Patents by Inventor Kenneth S. Collins

Kenneth S. Collins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180134612
    Abstract: A bonded ceramic component which is resistant to reactive halogen-containing plasmas, said component comprising ceramic portions which are bonded together by a bonding material which includes an oxyfluoride glass-ceramic-comprising transition area between interfaces of the ceramic portions, where the transition area includes form at least 0.1 volume % amorphous phase up to about 50 volume % amorphous phase.
    Type: Application
    Filed: January 9, 2018
    Publication date: May 17, 2018
    Inventors: Jennifer Y. Sun, Ren-Guan Duan, Kenneth S. Collins
  • Publication number: 20180138014
    Abstract: A plasma reactor has an overhead inductively coupled plasma source with two coil antennas and symmetric and radial RF feeds and cylindrical RF shielding around the symmetric and radial RF feeds. The radial RF feeds are symmetrically fed to the plasma source.
    Type: Application
    Filed: January 10, 2018
    Publication date: May 17, 2018
    Inventors: James D. Carducci, Kenneth S. Collins, Richard Fovell, Jason A. Kenney, Kartik Ramaswamy, Shahid Rauf
  • Patent number: 9960776
    Abstract: Methods and apparatus for generating a variable clock used to control a component of a substrate processing system are provided herein. In some embodiments, an apparatus for controlling a substrate processing system includes: a phase locked loop circuit for generating a relative clock that is phase locked to a variable frequency signal being used by a substrate processing chamber; and a controller, coupled to the phase locked loop circuit, for producing a control signal for a component of the substrate processing system, wherein the control signal is based upon the relative clock and an operating indicia of the substrate processing system.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: May 1, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Kenneth S. Collins, Satoru Kobayashi, Kartik Ramaswamy
  • Patent number: 9928987
    Abstract: A plasma reactor has an overhead multiple coil inductive plasma source with RF feeds arranged in equilateral symmetry.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: March 27, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Jason A. Kenney, James D. Carducci, Kenneth S. Collins, Richard Fovell, Kartik Ramaswamy, Shahid Rauf
  • Publication number: 20180053630
    Abstract: The disclosure pertains to a capacitively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a symmetrical power distribution.
    Type: Application
    Filed: October 25, 2017
    Publication date: February 22, 2018
    Inventors: Kartik Ramaswamy, Igor Markovsky, Zhijang Chen, James D. Carducci, Kenneth S. Collins, Shahid Rauf, Nipun Misra, Leonid Dorf, Zheng John Ye
  • Publication number: 20180053631
    Abstract: The disclosure concerns a method of operating a plasma reactor having an electron beam plasma source for independently adjusting electron beam energy, plasma ion energy and radical population. The disclosure further concerns an electron beam source for a plasma reactor having an RF-driven electrode for producing the electron beam.
    Type: Application
    Filed: October 13, 2017
    Publication date: February 22, 2018
    Inventors: Leonid Dorf, Kenneth S. Collins, Shahid Rauf, Kartik Ramaswamy, James D. Carducci, Hamid Tavassoli, Olga Regelman, Ying Zhang
  • Patent number: 9896769
    Abstract: A plasma reactor enclosure has a metallic portion and a dielectric portion of plural dielectric windows supported on the metallic portion, each of the dielectric windows extending around an axis of symmetry. Plural concentric coil antennas are disposed on an external side of the enclosure, respective ones of the coil antennas facing respective ones of the dielectric windows.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: February 20, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Andrew Nguyen, Kenneth S. Collins, Kartik Ramaswamy, Shahid Rauf, James D. Carducci, Douglas A. Buchberger, Jr., Ankur Agarwal, Jason A. Kenney, Leonid Dorf, Ajit Balakrishna, Richard Fovell
  • Patent number: 9896376
    Abstract: A bonded ceramic component which is resistant to reactive halogen-containing plasmas, said component comprising ceramic portions which are bonded together by a bonding material which includes an oxyfluoride glass-ceramic-comprising transition area between interfaces of the ceramic portions, where the transition area includes from at least 0.1 volume % amorphous phase up to about 50 volume % amorphous phase.
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: February 20, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Jennifer Y. Sun, Ren-Guan Duan, Kenneth S. Collins
  • Patent number: 9870897
    Abstract: A plasma reactor has an overhead inductively coupled plasma source with two coil antennas and symmetric and radial RF feeds and cylindrical RF shielding around the symmetric and radial RF feeds. The radial RF feeds are symmetrically fed to the plasma source.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: January 16, 2018
    Assignee: Applied Materials, Inc.
    Inventors: James D. Carducci, Kenneth S. Collins, Richard Fovell, Jason A. Kenney, Kartik Ramaswamy, Shahid Rauf
  • Publication number: 20170372899
    Abstract: Methods for forming a diamond like carbon layer with desired film density, mechanical strength and optical film properties are provided. In one embodiment, a method of forming a diamond like carbon layer includes generating an electron beam plasma above a surface of a substrate disposed in a processing chamber, and forming a diamond like carbon layer on the surface of the substrate. The diamond like carbon layer is formed by an electron beam plasma process, wherein the diamond like carbon layer serves as a hardmask layer in an etching process in semiconductor applications. The diamond like carbon layer may be formed by bombarding a carbon containing electrode disposed in a processing chamber to generate a secondary electron beam in a gas mixture containing carbon to a surface of a substrate disposed in the processing chamber, and forming a diamond like carbon layer on the surface of the substrate from elements of the gas mixture.
    Type: Application
    Filed: June 28, 2016
    Publication date: December 28, 2017
    Inventors: Yang YANG, Lucy CHEN, Jie ZHOU, Kartik RAMASWAMY, Kenneth S. COLLINS, Srinivas D. NEMANI, Chentsau YING, Jingjing LIU, Steven LANE, Gonzalo MONROY, James D. CARDUCCI
  • Publication number: 20170372874
    Abstract: A bulk, sintered solid solution-comprising ceramic article useful in semiconductor processing, which is resistant to erosion by halogen-containing plasmas and provides advantageous mechanical properties. The solid solution-comprising ceramic article is formed from a combination of yttrium oxide and zirconium oxide. The bulk, sintered solid solution-comprising article is formed from zirconium oxide at a molar concentration ranging from about 96 mole % to about 94 mole %, and yttrium oxide at a molar concentration ranging from about 4 mole % to about 6 mole %.
    Type: Application
    Filed: October 20, 2015
    Publication date: December 28, 2017
    Applicant: Applied Materials, Inc.
    Inventors: Jennifer Y. Sun, Ren-Guan Duan, Jie Yuan, Li Xu, Kenneth S. Collins
  • Publication number: 20170365443
    Abstract: A gas distribution plate assembly for a processing chamber is provided that in one embodiment includes a body made of a metallic material, a base plate comprising a silicon infiltrated metal matrix composite coupled to the body, and a perforated faceplate comprising a silicon disk coupled to the base plate by a bond layer.
    Type: Application
    Filed: January 24, 2017
    Publication date: December 21, 2017
    Inventors: James D. CARDUCCI, Kenneth S. COLLINS, Kartik RAMASWAMY, Michael R. RICE, Richard Charles FOVELL, Vijay D. PARKHE
  • Publication number: 20170350017
    Abstract: A plasma reactor has an overhead multiple coil inductive plasma source with symmetric RF feeds and a symmetrical chamber exhaust with plural struts through the exhaust region providing access to a confined workpiece support. A grid may be included for masking spatial effects of the struts from the processing region.
    Type: Application
    Filed: August 24, 2017
    Publication date: December 7, 2017
    Inventors: Andrew Nguyen, Kenneth S. Collins, Kartik Ramaswamy, Shahid Rauf, James D. Carducci, Douglas A. Buchberger, JR., Ankur Agarwal, Jason A. Kenney, Leonid Dorf, Ajit Balakrishna, Richard Fovell
  • Publication number: 20170350018
    Abstract: A plasma reactor enclosure has a metallic portion and a dielectric portion of plural dielectric windows supported on the metallic portion, each of the dielectric windows extending around an axis of symmetry. Plural concentric coil antennas are disposed on an external side of the enclosure, respective ones of the coil antennas facing respective ones of the dielectric windows.
    Type: Application
    Filed: August 24, 2017
    Publication date: December 7, 2017
    Inventors: Andrew Nguyen, Kenneth S. Collins, Kartik Ramaswamy, Shahid Rauf, James D. Carducci, Douglas A. Buchberger, Ankur Agarwal, Jason A. Kenney, Leonid Dorf, Ajit Balakrishna, Richard Fovell
  • Publication number: 20170345623
    Abstract: Embodiments of the present disclosure generally provide various apparatus and methods for reducing particles in a semiconductor processing chamber. One embodiment of present disclosure provides a vacuum screen assembly disposed over a vacuum port to prevent particles generated by the vacuum pump from entering substrate processing regions. Another embodiment of the present disclosure provides a perforated chamber liner around a processing region of the substrate. Another embodiment of the present disclosure provides a gas distributing chamber liner for distributing a cleaning gas around the substrate support under the substrate supporting surface.
    Type: Application
    Filed: August 15, 2017
    Publication date: November 30, 2017
    Inventors: Andrew NGUYEN, Bradley HOWARD, Shahid RAUF, Ajit BALAKRISHNA, Tom K. CHOI, Kenneth S. COLLINS, Anand KUMAR, Michael D. WILLWERTH, Yogananda SARODE VISHWANATH
  • Patent number: 9824862
    Abstract: The disclosure pertains to a capacitively coupled plasma source in which VHF power is applied through an impedance-matching coaxial resonator having a symmetrical power distribution.
    Type: Grant
    Filed: November 20, 2014
    Date of Patent: November 21, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Kartik Ramaswamy, Igor Markovsky, Zhigang Chen, James D. Carducci, Kenneth S. Collins, Shahid Rauf, Nipun Misra, Leonid Dorf, Zheng John Ye
  • Patent number: 9799491
    Abstract: The disclosure concerns a method of operating a plasma reactor having an electron beam plasma source for independently adjusting electron beam energy, plasma ion energy and radical population. The disclosure further concerns an electron beam source for a plasma reactor having an RF-driven electrode for producing the electron beam.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: October 24, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Leonid Dorf, Kenneth S. Collins, Shahid Rauf, Kartik Ramaswamy, James D. Carducci, Hamid Tavassoli, Olga Regelman, Ying Zhang
  • Publication number: 20170271129
    Abstract: Embodiments of the present invention provide a plasma chamber design that allows extremely symmetrical electrical, thermal, and gas flow conductance through the chamber. By providing such symmetry, plasma formed within the chamber naturally has improved uniformity across the surface of a substrate disposed in a processing region of the chamber. Further, other chamber additions, such as providing the ability to manipulate the gap between upper and lower electrodes as well as between a gas inlet and a substrate being processed, allows better control of plasma processing and uniformity as compared to conventional systems.
    Type: Application
    Filed: June 1, 2017
    Publication date: September 21, 2017
    Inventors: James D. CARDUCCI, Hamid TAVASSOLI, Ajit BALAKRISHNA, Zhigang CHEN, Andrew NGUYEN, Douglas A. BUCHBERGER, JR., Kartik RAMASWAMY, Shahid RAUF, Kenneth S. COLLINS
  • Patent number: 9761416
    Abstract: Embodiments of the present disclosure generally provide various apparatus and methods for reducing particles in a semiconductor processing chamber. One embodiment of present disclosure provides a vacuum screen assembly disposed over a vacuum port to prevent particles generated by the vacuum pump from entering substrate processing regions. Another embodiment of the present disclosure provides a perforated chamber liner around a processing region of the substrate. Another embodiment of the present disclosure provides a gas distributing chamber liner for distributing a cleaning gas around the substrate support under the substrate supporting surface.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: September 12, 2017
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Andrew Nguyen, Bradley Howard, Shahid Rauf, Ajit Balakrishna, Tom K. Cho, Kenneth S. Collins, Anand Kumar, Michael D. Willwerth, Yogananda Sarode Vishwanath
  • Patent number: 9745663
    Abstract: A plasma reactor has an overhead multiple coil inductive plasma source with symmetric RF feeds and a symmetrical chamber exhaust with plural struts through the exhaust region providing access to a confined workpiece support. A grid may be included for masking spatial effects of the struts from the processing region.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: August 29, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Andrew Nguyen, Kenneth S. Collins, Kartik Ramaswamy, Shahid Rauf, James D. Carducci, Douglas A. Buchberger, Jr., Ankur Agarwal, Jason A. Kenney, Leonid Dorf, Ajit Balakrishna, Richard Fovell