Abstract: An antenna device is provided. The antenna device includes a first substrate, a multilayer electrode, a second substrate, and a liquid-crystal layer. The multilayer electrode is disposed on the first substrate, and the multilayer electrode includes a first conductive layer, a second conductive layer, and a third conductive layer. The second conductive layer is disposed on the first conductive layer. The third conductive layer is disposed on the second conductive layer. The liquid-crystal layer is disposed between the first substrate and the second substrate. In addition, the third conductive layer includes a first portion that extends beyond the second conductive layer.

Abstract: An electronic device is provided. The electronic device includes a substrate and an electronic unit disposed on the substrate. The electronic unit includes a light-emitting diode, a conductive structure, a first driving circuit, and a second driving circuit. The conductive structure is disposed between the light-emitting diode and the substrate. The first driving circuit includes a first output wire. The second driving circuit includes a second output wire. The first driving circuit is electrically connected to the light-emitting diode by the conductive structure. The second driving circuit is electrically insulated from the light-emitting diode. In addition, the conductive structure at least partially overlaps the first output wire and the second output wire in a normal direction of the substrate.

Abstract: The disclosure provides a display device including a liquid crystal panel and a plurality of backlight units. The plurality of backlight units are configured to provide light to the liquid crystal panel. Each of the backlight units includes a driving substrate and a light-emitting element disposed on the driving substrate. The driving substrate includes a data line, a scanning line, and a driving circuit including three nodes. The three nodes of the driving circuit are respectively electrically connected to the data line, the scanning line, and the light-emitting element. The display device of the disclosure may have a relatively large size.

Abstract: The disclosure provides a light emitting device including a substrate and multiple pixels. The pixels are disposed on the substrate, each of the pixels includes multiple sub-pixels. Two adjacent sub-pixels are separated by a distance D, and one of the two adjacent sub-pixels has a height H. The distance and the height satisfy a relational expression: 0.3H<D?30H.

Abstract: A light emitting device of the present disclosure includes: a circuit board; a plurality of substrates including a first substrate and a second substrate, wherein the first substrate is disposed on the circuit board, and the second substrate is disposed on the circuit board and overlapped with the first substrate; a plurality of light emitting units disposed on the first substrate; a plurality of pixel driving circuits electrically connected to the plurality of light emitting units; and a plurality of gate driving circuits electrically connected to the plurality of pixel driving circuits, wherein at least a part of the plurality of pixel driving circuits or at least a part of the plurality of gate driving circuits are disposed on the second substrate.

Abstract: An electronic device includes a first sub-pixel and a test element. The first sub-pixel includes a first transistor, and a first electronic unit. The first electronic unit is electrically connected to the first transistor. The test element is electrically connected to the first transistor. The test element has a first impedance, the first electronic unit has a second impedance, and the first impedance is higher than the second impedance.

Abstract: An electronic device includes a substrate, a first light emitting unit, a second light emitting unit, a driving transistor, a first emission transistor, and a second emission transistor. The first light emitting unit and the second light emitting unit are disposed on the substrate. The driving transistor is electrically connected to a voltage source. The first emission transistor is electrically connected between the driving transistor and the first light emitting unit. The second emission transistor is electrically connected between the driving transistor and the second light emitting unit.

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

Abstract: A manufacturing method of a package structure including the following steps is provided. A carrier is provided. An anti-warpage structure is formed on the carrier. And a redistribution layer is formed on the carrier. In the normal direction of the carrier, a warpage trend of the anti-warpage structure is opposite to a warpage trend of the redistribution layer.

Abstract: A liquid crystal device comprises a first polymer substrate, a first buffer layer, thin film transistors, a liquid crystal layer and a second polymer substrate. The first buffer layer is disposed on the first polymer substrate. The thin film transistors are disposed on the first buffer layer. The liquid crystal layer is disposed on the thin film transistors. The second polymer substrate is disposed on the liquid crystal layer.

Abstract: A display device is provided. The display device includes a plurality of light-emitting modules. The at least one of the plurality of light-emitting modules includes a light-emitting unit group. The light-emitting unit group includes a plurality of light-emitting units coupled to each other in series. The first current source is coupled to the light-emitting unit group, and configured to provide a first current to drive the plurality of light-emitting units. The bypass unit includes a plurality of first switch units. The bypass unit is coupled to the light-emitting unit group in parallel. The plurality of first switch units are coupled to the plurality of light-emitting units in parallel.

Abstract: A light emitting apparatus and a display device are provided. The light emitting apparatus includes a light emitting unit and a pixel circuit. The pixel circuit is electrically connected to the light emitting unit. The pixel circuit includes a first driving transistor and a second driving transistor. The first driving transistor and the second driving transistor are configured to provide a first driving current and a second driving current to the light emitting unit at the same time, respectively. The first driving transistor includes a first gate terminal. The second driving transistor includes a second gate terminal. The first gate terminal and the second gate terminal are electrically connected to different nodes. The display device includes the light emitting apparatus.

Abstract: Some embodiments of the present disclosure provide a light-emitting diode package. The light-emitting diode package includes a transparent substrate. The light-emitting diode package also includes a first light-emitting diode which is disposed on the transparent substrate and has a first multiple quantum well structure. The light-emitting diode package further includes a second light-emitting diode which is disposed on the transparent substrate and has a second multiple quantum well structure. The first multiple quantum well structure and the second multiple quantum well structure are disposed to emit lights with different wavelengths.

Abstract: The disclosure provides an electronic apparatus and a manufacturing method thereof. The electronic apparatus includes a first insulating layer, a first metal layer, a second metal layer, and an electronic assembly. The first insulating layer includes a first surface and a second surface opposite to the first surface. The first metal layer has an opening and is formed on the first surface. The second metal layer is formed on the second surface and a projection of the opening on the second surface is overlapped with a projection of the second metal layer on the second surface. The electronic assembly is electrically connected with the first metal layer and the second metal layer.

Abstract: An electronic device and a method for manufacturing the same are disclosed. The method for manufacturing the electronic device includes the following steps: providing a substrate; forming a metal layer on the substrate, wherein the metal layer has a first surface; forming a first insulating layer on the first surface of the metal layer; forming a second insulating layer on the first insulating layer; etching the first insulating layer and the second insulating layer to form a contact hole, wherein the contact hole exposes a portion of the first surface; cleaning the portion of the first surface exposed by the contact hole with a solution; and forming a transparent conductive layer on the second insulating layer, wherein the transparent conductive layer electrically connects with the metal layer.

Abstract: An electronic device includes a substrate, a first circuit, a plurality of bonding pads and a diode. The first circuit is disposed on the substrate. The bonding pads are disposed on the substrate, wherein at least one of the bonding pads is electrically connected to the first circuit through a bridge line. The diode is disposed on the substrate and electrically connected to the first circuit through at least one of the bonding pads. The bridge line crosses over a data line in a top view.

Abstract: A tiled electronic device includes a plurality of display panels, and at least one of the display panels includes a flexible substrate, a pixel, and two signal wires. The flexible substrate has a display portion and a bent portion connected to the display portion. The pixel is disposed on the display portion. The signal wires are disposed on the flexible substrate, and electrically connected to the pixel. Each of the signal wires has a first segment disposed on the display portion, and a second segment disposed on the bent portion. The two first sections have a first pitch, and the two second sections have a second pitch. The first pitch is different than the second pitch.

Abstract: A light-emitting device and display equipment are disclosed. The light-emitting device includes a light-emitting unit. The light-emitting unit includes a driving transistor and a light-emitting diode. The driving transistor includes a first terminal, a second terminal and a gate terminal. The first terminal is used to receive an operation voltage. The light-emitting diode is coupled to the second terminal and used to receive a driving current. The operation voltage is variable.

Abstract: The present disclosure provides an electronic device providing a substrate, a first circuit, a plurality of bonding pads and a light emitting unit. The first circuit is disposed on the substrate. The bonding pads are disposed on the substrate, wherein at least one of the bonding pads includes a bonding part and a connecting part, and the bonding part is electrically connected to the first circuit through the connecting part. The light emitting unit is disposed on the substrate and corresponding to the bonding part, and the light emitting unit is electrically connected to the first circuit through at least one of the bonding pads. At least a portion of the first circuit is located between two of the bonding pads in a top view.

Abstract: An operation method of an electronic device for sensing an optical signal is provided. The electronic device includes a plurality of optical sensors and a plurality of light-emitting elements disposed adjacent to the plurality of optical sensors. The operation method of the electronic device for sensing the optical signal includes the following steps. The optical signal is provided to a first optical sensor of the plurality of optical sensors. The first optical sensor outputs a driving signal when dimming the plurality of light-emitting elements adjacent to the first optical sensor. Therefore, the accuracy of sensing the optical signal may be effectively increased.