Abstract: A method includes: polishing a semiconductor wafer by a polishing device; measuring a form of the semiconductor wafer by a measuring device before a polished surface of the semiconductor wafer becomes hydrophilic; and setting polishing conditions for the polishing based on a measurement result of the form of the semiconductor wafer by a polishing condition setting unit.

Abstract: A motor control device includes: a PWM controller that PWM-controls an inverter driving a three-phase motor and including three arm portions, each including a high-side switching element and a low-side switching element connected in series with each other between a first power supply line and a second power supply line connected to a potential lower than a potential of the first power supply line. In an energizing period and a non-energizing period in a case where the three-phase motor is energized from the first power supply line through the PWM-control of the inverter, during a first predetermined period in the energizing period immediately before transition from the energizing period to the non-energizing period, the PWM controller performs a SWEEP of a signal applied to one of the high-side switching element and the low-side switching element, and performs a synchronous rectification control.

Abstract: A heat exchanger includes: the pair of the oil holes being positioned on an outer edge of one of the core plates, being positioned at symmetrical positions with respect to the center of the one of the core plates to sandwich the center of the one of the core plates, and being positioned to sandwich one of the fin plates along the first reference line, and the pair of the coolant holes being positioned on the outer edge of the one of the core plates, being positioned at symmetrical positions with respect to the center of the one of the core plates to sandwich the center of the one of the core plates, and being positioned to sandwich the one of the fin plates along the first reference line.

Abstract: A heat exchanger includes: each of the fin plates having a V shaped or trapezoid corrugated shape, and including top walls positioned at top portions of the corrugated shape, bottom walls positioned at bottom portions of the corrugated shape, and foot portions each connecting one of the top walls and one of the bottom walls, each of the foot portions having a rectangular corrugated shape along one of the top walls and one of the bottom walls, and including stepped walls formed at a predetermined interval along the one of the top walls and the one of the bottom walls, and opening portions each formed in one of the stepped walls, and being an elongated through holes having a width equal to or smaller than a thickness of one of the fin plates.

Abstract: An oil bypass structure of an oil cooler includes: a bypass passage; an outlet side passage; and bypass valve disposed at a connection portion between the bypass passage and the outlet side passage, the bypass valve which includes a valve element including an inside passage, and within which the oil flows, the bypass valve being arranged to be closed to shut off a flow of the oil from the bypass passage to the outlet side passage by the valve element so that the oil passing through the heat exchange section flows within the inside passage, and to be opened to connect the bypass passage and the inside passage so that the oil passing through the bypass passage flows within the inside passage.

Abstract: Provided is an additive masterbatch comprising a low-melting-point resin additive at a high concentration, which additive masterbatch can be continuously produced without strand breakage, shows excellent clumping resistance to inhibit bleeding from a pellet thereof and thus has few use restrictions for potential application. The resin additive masterbatch is characterized by comprising, with respect to 100 parts by mass of (A) a polyolefin resin: 50 to 200 parts by mass of (B) a resin additive having a melting point of not higher than 65° C.; and 10 to 20 parts by mass of (C) an inorganic layered compound.

Abstract: A heat exchanger includes: each of the fin plates having a V shaped or trapezoid corrugated shape, and including top walls positioned at top portions of the corrugated shape, bottom walls positioned at bottom portions of the corrugated shape, and foot portions each connecting one of the top walls and one of the bottom walls, each of the foot portions having a rectangular corrugated shape along one of the top walls and one of the bottom walls, and including stepped walls formed at a predetermined interval along the one of the top walls and the one of the bottom walls, and opening portions each formed in one of the stepped walls, and being an elongated through holes having a width equal to or smaller than a thickness of one of the fin plates.

Abstract: A heat exchanger includes: the pair of the oil holes being positioned on an outer edge of one of the core plates, being positioned at symmetrical positions with respect to the center of the one of the core plates to sandwich the center of the one of the core plates, and being positioned to sandwich one of the fin plates along the first reference line, and the pair of the coolant holes being positioned on the outer edge of the one of the core plates, being positioned at symmetrical positions with respect to the center of the one of the core plates to sandwich the center of the one of the core plates, and being positioned to sandwich the one of the fin plates along the first reference line.

Abstract: For allowing a crack to progress between respective lines reliably while shortening a laser beam irradiation time, a method for processing SiC material includes allowing a laser beam to be absorbed in a cutting scheduled plane of an SiC material to form an altered pattern including a plurality of line-shaped altered regions; and cutting the SiC material along the cutting scheduled plane, wherein a plurality of line-shaped main altered regions extending in a predetermined direction, arranged at a first pitch P1 and included in altered region groups is formed, and a plurality of altered region groups is arranged at a second pitch P2 larger than the first pitch P1.

Abstract: An oil bypass structure of an oil cooler includes: a bypass passage; an outlet side passage; and bypass valve disposed at a connection portion between the bypass passage and the outlet side passage, the bypass valve which includes a valve element including an inside passage, and within which the oil flows, the bypass valve being arranged to be closed to shut off a flow of the oil from the bypass passage to the outlet side passage by the valve element so that the oil passing through the heat exchange section flows within the inside passage, and to be opened to connect the bypass passage and the inside passage so that the oil passing through the bypass passage flows within the inside passage.

Abstract: Disclosed is a resin composition having excellent weather resistance, in which occurrence of initial coloration, bleeding and blooming is suppressed. The resin composition contains, with respect to 100 parts by mass of (A) an olefin-based resin: 0.05 to 0.3 parts by mass of (B) a hindered amine-based light stabilizer; 0.05 to 0.3 parts by mass of (C) a benzoate compound; and 0.001 to 0.01 parts by mass of (D) a benzotriazole-based ultraviolet absorber.

Abstract: Provided is an additive masterbatch having excellent storage stability (agglomeration resistance), which also has reduced surface tackiness despite comprising a low-melting-point resin additive at a high concentration. The additive masterbatch of the present invention is characterized by comprising, with respect to 100 parts by mass of (A) a polyolefin resin, 65 to 300 parts by mass of (B) a resin additive having a melting point of not higher than 80° C.; and 0.8 to 24 parts by mass of (C) a benzotriazole-based ultraviolet absorber.

Abstract: A method includes: polishing a semiconductor wafer by a polishing device; measuring a form of the semiconductor wafer by a measuring device before a polished surface of the semiconductor wafer becomes hydrophilic; and setting polishing conditions for the polishing based on a measurement result of the form of the semiconductor wafer by a polishing condition setting unit.

Abstract: Provided is a masterbatch in which blocking in a masterbatch of a hindered amine compound and a benzoate compound, which is caused by long-term storage under a high-temperature environment, is improved.

Abstract: A method of manufacturing a semiconductor wafer includes: rough-polishing front and back surfaces of the semiconductor wafer; mirror-polishing a chamfered portion of the rough-polished semiconductor wafer; performing mirror finish polishing on the front surface or both the front and back surfaces of the semiconductor wafer having the mirror-polished chamfered portion; and forming an oxide film on an entire surface of the semiconductor wafer after the mirror-polishing of the chamfered portion and before the mirror finish polishing.

Abstract: Provided is an additive masterbatch comprising a low-melting-point resin additive at a high concentration, which additive masterbatch can be continuously produced without strand breakage, shows excellent clumping resistance to inhibit bleeding from a pellet thereof and thus has few use restrictions for potential application. The resin additive masterbatch is characterized by comprising, with respect to 100 parts by mass of (A) a polyolefin resin: 50 to 200 parts by mass of (B) a resin additive having a melting point of not higher than 65° C.; and 10 to 20 parts by mass of (C) an inorganic layered compound.

Abstract: Provided is a resin composition having excellent weather resistance, in which occurrence of initial coloration, bleeding and blooming is suppressed. The resin composition is characterized by comprising, with respect to 100 parts by mass of (A) an olefin-based resin: 0.05 to 0.3 parts by mass of (B) a hindered amine-based light stabilizer; 0.05 to 0.3 parts by mass of (C) a benzoate compound represented by the following Formula (1); and 0.001 to 0.

Abstract: Provided is a masterbatch in which blocking in a masterbatch of a hindered amine compound and a benzoate compound, which is caused by long-term storage under a high-temperature environment, is improved.

Abstract: A method of manufacturing a semiconductor wafer includes: rough-polishing front and back surfaces of the semiconductor wafer; mirror-polishing a chamfered portion of the rough-polished semiconductor wafer; performing mirror finish polishing on the front surface or both the front and back surfaces of the semiconductor wafer having the mirror-polished chamfered portion; and forming an oxide film on an entire surface of the semiconductor wafer after the mirror-polishing of the chamfered portion and before the mirror finish polishing.

Abstract: A press-through package for articles such as medicines which can reliably prevent a recipient from accidentally swallowing the whole package without opening it, including solid medicines M stored in a plurality of pockets of a base sheet one by one and the pockets sealed by a cover film having attached to the rear surface of the base sheet, wherein the entire package of the press-through package is made in a cylindrical form which cannot allow a recipient from accidentally swallowing and from which the medicines can be taken out easily.