Abstract: A power amplifier circuit that includes an external input terminal and an external output terminal; a first power amplifier, a second power amplifier, a third power amplifier, and a fourth power amplifier; a transformer including an input-side coil and an output-side coil; and a first transmission line, the external input terminal being connected to an input terminal of the first and second power amplifiers, an output terminal of the first power amplifier is connected to an input terminal of the third and fourth power amplifiers, output terminals of the third and fourth power amplifiers being connected to a first and second end of the input-side coil respectively, the external output terminal being connected to a first end of the output-side coil, and an output terminal of the second power amplifier being connected to a second end of the output-side coil via the first transmission line.

Abstract: Provided is a fiber-reinforced resin bolt having a strength higher than that of a conventional fiber-reinforced resin bolt. A fiber-reinforced resin bolt 1 formed by a winding step of winding a CFRP resin tape 14, which is formed in a band shape by integrating CFRP 12 with a thermosetting resin in such a manner that the CFRP 12 is oriented in a longitudinal direction, so that the CFRP 12 is arranged concentrically around a winding axis, thereby forming a CFRP resin tape layer 10; and a curing step of placing the CFRP resin tape layer 10 formed by the winding step in a die 40 whose inner wall surface is formed with a screw shape, pressurizing the die 40 in which the CFRP resin tape layer 10 is placed from one direction of the winding axis to the other, and heating the die 40 with a heater 82, thereby curing the resin containing the CFRP resin tape layer 10.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell, a read circuit, a correcting circuit and a write circuit. The read circuit is configured to read first data from the memory cell by receiving a first command. The correcting circuit is configured to generate second data by correcting an error included in the first data. The write circuit is configured to write the second data to the memory cell in response to receiving a second command.

Abstract: According to one embodiment, a semiconductor memory device includes a memory cell, a read circuit, a correcting circuit and a write circuit. The read circuit is configured to read first data from the memory cell by receiving a first command. The correcting circuit is configured to generate second data by correcting an error included in the first data. The write circuit is configured to write the second data to the memory cell in response to receiving a second command.

Abstract: A nonvolatile random access memory including a memory cell array including banks, each bank including rows; an address latch circuit; and a control circuit receiving a first set of signals including a precharge command and a first row address, and a second set of signals including an active command and a second row address. The control circuit executes a first operation in which one of the banks is deactivated when the first set of signals is loaded, executes a second operation in which the first row address is loaded when the first set of signals is loaded, and executes a third operation in which at least one of the rows in the bank is selected and activated based on the second row address when the second set of signals is loaded after the first set of signals.

Abstract: A nonvolatile random access memory including a memory cell array including banks, each bank including rows; an address latch circuit; and a control circuit receiving a first set of signals including a precharge command and a first row address, and a second set of signals including an active command and a second row address. The control circuit executes a first operation in which one of the banks is deactivated when the first set of signals is loaded, executes a second operation in which the first row address is loaded when the first set of signals is loaded, and executes a third operation in which at least one of the rows in the bank is selected and activated based on the second row address when the second set of signals is loaded after the first set of signals.

Abstract: According to one embodiment, a memory includes a memory cell array with banks, each bank including rows, a first word lines provided in corresponding to the rows, an address latch circuit which latches a first row address signal, a row decoder which activates one of the first word lines, and a control circuit which is configured to execute a first operation which activates one of the banks based on a bank address signal when a first command is loaded, and a second operation which latches the first row address signal in the address latch circuit, and execute a third operation which activates one of the first word lines by the row decoder based on a second row address signal and the first row address signal latched in the address latch circuit when a second command is loaded after the first command.

Abstract: According to one embodiment, a memory includes a memory cell array with banks, each bank including rows, a first word lines provided in corresponding to the rows, an address latch circuit which latches a first row address signal, a row decoder which activates one of the first word lines, and a control circuit which is configured to execute a first operation which activates one of the banks based on a bank address signal when a first command is loaded, and a second operation which latches the first row address signal in the address latch circuit, and execute a third operation which activates one of the first word lines by the row decoder based on a second row address signal and the first row address signal latched in the address latch circuit when a second command is loaded after the first command.

Abstract: According to one embodiment, a memory includes a memory cell array with banks, each bank including rows, a first word lines provided in corresponding to the rows, an address latch circuit which latches a first row address signal, a row decoder which activates one of the first word lines, and a control circuit which is configured to execute a first operation which activates one of the banks based on a bank address signal when a first command is loaded, and a second operation which latches the first row address signal in the address latch circuit, and execute a third operation which activates one of the first word lines by the row decoder based on a second row address signal and the first row address signal latched in the address latch circuit when a second command is loaded after the first command.

Abstract: According to one embodiment, a memory includes a memory cell array with banks, each bank including rows, a first word lines provided in corresponding to the rows, an address latch circuit which latches a first row address signal, a row decoder which activates one of the first word lines, and a control circuit which is configured to execute a first operation which activates one of the banks based on a bank address signal when a first command is loaded, and a second operation which latches the first row address signal in the address latch circuit, and execute a third operation which activates one of the first word lines by the row decoder based on a second row address signal and the first row address signal latched in the address latch circuit when a second command is loaded after the first command.

Abstract: According to one embodiment, a magnetic memory includes a magnetoresistive element includes a fixed layer whose magnetization direction is fixed, a recording layer whose magnetization direction is variable and a nonmagnetic layer disposed between the fixed layer and the recording layer. A direction of a read current is set to a first direction in a case where an expression of MR ratio ?|Ic+/Ic?|?1 is satisfied if a critical current of the first direction used to write the magnetoresistive element to the parallel state is set to Ic? and a critical current of a second direction used to write the magnetoresistive element to the anti-parallel state is set to Ic+.

Abstract: A memory according to an embodiment includes bit lines, word lines, source lines, magnetic tunnel junction elements and transistors that are serially connected between the bit lines and the source lines, respectively, and a sense amplifier that detects data stored in the magnetic tunnel junction elements. The semiconductor storage device includes multiplexers between the bit lines and the sense amplifier in order to select one of the bit lines to be connected to the sense amplifier, and write amplifiers that are located corresponding to memory cell blocks each of which includes memory cells each including the magnetic tunnel junction element and the transistor and are connected to the bit lines or connected via the multiplexers to the bit lines. To write data, the sense amplifier applies a write voltage to the bit lines and then the write amplifiers hold the write voltage.

Abstract: According to one embodiment, a semiconductor memory device includes a variable resistance element configured to store data “0” and data “1” in accordance with a change in resistance value, a current generator configured to generate a reference current for determining data of the variable resistance element, and having an admittance middle between an admittance of a variable resistance element storing data “0” and an admittance of a variable resistance element storing data “1”, and a sense amplifier includes a first input terminal connected to the variable resistance element and a second input terminal connected to the current generator, and configured to compare currents of the first input terminal and the second input terminal.

Abstract: According to one embodiment, a magnetic memory includes a magnetoresistive effect element including a first magnetic layer invariable in magnetization direction, a second magnetic layer variable in magnetization direction, and an intermediate layer between the first magnetic layer and the second magnetic layer, an error detecting and correcting circuit which detects whether first data in the magnetoresistive effect element includes any error and which outputs error-corrected second data when the first data includes an error, a writing circuit which generates one of the first write current including a first pulse width and the second write current including a second pulse width greater than the first pulse width, and a control circuit which controls the writing circuit to pass the second write current through the magnetoresistive effect element when the second data is written into the magnetoresistive effect element.

Abstract: A resistance change memory of an aspect of the present invention including memory cells including resistance change memory element, word lines connected to the memory cells, a row decoder which activates the word lines, redundant cells used instead of defective cells, a redundant word line connected to redundant cells, a redundant row decoder which activates the redundant word line, a control circuit in which defect address information indicating the word line connected to the defective cell is stored and which remedies the defective cell, and regions provided in a memory cell array and a redundant cell array and identified based on column address information, wherein the control circuit replaces a part of the word line connected to the defective cell with a part of the redundant word line in accordance with each of the regions, and allows the redundant row decoder to activate the replaced redundant word line.

Abstract: A resistance change memory device includes memory cells including two transistors connected in parallel between a first node and a connecting node and a variable resistance element whose one end is connected to the connecting node. The first node of each memory cell and a second node, which is the other end of the variable resistance element of the memory cell, are connected to different bit lines. The first node of a one memory cell and the first node of another memory cell which is adjacent on a first side along the second axis to the one memory are connected to the same bit line. The second node of the one memory cell and the second node of still another memory cell which is adjacent on a second side along the second axis to the one memory cell are connected to the same bit line.

Abstract: According to one embodiment, a resistance-change memory includes memory cells between a bit line and a source line, each of the memory cells including a memory element and a cell transistor having a gate connected to a word line, an n-channel transistor having a gate to which a first control voltage is applied, and a current path connected to the bit line, and a p-channel transistor having a gate to which a second control voltage is applied, and a current path connected to the source line. When the memory cell is read, the potential of the bit line is controlled by the first control voltage, and the potential of the source line is controlled by the second control voltage.

Abstract: A resistance change memory includes two memory cell arrays each including a plurality of memory cells, the memory cells including variable resistive elements, two reference cell arrays provided to correspond to the two memory cell arrays, respectively, and each including a plurality of reference cells, the reference cells having a reference value, and a sense amplifier shared by the two memory cell arrays and detecting data in an accessed memory cell by use of a reference cell array corresponding to a second memory cell array different from a first memory cell array including the accessed memory cell. In reading the data, a particular reference cell in one reference cell array is always activated for an address space based on one memory cell array as a unit.

Abstract: A memory according to an embodiment includes bit lines, word lines, source lines, magnetic tunnel junction elements and transistors that are serially connected between the bit lines and the source lines, respectively, and a sense amplifier that detects data stored in the magnetic tunnel junction elements. The semiconductor storage device includes multiplexers between the bit lines and the sense amplifier in order to select one of the bit lines to be connected to the sense amplifier, and write amplifiers that are located corresponding to memory cell blocks each of which includes memory cells each including the magnetic tunnel junction element and the transistor and are connected to the bit lines or connected via the multiplexers to the bit lines. To write data, the sense amplifier applies a write voltage to the bit lines and then the write amplifiers hold the write voltage.

Abstract: According to one embodiment, a semiconductor memory device includes a variable resistance element configured to store data “0” and data “1” in accordance with a change in resistance value, a current generator configured to generate a reference current for determining data of the variable resistance element, and having an admittance middle at a level in between an admittance of a variable resistance element storing data “0” and an admittance of a variable resistance element storing data “1”, and a sense amplifier includes a first input terminal connected to the variable resistance element and a second input terminal connected to the current generator, and configured to compare currents of the first input terminal and the second input terminal.