Abstract: A method of processing a plate-shaped workpiece that includes layered bodies containing metal which are formed in superposed relation to projected dicing lines, includes the steps of holding the workpiece on a holding table, and, thereafter, cutting the workpiece along the projected dicing lines with an annular cutting blade, thereby separating the layered bodies. The cutting blade has a plurality of through holes defined in an outer peripheral portion thereof that cuts into the workpiece and extending through the cutting blade from a face side to a reverse side thereof, but not open at an outer peripheral edge thereof. The step of cutting the workpiece includes the step of cutting the workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

Abstract: A method for processing a plate-shaped workpiece having a division line and a metal member formed on the division line or in an area corresponding to the division line includes a holding step of holding the workpiece on a chuck table with the metal member oriented downward, a first cutting step of cutting the workpiece along the division line by using a first cutting blade, thereby forming a first cut groove having a bottom not reaching the metal member, and a second cutting step of cutting the workpiece along the first cut groove by using a second cutting blade, thereby forming a second cut groove fully cutting the workpiece along the division line so as to divide the metal member. The second cutting step includes supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

Abstract: Disclosed herein is a grinding wheel including an annular wheel base and a plurality of grinding stones fixed to an outer circumferential portion of the lower end of the annular wheel base. Each of the grinding stones is made of a mixture of abrasive grains and photocatalytic particles which are held together by a binder. The abrasive grains are diamond abrasive grains, and the photocatalytic particles are titanium oxide (TiO2) particles.

Abstract: Disclosed herein is a grinding wheel including an annular wheel base and a plurality of grinding stones fixed to an outer circumferential portion of the lower end of the annular wheel base. Each of the grinding stones is made of a mixture of abrasive grains and photocatalytic particles which are held together by a binder. The abrasive grains are diamond abrasive grains, and the photocatalytic particles are titanium oxide (TiO2) particles.

Abstract: Disclosed herein is a cutting apparatus including a chuck table for holding a workpiece, a cutting unit for cutting the workpiece held on the chuck table, and a feeding mechanism for relatively moving the chuck table and the cutting unit. The cutting unit includes a spindle adapted to be rotationally driven, a rotatable cutting blade mounted on the spindle and having a peripheral cutting edge, a cutting water nozzle for supplying a cutting water to the cutting blade, a photocatalyst member provided so as to come into contact with the cutting water supplied from the cutting water nozzle, and a light applying unit for exciting the photocatalyst member to thereby give an oxidizing power due to hydroxy radicals to the cutting water.

Abstract: A cutting blade for cutting a workpiece is disclosed. The cutting blade includes a base and a cutting edge fixed to a peripheral portion of the base. The cutting edge is formed by bonding a mixture of abrasive grains and photocatalyst particles with a binder. In cutting the workpiece by using the cutting blade, a cutting water is supplied to the cutting blade and light is applied to the cutting blade to excite the photocatalyst particles. The cutting water supplied to the cutting blade comes into contact with the photocatalyst particles excited, so that the cutting water is given an oxidizing power due to hydroxy radicals.

Abstract: A cutting method for cutting by a cutting blade a workpiece which includes metal at least in a predetermined cutting position. The cutting method includes a cutting step of cutting by the cutting blade the predetermined cutting position of the workpiece while supplying a cutting fluid, containing an organic acid and an oxidizing agent, to a processing point at which the cutting blade cuts into the workpiece.

Abstract: A cutting method for cutting by a cutting blade a workpiece which includes metal at least in a predetermined cutting position. The cutting method includes a cutting step of cutting by the cutting blade the predetermined cutting position of the workpiece while supplying a cutting fluid, containing an organic acid and an oxidizing agent, to a processing point at which the cutting blade cuts into the workpiece.

Abstract: A method of processing a workpiece which includes metal in a work surface by a processing unit including a grindstone or a polishing pad includes a processing step of grinding or polishing the workpiece by the processing unit while supplying a processing fluid to the work surface of the workpiece. The processing fluid contains an organic acid and an oxidizing agent.

Abstract: The invention provides a metal polishing liquid comprising an oxidizing agent and colloidal silica in which a part of a surface of the colloidal silica is covered with aluminum atoms, and a Chemical Mechanical Polishing method using the same. An amino acid, a compound having an isothiazoline-3-one skeleton, an organic acid, a passivated film forming agent, a cationic surfactant, a nonionic surfactant, and a water-soluble polymer may be contained. A metal polishing liquid which is used in Chemical Mechanical Polishing in manufacturing of a semiconductor device, attains low dishing of a subject to be polished, and can perform polishing excellent in in-plane uniformity of a surface to be polished.

Abstract: According to an aspect of the invention, there is provided a polishing liquid for polishing a barrier metal material on an interlayer insulation material, the polishing liquid having a pH of from 2.0 to 6.0 and including an aqueous solution containing a compound represented by the following formula (1), and polishing particles containing silicon oxide and dispersed in the aqueous solution: R1—(CH2)m—(CHR2)n—COOH (1) wherein m+n?4; R1 represents a hydrogen atom, a methyl group, an ethyl group or a hydroxyl group; R2 represents a methyl group, an ethyl group, a benzene ring or a hydroxyl group; and when a plurality of R2s are present in the formula (1), they are the same or different from one another.

Abstract: A polishing composition comprises: at least one compound selected from tetrazole compounds and derivatives thereof and anthranilic acid compounds and derivatives thereof; abrasive particles comprising associative abrasive particles; and an oxidizing agent.

Abstract: The invention provides a metal polishing liquid comprising an oxidizing agent and colloidal silica in which a part of a surface of the colloidal silica is covered with aluminum atoms, and a Chemical Mechanical Polishing method using the same. An amino acid, a compound having an isothiazoline-3-one skeleton, an organic acid, a passivated film forming agent, a cationic surfactant, a nonionic surfactant, and a water-soluble polymer may be contained. A metal polishing liquid which is used in Chemical Mechanical Polishing in manufacturing of a semiconductor device, attains low dishing of a subject to be polished, and can perform polishing excellent in in-plane uniformity of a surface to be polished.

Abstract: According to an aspect of the invention, there is provided a polishing liquid for polishing a barrier layer of a semiconductor integrated circuit, the polishing liquid including colloidal silica covered at a portion of a surface thereof with aluminum, and an oxidizing agent, wherein the polishing liquid has a pH of from 2 to 7.

Abstract: According to an aspect of the invention, there is provided a polishing liquid for polishing a barrier metal material on an interlayer insulation material, the polishing liquid having a pH of from 2.0 to 6.0 and including an aqueous solution containing a compound represented by the following formula (1), and polishing particles containing silicon oxide and dispersed in the aqueous solution: R1—(CH2)m—(CHR2)n—COOH (1) wherein m+n?4; R1 represents a hydrogen atom, a methyl group, an ethyl group or a hydroxyl group; R2 represents a methyl group, an ethyl group, a benzene ring or a hydroxyl group; and when a plurality of R2s are present in the formula (1), they are the same or different from one another.

Abstract: A polishing composition comprises: at least one compound selected from tetrazole compounds and derivatives thereof and anthranilic acid compounds and derivatives thereof; abrasive particles comprising associative abrasive particles; and an oxidizing agent.

Abstract: A polishing compound containing cocoon-shaped silica particles and crystal silica particles, and water-soluble polymers including; at least one type selected from the groups including ammonium nitrate and ammonium acetate, and at least one type selected from methylcellulose, carboxymethylcellulose, hydroxyethylcellulose, and the group including carboxymethylcellulose.

Abstract: A polishing compound containing cocoon-shaped silica particles and crystal silica particles, and water-soluble polymers including; at least one type selected from the groups including ammonium nitrate and ammonium acetate, and at least one type selected from methylcellulose, carboxymethylcellulose, hydroxyethylcellulose, and the group including carboxymethylcellulose.

Abstract: A process for producing uridine diphosphate-N-acetylglucosamine (UDPAG) from uridylic acid (UMP) and N-acetylglucosamine by use of microorganism cells, characterized by adding N-acetylglucosamine kinase thereto. According to the present invention, UDPAG can be efficiently produced even when N-acetylglucosamine is used as a substrate.

Abstract: A process for preparing a sugar nucleotide from a nucleotide by using a yeast cell, characterized in that both a nucleoside diphosphate-sugar pyrophosphorylase and a sugar 1-phosphate are present in the reaction system. According to this process, various sugar nucleotides, which have been prepared only in low productivity by the conventional yeast cell process, can be efficiently prepared.