Patents by Inventor Ker-Min Chen

Ker-Min Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6563353
    Abstract: A power-on control circuit for an integrated circuit of the type having plural voltage source. The circuit is powered on sequentially, thereby preventing bus contention. The power-on control circuit includes a power-on detection for generating an enabling signal and disabling signal to control output buffer. When the high voltage source is powered on and the low voltage is not, the output buffer is at a high impedance state to prevent bus contention. When the low voltage is powered on after the high voltage is powered on, the output buffer is at a normal state.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: May 13, 2003
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ker-Min Chen, Wen-Tai Wang
  • Publication number: 20030042946
    Abstract: A power-on control circuit for an integrated circuit of the type having plural voltage source. The circuit is powered on sequentially, thereby preventing bus contention. The power-on control circuit includes a power-on detection for generating an enabling signal and disabling signal to control output buffer. When the high voltage source is powered on and the low voltage is not, the output buffer is at a high impedance state to prevent bus contention. When the low voltage is powered on after the high voltage is powered on, the output buffer is at a normal state.
    Type: Application
    Filed: March 19, 2002
    Publication date: March 6, 2003
    Inventors: Ker-Min Chen, Wen-Tai Wang
  • Patent number: 6479845
    Abstract: A method of routing power supply voltage electrodes and reference voltage electrodes which makes efficient use of chip area, maximizes decoupling capacitance, and reduces voltage drops due to electrode resistance is described. The two top wiring layers of an integrated circuit chip are used as power distribution layers to distribute the power supply voltage and reference voltage so that the power supply voltage bus electrode and reference voltage bus electrode are in separate wiring layers. The chip is partitioned into a number of sub-blocks with spaces between the sub-blocks. In a first wiring layer the power supply voltage bus electrode is routed so as to surround each of the sub-blocks. In a second wiring layer the reference voltage bus electrode is routed so as to surround each of the sub-blocks.
    Type: Grant
    Filed: September 6, 2001
    Date of Patent: November 12, 2002
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventor: Ker-Min Chen
  • Publication number: 20020048923
    Abstract: A method of routing power supply voltage electrodes and reference voltage electrodes which makes efficient use of chip area, maximizes decoupling capacitance, and reduces voltage drops due to electrode resistance is described. The two top wiring layers of an integrated circuit chip are used as power distribution layers to distribute the power supply voltage and reference voltage so that the power supply voltage bus electrode and reference voltage bus electrode are in separate wiring layers. The chip is partitioned into a number of sub-blocks with spaces between the sub-blocks. In a first wiring layer the power supply voltage bus electrode is routed so as to surround each of the sub-blocks. In a second wiring layer the reference voltage bus electrode is routed so as to surround each of the sub-blocks.
    Type: Application
    Filed: September 6, 2001
    Publication date: April 25, 2002
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
    Inventor: Ker-Min Chen
  • Patent number: 6306745
    Abstract: A method of routing power supply voltage electrodes and reference voltage electrodes which makes efficient use of chip area, maximizes decoupling capacitance, and reduces voltage drops due to electrode resistance is described. The two top wiring layers of an integrated circuit chip are used as power distribution layers to distribute the power supply voltage and reference voltage so that the power supply voltage bus electrode and reference voltage bus electrode are in separate wiring layers. The chip is partitioned into a number of sub-blocks with spaces between the sub-blocks. In a first wiring layer the power supply voltage bus electrode is routed so as to surround each of the sub-blocks. In a second wiring layer the reference voltage bus electrode is routed so as to surround each of the sub-blocks.
    Type: Grant
    Filed: September 21, 2000
    Date of Patent: October 23, 2001
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventor: Ker-Min Chen
  • Patent number: RE34768
    Abstract: A modified epoxy resin composition for use in making a printed circuit board comprising: (1) a modified epoxy resin obtained by reacting (a) a low molecular weight epoxy resin having at least two epoxy groups which .[.have.]. .Iadd.has .Iaddend.the following formula, ##STR1## (b) .[.a mono-nucleus chain tending agent containing N-heterocyclic fatty groups and.]. .Iadd.an N-heterocyclic fatty amino chain-extended agent .Iaddend.at least two active hydrogen atoms and represented by the formulas, and (c) at least one catalyst for catalyzing the reaction between components (a) and (b).
    Type: Grant
    Filed: April 29, 1992
    Date of Patent: October 25, 1994
    Assignee: Industrial Technology Research Institute
    Inventors: Tzong-Ming Lee, Ker-Min Chen