Patents by Inventor Kenneth S. Collins

Kenneth S. Collins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9741546
    Abstract: Embodiments of the present invention provide a plasma chamber design that allows extremely symmetrical electrical, thermal, and gas flow conductance through the chamber. By providing such symmetry, plasma formed within the chamber naturally has improved uniformity across the surface of a substrate disposed in a processing region of the chamber. Further, other chamber additions, such as providing the ability to manipulate the gap between upper and lower electrodes as well as between a gas inlet and a substrate being processed, allows better control of plasma processing and uniformity as compared to conventional systems.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: August 22, 2017
    Assignee: Applied Materials, Inc.
    Inventors: James D. Carducci, Hamid Tavassoli, Ajit Balakrishna, Zhigang Chen, Andrew Nguyen, Douglas A. Buchberger, Jr., Kartik Ramaswamy, Shahid Rauf, Kenneth S. Collins
  • Patent number: 9721760
    Abstract: In a plasma reactor for processing a workpiece, an electron beam is employed as the plasma source, and sputtered metal atoms are removed from the electron beam to reduce contamination.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: August 1, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Leonid Dorf, Shahid Rauf, Kenneth S. Collins, Kartik Ramaswamy, Nipun Misra, Gonzalo Antonio Monroy, James D. Carducci, Steven Lane
  • Patent number: 9721757
    Abstract: A modular plasma source assembly for use with a processing chamber is described. The assembly includes an RF hot electrode with an end dielectric and a sliding ground connection positioned adjacent the sides of the electrode. A seal foil connects the sliding ground connection to the housing to provide a grounded sliding ground connection separated from the hot electrode by the end dielectric. A coaxial feed line passes through a conduit into the RF hot electrode isolated from the processing environment so that the coaxial RF feed line is at atmospheric pressure while the plasma processing region is at reduced pressure.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: August 1, 2017
    Assignee: Applied Materials, Inc.
    Inventors: John C. Forster, Joseph Yudovsky, Garry K. Kwong, Tai T. Ngo, Kevin Griffin, Kenneth S. Collins, Ren Liu
  • Publication number: 20170125217
    Abstract: The disclosure concerns a method of operating a plasma reactor having an electron beam plasma source for independently adjusting electron beam energy, plasma ion energy and radical population. The disclosure further concerns an electron beam source for a plasma reactor having an RF-driven electrode for producing the electron beam.
    Type: Application
    Filed: May 4, 2016
    Publication date: May 4, 2017
    Inventors: Leonid Dorf, Kenneth S. Collins, Shahid Rauf, Kartik Ramaswamy, James D. Carducci, Hamid Tavassoli, Olga Regelman, Ying Zhang
  • Publication number: 20170110293
    Abstract: A bulk, sintered solid solution-comprising ceramic article useful in semiconductor processing, which is resistant to erosion by halogen-containing plasmas and provides advantageous mechanical properties. The solid solution-comprising ceramic article is formed from a combination of yttrium oxide and zirconium oxide. The bulk, sintered solid solution-comprising article is formed from zirconium oxide at a molar concentration ranging from about 96 mole % to about 94 mole %, and yttrium oxide at a molar concentration ranging from about 4 mole % to about 6 mole %.
    Type: Application
    Filed: October 20, 2015
    Publication date: April 20, 2017
    Applicant: Applied Materials, Inc.
    Inventors: Jennifer Y. Sun, Ren-Guan Duan, Jie Yuan, Li Xu, Kenneth S. Collins
  • Publication number: 20170050819
    Abstract: Retractors and vests having the retractors are disclosed, wherein the retractor can be attached by an attachment mechanism to a web system on the vest. An accessory can be attached to a line within the retractor, and the user can extend the line from the retractor housing when the accessory is in use. When the line is extended from the housing, the retractor housing rotates so it is in alignment with the extended line. This alignment of the housing and line significantly reduces the stresses on the line, which in turn extends the reliability and lifespan of the retractor. Further, the line can be under a retraction force that retracts the line back into the retractor housing when the extension force is released. The retraction force can be strong enough to prevent the line from extending from under weight of the accessory. The retractor can also minimize the dangle length of the retracting device to the attachment point to minimize movement when not in use.
    Type: Application
    Filed: November 7, 2016
    Publication date: February 23, 2017
    Applicant: HAMMERHEAD INDUSTRIES, INC.
    Inventors: John A. Salentine, Kenneth S. Collin
  • Patent number: 9564297
    Abstract: In a plasma reactor for processing a workpiece, an electron beam is employed as the plasma source, and a remote radical source is incorporated with the process chamber.
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: February 7, 2017
    Assignee: Applied Materials, Inc.
    Inventors: Ming-Feng Wu, Leonid Dorf, Shahid Rauf, Ying Zhang, Kenneth S. Collins, Hamid Tavassoli, Kartik Ramaswamy, Steven Lane
  • Publication number: 20160372307
    Abstract: Implementations described herein provide a substrate support assembly which enables tuning of a plasma within a plasma chamber. In one embodiment, a method for tuning a plasma in a chamber is provided. The method includes providing a first radio frequency power and a direct current power to a first electrode in a substrate support assembly, providing a second radio frequency power to a second electrode in the substrate support assembly at a different location than the first electrode, monitoring parameters of the first and second radio frequency power, and adjusting one or both of the first and second radio frequency power based on the monitored parameters.
    Type: Application
    Filed: June 17, 2015
    Publication date: December 22, 2016
    Inventors: YANG YANG, Kartik RAMASWAMY, Steven LANE, Lawrence WONG, Shahid RAUF, Andrew NGUYEN, Kenneth S. COLLINS, Roger Alan LINDLEY
  • Patent number: 9487376
    Abstract: Retractors and vests having retractors are disclosed, wherein the retractor can be attached by an attachment mechanism to a web system on the vest. An accessory can be attached to a line within the retractor, and the line can be extended from the retractor housing during accessory use. When the line is extended from the housing, the retractor housing rotates so it aligns with the extended line. This alignment of the housing and line reduces stresses on the line, which extends the reliability and lifespan of the retractor. Further, a retraction force can retract the line back into the retractor housing when the extension force is released. The retraction force can be strong enough to prevent the line from extending from under weight of the accessory. The retractor can also minimize the dangle length of the retracting device to the attachment point to minimize movement when not in use.
    Type: Grant
    Filed: January 14, 2013
    Date of Patent: November 8, 2016
    Assignee: HAMMERHEAD INDUSTRIES, INC.
    Inventors: John A Salentine, Kenneth S Collin, Jr.
  • Publication number: 20160314936
    Abstract: Embodiments of the present invention provide a plasma chamber design that allows extremely symmetrical electrical, thermal, and gas flow conductance through the chamber. By providing such symmetry, plasma formed within the chamber naturally has improved uniformity across the surface of a substrate disposed in a processing region of the chamber. Further, other chamber additions, such as providing the ability to manipulate the gap between upper and lower electrodes as well as between a gas inlet and a substrate being processed, allows better control of plasma processing and uniformity as compared to conventional systems.
    Type: Application
    Filed: June 30, 2016
    Publication date: October 27, 2016
    Inventors: James D. CARDUCCI, Hamid TAVASSOLI, Ajit BALAKRISHNA, Zhigang CHEN, Andrew NGUYEN, Douglas A. BUCHBERGER, JR., Kartik RAMASWAMY, Shahid RAUF, Kenneth S. COLLINS
  • Publication number: 20160314937
    Abstract: Embodiments of the present invention provide a plasma chamber design that allows extremely symmetrical electrical, thermal, and gas flow conductance through the chamber. By providing such symmetry, plasma formed within the chamber naturally has improved uniformity across the surface of a substrate disposed in a processing region of the chamber. Further, other chamber additions, such as providing the ability to manipulate the gap between upper and lower electrodes as well as between a gas inlet and a substrate being processed, allows better control of plasma processing and uniformity as compared to conventional systems.
    Type: Application
    Filed: June 30, 2016
    Publication date: October 27, 2016
    Inventors: James D. CARDUCCI, Hamid TAVASSOLI, Ajit BALAKRISHNA, Zhigang CHEN, Andrew NGUYEN, Douglas A. BUCHBERGER, JR., Kartik RAMASWAMY, Shahid RAUF, Kenneth S. COLLINS
  • Publication number: 20160314942
    Abstract: Embodiments of the present invention provide a plasma chamber design that allows extremely symmetrical electrical, thermal, and gas flow conductance through the chamber. By providing such symmetry, plasma formed within the chamber naturally has improved uniformity across the surface of a substrate disposed in a processing region of the chamber. Further, other chamber additions, such as providing the ability to manipulate the gap between upper and lower electrodes as well as between a gas inlet and a substrate being processed, allows better control of plasma processing and uniformity as compared to conventional systems.
    Type: Application
    Filed: June 30, 2016
    Publication date: October 27, 2016
    Inventors: James D. CARDUCCI, Hamid TAVASSOLI, Ajit BALAKRISHNA, Zhigang CHEN, Andrew NGUYEN, Douglas A. BUCHBERGER, JR., Kartik RAMASWAMY, Shahid RAUF, Kenneth S. COLLINS
  • Publication number: 20160314940
    Abstract: Embodiments of the present invention provide a plasma chamber design that allows extremely symmetrical electrical, thermal, and gas flow conductance through the chamber. By providing such symmetry, plasma formed within the chamber naturally has improved uniformity across the surface of a substrate disposed in a processing region of the chamber. Further, other chamber additions, such as providing the ability to manipulate the gap between upper and lower electrodes as well as between a gas inlet and a substrate being processed, allows better control of plasma processing and uniformity as compared to conventional systems.
    Type: Application
    Filed: June 30, 2016
    Publication date: October 27, 2016
    Inventors: James D. CARDUCCI, Hamid TAVASSOLI, Ajit BALAKRISHNA, Zhigang CHEN, Andrew NGUYEN, Douglas A. BUCHBERGER, JR., Kartik RAMASWAMY, Shahid RAUF, Kenneth S. COLLINS
  • Publication number: 20160276141
    Abstract: Embodiments of the invention relate to compositions including a yttrium-based fluoride crystal phase, or a yttrium-based oxyfluoride crystal phase, or an oxyfluoride amorphous phase, or a combination of these materials. The compositions may be used to form a solid substrate for use as a semiconductor processing apparatus, or the compositions may be used to form a coating which is present upon a surface of substrates having a melting point which is higher than about 1600°, substrates such as aluminum oxide, aluminum nitride, quartz, silicon carbide and silicon nitride, by way of example.
    Type: Application
    Filed: March 19, 2015
    Publication date: September 22, 2016
    Applicant: Applied Materials, Inc.
    Inventors: Jennifer Y. Sun, Ren-Guan Duan, Kenneth S. Collins
  • Publication number: 20160276136
    Abstract: A modular plasma source assembly for use with a processing chamber is described. The assembly includes an RF hot electrode with an end dielectric and a sliding ground connection positioned adjacent the sides of the electrode. A seal foil connects the sliding ground connection to the housing to provide a grounded sliding ground connection separated from the hot electrode by the end dielectric. A coaxial feed line passes through a conduit into the RF hot electrode isolated from the processing environment so that the coaxial RF feed line is at atmospheric pressure while the plasma processing region is at reduced pressure.
    Type: Application
    Filed: May 31, 2016
    Publication date: September 22, 2016
    Inventors: John C. Forster, Joseph Yudovsky, Garry K. Kwong, Tai T. Ngo, Kevin Griffin, Kenneth S. Collins, Ren Liu
  • Publication number: 20160276134
    Abstract: A reactor with an overhead electron beam source is capable of generating an ion-ion plasma for performing an atomic layer etch process.
    Type: Application
    Filed: March 17, 2015
    Publication date: September 22, 2016
    Inventors: Kenneth S. Collins, Kartik Ramaswamy, James D. Carducci, Shahid Rauf, Leonid Dorf, Yang Yang
  • Patent number: 9449794
    Abstract: A plasma reactor has an overhead multiple coil antennas including a parallel spiral coil antenna and symmetric and radial RF feeds and cylindrical RF shielding around the symmetric and radial RF feeds. The radial RF feeds are symmetrically fed to the plasma source.
    Type: Grant
    Filed: May 6, 2014
    Date of Patent: September 20, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Andrew Nguyen, Kartik Ramaswamy, Jason A. Kenney, Shahid Rauf, Kenneth S. Collins, Yang Yang, Steven Lane, Yogananda Sarode Vishwanath
  • Patent number: 9443700
    Abstract: A plasma reactor that generates plasma in a workpiece processing chamber by an electron beam, has an electron beam source and segmented suppression electrode with individually biased segments to control electron beam density distribution.
    Type: Grant
    Filed: February 10, 2014
    Date of Patent: September 13, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Leonid Dorf, Shahid Rauf, Kenneth S. Collins, Nipun Misra, Kartik Ramaswamy, James D. Carducci, Steven Lane
  • Patent number: 9412563
    Abstract: An RF plasma source has a resonator with its shorted end joined to the processing chamber ceiling and inductively coupled to two arrays of radial toroidal channels in the ceiling, the resonator having two radial zones and the two arrays of toroidal channels lying in respective ones of the radial zones.
    Type: Grant
    Filed: September 13, 2013
    Date of Patent: August 9, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Kartik Ramaswamy, Kenneth S. Collins, Shahid Rauf, Steven Lane, Yang Yang, Lawrence Wong
  • Publication number: 20160225466
    Abstract: An external magnetic filter to trap electrons surrounds a reactor chamber and has multiple magnets arranged in a circle, the magnetic orientation of each individual magnet being rotated relative to the orientation of the adjacent individual magnet by a difference angle that is a function of the arc subtended by the individual magnet.
    Type: Application
    Filed: August 21, 2015
    Publication date: August 4, 2016
    Inventors: Kartik Ramaswamy, Kenneth S. Collins, Steven Lane, Yang Yang, Lawrence Wong