Patents by Inventor Keon Jae Lee

Keon Jae Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200233980
    Abstract: A secret information generation apparatus and a method for operating the secret information generation apparatus. The secret information generation apparatus includes a resistor-capacitor circuit, and a microcontroller unit including a first pin connected to an input terminal of the resistor-capacitor circuit and a second pin connected to an output terminal of the resistor-capacitor circuit, wherein the microcontroller unit is configured to transmit a digital value corresponding to a challenge to the resistor-capacitor circuit through the first pin, receive an output value of the resistor-capacitor circuit corresponding to the digital value through the second pin, convert the received value into a digital value using an analog-to-digital converter, extract one or more valid bits from the converted digital value, and then generate a response.
    Type: Application
    Filed: January 14, 2020
    Publication date: July 23, 2020
    Inventors: Sang-Jae LEE, You-Sung KANG, Keon-Woo KIM, Byoung-Koo KIM, Ik-Kyun KIM, Ju-Han KIM, Tae-Sung KIM, Mi-Kyung OH, Seung-Yong YOON, Seung-Kwang LEE, Yong-Sung JEON, Doo-Ho CHOI
  • Publication number: 20200211879
    Abstract: The present disclosure provides a method for transfer and assembly of RGB micro-light-emitting diodes using vacuum suction force whereby the vacuum state of micrometer-sized adsorption holes to which micro-light-emitting diodes formed on a mother substrate or a temporary substrate are bonded is controlled selectively, so that only the micro-light-emitting diode devices desired to be detached from the mother substrate or the temporary substrate are detached from the mother substrate or the temporary substrate using vacuum suction force and then transferred to a target substrate
    Type: Application
    Filed: December 26, 2019
    Publication date: July 2, 2020
    Inventors: Keon Jae LEE, Han Eol LEE, Tae Jin KIM, Jung Ho SHIN, Sang Hyun PARK
  • Publication number: 20200155010
    Abstract: A pulse sensing module used in a blood pressure measuring device attached to the skin to allow at least one of systolic pressure Psystolic, diastolic pressure Pdiastolic, and blood pressure variation to be measured according to an embodiment of the present disclosure includes a piezoelectric layer that includes a piezoelectric material for generating a piezoelectric effect due to a pulse and a protective layer that is applied to the piezoelectric layer to protect the piezoelectric layer, allows a poling process of applying a high voltage to the first electrode line and the second electrode line formed on the piezoelectric layer to improve the polarity of the piezoelectric material, and has an opening for allowing a portion of the first electrode line and a portion of the second electrode line to be exposed.
    Type: Application
    Filed: November 28, 2018
    Publication date: May 21, 2020
    Applicants: ROBOPRINT CO., LTD, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jung Kyu PARK, Min Su KIM, Keon Jae LEE, Dae Yong PARK
  • Patent number: 10613356
    Abstract: One aspect of the present disclosure relates to a remotely controllable lens device. The lens device can include a lens material and a circuit physically coupled to the lens material. The circuit can be configured to be powered based on an energy signal from a power source to perform a function (e.g., release of drug, generation of electromagnetic radiation, detection of electromagnetic radiation, and/or control of an optical refractive property). For example, the power source can be an external power source and/or an auto-powered source. The external power source can be, for example, a power source that utilizes synchronized magnetic flux phase coupling (e.g., WiTricity). The auto-powered source can be provided on-site (e.g., on-chip) using a harvesting system (e.g., solar-cell, photo-cell, piezoelectric, etc.
    Type: Grant
    Filed: September 9, 2014
    Date of Patent: April 7, 2020
    Assignees: The General Hospital Corporation, Phi Biomed Co., Ltd.
    Inventors: Seok-Hyun Yun, Ehsan Kamrani, Sei Kwang Hahn, Hyemin Kim, Dohee Keum, Keon Jae Lee, Choun-Ki Joo
  • Publication number: 20200083670
    Abstract: Embodiments relate to a semiconductor device, an optical transmission module, and an optical transmission apparatus. An optical transmission module according to an embodiment includes a board; a submount disposed on a first surface of the board; a vertical cavity surface emitting laser (VCSEL) semiconductor device disposed on a first surface of the submount; and a module housing including a coupling unit and a body, the coupling unit spaced apart from the vertical cavity surface emitting laser (VCSEL) semiconductor device and facing the first surface of the submount, the body extending from the coupling unit toward the first surface of the board and disposed around the submount and the vertical cavity surface emitting laser (VCSEL) semiconductor device.
    Type: Application
    Filed: December 13, 2017
    Publication date: March 12, 2020
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Baek Jun KIM, Ho Jae KANG, Keon Hwa LEE, Yong Gyeong LEE
  • Patent number: 10566477
    Abstract: Provided are a method of manufacturing a flexible device and the flexible device, a solar cell, and a light emitting device. The method of manufacturing a flexible device includes providing a device layer on a sacrificial substrate, contacting a flexible substrate on one side surface of the device layer, and removing the sacrificial substrate. A large area device may be transferred onto the flexible substrate with superior alignment to realize and manufacture the flexible device. In addition, since mass production is possible, the economic feasibility may be superior. Also, when a large area solar cell having a thin thickness is manufactured, since a limitation such as twisting of a thin film of a solar cell may be effectively solved, the economic feasibility and stability may be superior.
    Type: Grant
    Filed: January 20, 2011
    Date of Patent: February 18, 2020
    Assignees: SK Siltron Co., Ltd., Korea Advanced Institute of Science Technology
    Inventors: Keon Jae Lee, Sang Yong Lee
  • Publication number: 20200036161
    Abstract: Embodiments pertain to a semiconductor device package, a method of manufacturing the semiconductor device package, and an autofocusing apparatus including the semiconductor device package. The semiconductor device package according to an embodiment may include: a package body; a diffusion unit; and a vertical cavity surface emitting laser (VCSEL) semiconductor device disposed on a support and under the diffusion unit. According to the embodiment, the package body may include the support, a first sidewall protruding to a first thickness from an edge region of an upper surface of the support and having a first upper surface of a first width, and a second sidewall protruding to a second thickness from the first upper surface of the first side wall and having a second upper surface of a second width, wherein the support, the first sidewall, and the second sidewall may be integrally formed with the same material.
    Type: Application
    Filed: December 13, 2017
    Publication date: January 30, 2020
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Baek Jun KIM, Ho Jae KANG, Hui Seong KANG, Keon Hwa LEE, Yong Gyeong LEE
  • Publication number: 20200006540
    Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
    Type: Application
    Filed: June 21, 2019
    Publication date: January 2, 2020
    Applicant: The Board of Trustees of the University of Illinois
    Inventors: Ralph G. NUZZO, John A. ROGERS, Etienne MENARD, Keon Jae LEE, Dahl-Young KHANG, Yugang SUN, Matthew MEITL, Zhengtao ZHU
  • Publication number: 20190378749
    Abstract: The present disclosure provides a method for transferring a semiconductor device using a micro-vacuum module, wherein the micro-vacuum module includes: a vacuum-forming substrate having a plurality of through-holes, which are connected to an external pump module and a vacuum control unit, formed; and a pattern-forming unit equipped with a single channel or a plurality of independent channels, which is coupled to the vacuum-forming substrate, wherein the plurality of channels are formed to be communicated respectively to a plurality of vacuum holes which have a smaller size than the size of a semiconductor device to be transferred, and the plurality of vacuum holes, having a diameter smaller than 100 ?m, are contacted to a micro semiconductor device having a width and a length of 100 ?m or smaller and the micro semiconductor device is transferred using vacuum adsorption.
    Type: Application
    Filed: December 19, 2018
    Publication date: December 12, 2019
    Inventors: Keon Jae Lee, Han Eol Lee, Tae Jin Kim, Jung Ho Shin, Sang Hyun Park
  • Patent number: 10436631
    Abstract: Disclosed is a piezoelectric voice recognition sensor, which includes a flexible thin film, a piezoelectric material layer laminated on the flexible thin film, and an electrode laminated on the piezoelectric material layer, wherein the electrode includes a plurality of frequency separation channels arranged in a row, and the plurality of frequency separation channels have different lengths from each other. The piezoelectric voice recognition sensor separates a voice, recognized using a plurality of frequency separation channels having a trapezoidal shape, through the plurality of channels depending on frequencies, and simultaneously converts the separated voice signals from mechanical vibration signals into electric signals by means of the flexible piezoelectric element so that the converted electric signals are recognized.
    Type: Grant
    Filed: June 9, 2016
    Date of Patent: October 8, 2019
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Keon Jae Lee, Jae Hyun Han, Daniel Joe
  • Patent number: 10399291
    Abstract: The present invention provides a smart contact lens including a sensor capable of non-invasively sensing an eye disease in real time and a drug reservoir, and smart glasses for controlling the smart contact lens.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: September 3, 2019
    Assignee: PHI BIOMED CO., LTD.
    Inventors: Sei Kwang Hahn, Young Chul Sung, Beom Ho Mun, Keon Jae Lee, Dohee Keum, Su Jin Kim
  • Patent number: 10374072
    Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: August 6, 2019
    Assignee: The Board of Trustees of the University of Illinois
    Inventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu
  • Patent number: 10290785
    Abstract: A laminating structure of an electronic device using a transferring element according to the present disclosure includes a target substrate, a bottom electrode formed on the target substrate, an electronic device which is bonded to the bottom electrode, a top contact formed on the electronic device, a transferring element which is placed between the bottom electrode and the electronic device on the target substrate, and a top electrode connected to the electronic device, wherein the transferring element attached to the carrier substrate comes into contact with the electronic device, and is then transferred onto the target substrate.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: May 14, 2019
    Assignee: CENTER FOR INTEGRATED SMART SENSORS FOUNDATION
    Inventors: Keon Jae Lee, Han Eol Lee, Do Hyun Kim, Jung Ho Shin, Seong Kwang Hong
  • Publication number: 20190103532
    Abstract: A laminating structure of an electronic device using a transferring element according to the present disclosure includes a target substrate, a bottom electrode formed on the target substrate, an electronic device which is bonded to the bottom electrode, a top contact formed on the electronic device, a transferring element which is placed between the bottom electrode and the electronic device on the target substrate, and a top electrode connected to the electronic device, wherein the transferring element attached to the carrier substrate comes into contact with the electronic device, and is then transferred onto the target substrate.
    Type: Application
    Filed: October 3, 2017
    Publication date: April 4, 2019
    Inventors: Keon Jae Lee, Han Eol Lee, Do Hyun Kim, Jung Ho Shin, Seong Kwang Hong
  • Patent number: 10172241
    Abstract: Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: January 1, 2019
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Kyung Wook Baek, Keon Jae Lee, Geon Tae Hwang, Hyeon Kyun Yoo, Do Hyun Kim, Yoo Sun Kim
  • Patent number: 10166400
    Abstract: Provided is a method for separating a nanogenerator, which includes laminating a buffer layer on a sacrificial substrate, making a nanogenerator on the buffer layer, laminating a metal layer on the nanogenerator and separating the nanogenerator from the buffer layer. Here, a nanogenerator is separated by using a stress difference between the sacrificial substrate and the metal layer, instead of an existing method in which a nanogenerator is separated from the sacrificial substrate by means of wet etching or the like. In particular, according to a difference between a tensile stress at the metal layer such as nickel and a compressive stress at the lower silicon substrate, the nanogenerator is intactly separated from the silicon oxide layer serving as a buffer layer. Therefore, the nanogenerator may be separated from the sacrificial substrate in a mechanical way, which is safer and more economic in comparison to an existing chemical separation method using an etching solution.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: January 1, 2019
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Keon Jae Lee, Myung Hwan Byun, Kwi Il Park, Geon Tae Hwang, Chang Kyu Chung
  • Publication number: 20180036974
    Abstract: The present invention provides a smart contact lens including a sensor capable of non-invasively sensing an eye disease in real time and a drug reservoir, and smart glasses for controlling the smart contact lens.
    Type: Application
    Filed: April 25, 2016
    Publication date: February 8, 2018
    Inventors: Sei Kwang HAHN, Young Chul SUNG, Beom Ho MUN, Keon Jae LEE, Dohee KEUM, Su Jin KIM
  • Publication number: 20180016403
    Abstract: Provided are a method for manufacturing a nano-pattern including: increasing a temperature of a self-assembling material applied on a substrate through light irradiation to form a self-assembly pattern, and a nano-pattern manufactured thereby. More particularly, the present invention relates to a method for manufacturing a nano-pattern capable of implementing various circuit patterns through simple dragging without using a photoresist pattern or chemical pattern in advance, implementing the nano-pattern on a substrate having a three-dimensional structure such as a flexible substrate as well as a flat substrate, and performing a process without a specific environmental restriction. In addition, the present invention relates to a method for manufacturing a nano-pattern capable of forming a large-area self-assembly pattern within a very short time, that is, several to several ten milliseconds (ms) by instantly irradiating high-energy flash light to instantly perform thermal annealing.
    Type: Application
    Filed: June 2, 2017
    Publication date: January 18, 2018
    Inventors: Sang Ouk KIM, Hyeong Min JIN, Keon Jae LEE, Seung Hyun LEE, Ju Young KIM
  • Publication number: 20170309733
    Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
    Type: Application
    Filed: June 30, 2017
    Publication date: October 26, 2017
    Inventors: Ralph G. NUZZO, John A. ROGERS, Etienne MENARD, Keon Jae LEE, Dahl-Young KHANG, Yugang SUN, Matthew MEITL, Zhengtao ZHU
  • Publication number: 20170299426
    Abstract: Disclosed is a piezoelectric voice recognition sensor, which includes a flexible thin film, a piezoelectric material layer laminated on the flexible thin film, and an electrode laminated on the piezoelectric material layer, wherein the electrode includes a plurality of frequency separation channels arranged in a row, and the plurality of frequency separation channels have different lengths from each other. The piezoelectric voice recognition sensor separates a voice, recognized using a plurality of frequency separation channels having a trapezoidal shape, through the plurality of channels depending on frequencies, and simultaneously converts the separated voice signals from mechanical vibration signals into electric signals by means of the flexible piezoelectric element so that the converted electric signals are recognized.
    Type: Application
    Filed: June 9, 2016
    Publication date: October 19, 2017
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Keon Jae Lee, Jae Hyun Han, Daniel Joe