peripheral portion thereof that cuts into the workpiece in the step of cutting the workpiece. The step of cutting the workpiece includes the step of cutting the workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

Abstract: A plate-shaped workpiece includes a layered body containing metal which is formed in superposed relation to projected dicing lines. The workpiece is processed by holding a layered body side of the workpiece on a first holding table, thereafter, dry etching the workpiece through a mask disposed in areas that are exclusive of the projected dicing lines to form etched grooves along the projected dicing lines in a manner to leave the layered body unremoved, thereafter, holding the layered body side or an opposite side on a second holding table, and thereafter, cutting bottoms of the etched grooves with a cutting blade to sever the workpiece and the layered body along the projected dicing lines. The bottoms of the etched grooves are cut while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

Abstract: A method of processing a plate-shaped workpiece that includes layered bodies containing metal which are formed in superposed relation to projected dicing lines, includes the steps of holding the workpiece on a holding table, and thereafter, cutting the workpiece along the projected dicing lines with an annular cutting blade, thereby separating the layered bodies. The cutting blade has a slit which is open at an outer peripheral edge thereof. The step of cutting the workpiece includes the step of cutting the workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

Abstract: A processing method for processing a plate-shaped workpiece having a division line on the front side and a multilayer member containing metal formed on the back side is provided. The processing method includes a holding step of holding the front side of the workpiece on a holding table in the condition where the multilayer member formed on the back side of the workpiece is exposed, a cutting step of cutting the workpiece along the division line by using a cutting blade after performing the holding step, thereby forming a cut groove dividing the multilayer member, and a laser processing step of applying a laser beam to the workpiece along the cut groove after performing the cutting step. The cutting step includes the step of supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

Abstract: A method of processing a plate-shaped workpiece that includes on a reverse side thereof a layered body containing metal which is formed in superposed relation to projected dicing lines includes the steps of holding the reverse side of the workpiece on a holding table, thereafter, applying a laser beam having a wavelength that is absorbable by the workpiece to a face side thereof along the projected dicing lines to form laser-processed grooves in the workpiece which terminate short of the layered body, and thereafter, cutting bottoms of the laser-processed grooves with a cutting blade to sever the workpiece together with the layered body along the projected dicing lines. The step of cutting bottoms of the laser-processed grooves includes the step of cutting bottoms of the laser-processed grooves while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

Abstract: A method of processing a plate-shaped workpiece that includes layered bodies containing metal which are formed in superposed relation to projected dicing lines includes the steps of holding the workpiece on a first holding table such that the layered bodies are exposed, thereafter, cutting the workpiece along the projected dicing lines with a cutting blade to form cut grooves that sever the layered bodies, thereafter, holding the workpiece on a second holding table such that a mask disposed in areas that are exclusive of the projected dicing lines is exposed, and thereafter, performing dry etching on the workpiece through the mask to sever the workpiece along the projected dicing lines. The step of cutting the workpiece includes the step of cutting the workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

Abstract: A processing method for processing a plate-shaped workpiece having a division line on the front side and a multilayer member containing metal on the division line is provided. The processing method includes a holding step of holding the back side of the workpiece on a holding table in the condition where the multilayer member formed on the division line is exposed, a cutting step of cutting the workpiece along the division line by using a cutting blade after performing the holding step, thereby forming a cut groove dividing the multilayer member, and a laser processing step of applying a laser beam to the workpiece along the cut groove after performing the cutting step. The cutting step includes the step of supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

Abstract: A method of processing a plate-shaped workpiece that includes on a face side thereof layered bodies containing metal which are formed in superposed relation to projected dicing lines includes the steps of holding a face side of the workpiece on a holding table, thereafter, applying a laser beam having a wavelength that is absorbable by the workpiece to a reverse side thereof along the projected dicing lines to form laser-processed grooves in the workpiece which terminate short of the layered bodies, and thereafter, cutting bottoms of the laser-processed grooves with a cutting blade to sever the workpiece together with the layered bodies along the projected dicing lines. The step of cutting bottoms of the laser-processed grooves includes the step of cutting bottoms of the laser-processed grooves while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.