Patents by Inventor Kenji Yamashita

Kenji Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11016758
    Abstract: Proposal of data analysis components is enabled to be performed irrespective of the quantity of an implementation history of data analysis, and thus efficiency and cost reduction of production of software for data analysis are promoted. A data utilization platform server 101 is configured to includes a arithmetic device 112 which executes processing of generating analysis relationship information prescribing linkage between analysis target data and an analysis component executing analysis processing for the analysis target table on the basis of a relationship among a plurality pieces of the analysis target data collected from a plurality of predetermined systems; and processing of specifying a combination of a plurality of the analysis components available for predetermined data designated as an analysis target by a user on the basis of the analysis relationship information.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: May 25, 2021
    Assignee: HITACHI, LTD.
    Inventors: Hidenori Yamamoto, Takeshi Handa, Yuko Yamashita, Kenji Kawasaki, Syuuichirou Sakikawa, Takashi Tsuno
  • Patent number: 10971351
    Abstract: Example features relate to a method of polishing a chamfered wafer surface, the method including beveling a wafer to generate the chamfered wafer surface, the chamfered wafer surface being inclined with respect to a main wafer surface by an angle ?; and polishing the chamfered wafer surface with a polishing pad, a polishing surface of the polishing pad being inclined with respect to the chamfered wafer surface by an angle ?; wherein the angle ? is equal to or smaller than the angle ?. Example features relate to a system for polishing the chamfered surface, the system including a polishing pad mounting jig configured to polish the chamfered surface, an angle ? being defined between the chamfered surface and the main surface; and a polishing pad in contact with the chamfered surface at an angle ? during polishing; wherein the angle ? is smaller than the angle ?.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: April 6, 2021
    Assignee: SUMCO CORPORATION
    Inventor: Kenji Yamashita
  • Publication number: 20200403550
    Abstract: A motor controller includes: a rotation speed measurement portion that measures a rotation speed of a motor; and an energization method switching portion that switches an energization method so that the motor is driven by a 120-degree energization method when a rotation speed of the motor measured by the rotation speed measurement portion is less than or equal to a predetermined threshold value, and the motor is driven by a 150-degree energization method when a rotation speed of the motor measured by the rotation speed measurement portion exceeds the predetermined threshold value.
    Type: Application
    Filed: June 18, 2020
    Publication date: December 24, 2020
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventors: Hiroyuki MIYAMOTO, Kenji YAMASHITA
  • Patent number: 10715061
    Abstract: A motor control device includes: a PWM controller that PWM-controls an inverter driving a three-phase motor and including three arm portions, each including a high-side switching element and a low-side switching element connected in series with each other between a first power supply line and a second power supply line connected to a potential lower than a potential of the first power supply line. In an energizing period and a non-energizing period in a case where the three-phase motor is energized from the first power supply line through the PWM-control of the inverter, during a first predetermined period in the energizing period immediately before transition from the energizing period to the non-energizing period, the PWM controller performs a SWEEP of a signal applied to one of the high-side switching element and the low-side switching element, and performs a synchronous rectification control.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: July 14, 2020
    Assignee: AISIN SEIKI KABUSHIKI KAISHA
    Inventor: Kenji Yamashita
  • Publication number: 20200151711
    Abstract: A computer-implemented method includes: obtaining, by a computing device, an original Personal Account Number (PAN) to be transformed; transforming, by the computing device, the original PAN to form a transformed PAN; performing, by the computing device, a verification on the transformed PAN; determining, by the computing device, whether the transformed PAN passes verification; and storing or outputting, by the computing device, the transformed PAN based on determining that the transformed PAN does not pass verification, wherein the original PAN is later recovered from the transformed PAN to process a transaction.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 14, 2020
    Inventors: Kensuke HASHIMOTO, Kenji YAMASHITA, Masaya YAMADA, Hideki SHIBATA, Kohji HORII
  • Publication number: 20200090923
    Abstract: Example features relate to a method of polishing a chamfered wafer surface, the method including beveling a wafer to generate the chamfered wafer surface, the chamfered wafer surface being inclined with respect to a main wafer surface by an angle ?; and polishing the chamfered wafer surface with a polishing pad, a polishing surface of the polishing pad being inclined with respect to the chamfered wafer surface by an angle ?; wherein the angle ? is equal to or smaller than the angle ?. Example features relate to a system for polishing the chamfered surface, the system including a polishing pad mounting jig configured to polish the chamfered surface, an angle ? being defined between the chamfered surface and the main surface; and a polishing pad in contact with the chamfered surface at an angle ? during polishing; wherein the angle ? is smaller than the angle ?.
    Type: Application
    Filed: September 13, 2019
    Publication date: March 19, 2020
    Applicant: SUMCO CORPORATION
    Inventor: Kenji YAMASHITA
  • Patent number: 10553420
    Abstract: A method includes: polishing a semiconductor wafer by a polishing device; measuring a form of the semiconductor wafer by a measuring device before a polished surface of the semiconductor wafer becomes hydrophilic; and setting polishing conditions for the polishing based on a measurement result of the form of the semiconductor wafer by a polishing condition setting unit.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: February 4, 2020
    Assignee: SUMCO TECHXIV CORPORATION
    Inventor: Kenji Yamashita
  • Publication number: 20190348932
    Abstract: A motor control device includes: a PWM controller that PWM-controls an inverter driving a three-phase motor and including three arm portions, each including a high-side switching element and a low-side switching element connected in series with each other between a first power supply line and a second power supply line connected to a potential lower than a potential of the first power supply line. In an energizing period and a non-energizing period in a case where the three-phase motor is energized from the first power supply line through the PWM-control of the inverter, during a first predetermined period in the energizing period immediately before transition from the energizing period to the non-energizing period, the PWM controller performs a SWEEP of a signal applied to one of the high-side switching element and the low-side switching element, and performs a synchronous rectification control.
    Type: Application
    Filed: April 12, 2019
    Publication date: November 14, 2019
    Applicant: AISIN SEIKI KABUSHIKI KAISHA
    Inventor: Kenji YAMASHITA
  • Patent number: 10378827
    Abstract: A heat exchanger includes: the pair of the oil holes being positioned on an outer edge of one of the core plates, being positioned at symmetrical positions with respect to the center of the one of the core plates to sandwich the center of the one of the core plates, and being positioned to sandwich one of the fin plates along the first reference line, and the pair of the coolant holes being positioned on the outer edge of the one of the core plates, being positioned at symmetrical positions with respect to the center of the one of the core plates to sandwich the center of the one of the core plates, and being positioned to sandwich the one of the fin plates along the first reference line.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: August 13, 2019
    Assignee: MAHLE FILTER SYSTEMS JAPAN CORPORATION
    Inventors: Masahiro Ariyama, Satoshi Suzuki, Takuma Shibata, Kenji Yamashita, Katsuhiro Isoda, Yuki Koshiba
  • Patent number: 10281222
    Abstract: A heat exchanger includes: each of the fin plates having a V shaped or trapezoid corrugated shape, and including top walls positioned at top portions of the corrugated shape, bottom walls positioned at bottom portions of the corrugated shape, and foot portions each connecting one of the top walls and one of the bottom walls, each of the foot portions having a rectangular corrugated shape along one of the top walls and one of the bottom walls, and including stepped walls formed at a predetermined interval along the one of the top walls and the one of the bottom walls, and opening portions each formed in one of the stepped walls, and being an elongated through holes having a width equal to or smaller than a thickness of one of the fin plates.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: May 7, 2019
    Assignee: MAHLE FILTER SYSTEMS JAPAN CORPORATION
    Inventors: Masahiro Ariyama, Sachio Matsuda, Yuki Koshiba, Noriaki Matsumura, Kenji Yamashita, Katsuhiro Isoda
  • Patent number: 10138771
    Abstract: An oil bypass structure of an oil cooler includes: a bypass passage; an outlet side passage; and bypass valve disposed at a connection portion between the bypass passage and the outlet side passage, the bypass valve which includes a valve element including an inside passage, and within which the oil flows, the bypass valve being arranged to be closed to shut off a flow of the oil from the bypass passage to the outlet side passage by the valve element so that the oil passing through the heat exchange section flows within the inside passage, and to be opened to connect the bypass passage and the inside passage so that the oil passing through the bypass passage flows within the inside passage.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: November 27, 2018
    Assignee: MAHLE FILTER SYSTEMS JAPAN CORPORATION
    Inventors: Masahiro Ariyama, Katsuhiro Isoda, Kenji Yamashita
  • Patent number: 10100173
    Abstract: Provided is an additive masterbatch comprising a low-melting-point resin additive at a high concentration, which additive masterbatch can be continuously produced without strand breakage, shows excellent clumping resistance to inhibit bleeding from a pellet thereof and thus has few use restrictions for potential application. The resin additive masterbatch is characterized by comprising, with respect to 100 parts by mass of (A) a polyolefin resin: 50 to 200 parts by mass of (B) a resin additive having a melting point of not higher than 65° C.; and 10 to 20 parts by mass of (C) an inorganic layered compound.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: October 16, 2018
    Assignee: ADEKA CORPORATION
    Inventors: Takashi Ayabe, Kenji Yamashita
  • Publication number: 20180094870
    Abstract: A heat exchanger includes: the pair of the oil holes being positioned on an outer edge of one of the core plates, being positioned at symmetrical positions with respect to the center of the one of the core plates to sandwich the center of the one of the core plates, and being positioned to sandwich one of the fin plates along the first reference line, and the pair of the coolant holes being positioned on the outer edge of the one of the core plates, being positioned at symmetrical positions with respect to the center of the one of the core plates to sandwich the center of the one of the core plates, and being positioned to sandwich the one of the fin plates along the first reference line.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 5, 2018
    Applicant: MAHLE FILTER SYSTEMS JAPAN CORPORATION
    Inventors: Masahiro ARIYAMA, Satoshi SUZUKI, Takuma SHIBATA, Kenji YAMASHITA, Katsuhiro ISODA, Yuki KOSHIBA
  • Publication number: 20180094877
    Abstract: A heat exchanger includes: each of the fin plates having a V shaped or trapezoid corrugated shape, and including top walls positioned at top portions of the corrugated shape, bottom walls positioned at bottom portions of the corrugated shape, and foot portions each connecting one of the top walls and one of the bottom walls, each of the foot portions having a rectangular corrugated shape along one of the top walls and one of the bottom walls, and including stepped walls formed at a predetermined interval along the one of the top walls and the one of the bottom walls, and opening portions each formed in one of the stepped walls, and being an elongated through holes having a width equal to or smaller than a thickness of one of the fin plates.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 5, 2018
    Applicant: MAHLE FILTER SYSTEMS JAPAN CORPORATION
    Inventors: Masahiro ARIYAMA, Sachio MATSUDA, Yuki KOSHIBA, Noriaki MATSUMURA, Kenji YAMASHITA, Katsuhiro ISODA
  • Publication number: 20170355041
    Abstract: For allowing a crack to progress between respective lines reliably while shortening a laser beam irradiation time, a method for processing SiC material includes allowing a laser beam to be absorbed in a cutting scheduled plane of an SiC material to form an altered pattern including a plurality of line-shaped altered regions; and cutting the SiC material along the cutting scheduled plane, wherein a plurality of line-shaped main altered regions extending in a predetermined direction, arranged at a first pitch P1 and included in altered region groups is formed, and a plurality of altered region groups is arranged at a second pitch P2 larger than the first pitch P1.
    Type: Application
    Filed: November 16, 2015
    Publication date: December 14, 2017
    Inventors: Kenji YAMASHITA, Koichi NANIWAE
  • Publication number: 20170175599
    Abstract: An oil bypass structure of an oil cooler includes: a bypass passage; an outlet side passage; and bypass valve disposed at a connection portion between the bypass passage and the outlet side passage, the bypass valve which includes a valve element including an inside passage, and within which the oil flows, the bypass valve being arranged to be closed to shut off a flow of the oil from the bypass passage to the outlet side passage by the valve element so that the oil passing through the heat exchange section flows within the inside passage, and to be opened to connect the bypass passage and the inside passage so that the oil passing through the bypass passage flows within the inside passage.
    Type: Application
    Filed: November 1, 2016
    Publication date: June 22, 2017
    Applicant: MAHLE FILTER SYSTEMS JAPAN CORPORATION
    Inventors: Masahiro ARIYAMA, Katsuhiro ISODA, Kenji YAMASHITA
  • Patent number: 9624355
    Abstract: Disclosed is a resin composition having excellent weather resistance, in which occurrence of initial coloration, bleeding and blooming is suppressed. The resin composition contains, with respect to 100 parts by mass of (A) an olefin-based resin: 0.05 to 0.3 parts by mass of (B) a hindered amine-based light stabilizer; 0.05 to 0.3 parts by mass of (C) a benzoate compound; and 0.001 to 0.01 parts by mass of (D) a benzotriazole-based ultraviolet absorber.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: April 18, 2017
    Assignee: ADEKA CORPORATION
    Inventors: Takashi Ayabe, Naoki Yamamoto, Kenji Yamashita
  • Patent number: 9574068
    Abstract: Provided is an additive masterbatch having excellent storage stability (agglomeration resistance), which also has reduced surface tackiness despite comprising a low-melting-point resin additive at a high concentration. The additive masterbatch of the present invention is characterized by comprising, with respect to 100 parts by mass of (A) a polyolefin resin, 65 to 300 parts by mass of (B) a resin additive having a melting point of not higher than 80° C.; and 0.8 to 24 parts by mass of (C) a benzotriazole-based ultraviolet absorber.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: February 21, 2017
    Assignee: ADEKA CORPORATION
    Inventors: Takashi Ayabe, Kenji Yamashita, Naoki Yamamoto
  • Publication number: 20160196966
    Abstract: A method includes: polishing a semiconductor wafer by a polishing device; measuring a form of the semiconductor wafer by a measuring device before a polished surface of the semiconductor wafer becomes hydrophilic; and setting polishing conditions for the polishing based on a measurement result of the form of the semiconductor wafer by a polishing condition setting unit.
    Type: Application
    Filed: May 29, 2014
    Publication date: July 7, 2016
    Applicant: SUMCO TECHXIV CORPORATION
    Inventor: Kenji YAMASHITA
  • Patent number: 9376550
    Abstract: Provided is a masterbatch in which blocking in a masterbatch of a hindered amine compound and a benzoate compound, which is caused by long-term storage under a high-temperature environment, is improved.
    Type: Grant
    Filed: July 3, 2013
    Date of Patent: June 28, 2016
    Assignee: ADEKA CORPORATION
    Inventors: Takashi Ayabe, Kenji Yamashita