Abstract: A charging system for a peripheral device, such as a stylus, including orientation control. The charging system includes charging circuitry and magnets. The magnets are configured so that they attract the peripheral device to an engagement surface when it is in a first orientation relative to the engagement surface so that charging circuitry in a peripheral device portion couples with charging circuitry in a charger portion. The magnets are configured so that they also repel and rotate the peripheral device when it is in a second orientation relative to the engagement surface.

Abstract: An impeller for a centrifugal blower includes at least one blade oriented in a radial direction of the impeller. The blade has an airfoil section with a radially inward end and a radially outward end that are thinner than at least one point between the radially inward end and the radially outward end.

Abstract: A charging system for a peripheral device, such as a stylus, including orientation control. The charging system includes charging circuitry and magnets. The magnets are configured so that they attract the peripheral device to an engagement surface when it is in a first orientation relative to the engagement surface so that charging circuitry in a peripheral device portion couples with charging circuitry in a charger portion. The magnets are configured so that they also repel and rotate the peripheral device when it is in a second orientation relative to the engagement surface.

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

Abstract: An impeller for a centrifugal blower includes at least one blade oriented in a radial direction of the impeller. The blade has an airfoil section with a radially inward end and a radially outward end that are thinner than at least one point between the radially inward end and the radially outward end.

Abstract: A charging system for a peripheral device, such as a stylus, including orientation control. The charging system includes charging circuitry and magnets. The magnets are configured so that they attract the peripheral device to an engagement surface when it is in a first orientation relative to the engagement surface so that charging circuitry in a peripheral device portion couples with charging circuitry in a charger portion. The magnets are configured so that they also repel and rotate the peripheral device when it is in a second orientation relative to the engagement surface.

Abstract: Aspects of the present disclosure include connection mechanisms for a peripheral computing device to connect with a mobile computing device. The peripheral computing device may include a device interface component that defines part of the connection mechanisms, and an electrical connection protrusion extending from the device interface component and configured to insert in a corresponding electrical receptacle of a computing device. The device interface component may also include a magnetically connectable docking member configured to magnetically attract or to be magnetically attracted to a corresponding docking component on the computing device. The device interface component may further include a support rail configured to support the electrical connection protrusion and the magnetically connectable docking member. The support rail may comprise a shoulder configured to define a pivot point to guide connecting the peripheral computing device with the computing device.

Abstract: A charging system for a peripheral device, such as a stylus, including orientation control. The charging system includes charging circuitry and magnets. The magnets are configured so that they attract the peripheral device to an engagement surface when it is in a first orientation relative to the engagement surface so that charging circuitry in a peripheral device portion couples with charging circuitry in a charger portion. The magnets are configured so that they also repel and rotate the peripheral device when it is in a second orientation relative to the engagement surface.

Abstract: Aspects of the present disclosure include connection mechanisms for a peripheral computing device to connect with a mobile computing device. The peripheral computing device may include a device interface component that defines part of the connection mechanisms, and an electrical connection protrusion extending from the device interface component and configured to insert in a corresponding electrical receptacle of a computing device. The device interface component may also include a magnetically connectable docking member configured to magnetically attract or to be magnetically attracted to a corresponding docking component on the computing device. The device interface component may further include a support rail configured to support the electrical connection protrusion and the magnetically connectable docking member. The support rail may comprise a shoulder configured to define a pivot point to guide connecting the peripheral computing device with the computing device.

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

Abstract: A computing device is described. The computing device includes a support structure with an interface surface that has a cross-sectional width. The computing device includes a cover adhered to the interface surface of the support structure along an entirety of the cross-sectional width of the interface surface. A method of manufacturing a computing device is described. The method includes applying an adhesive to a cover. A support structure of a computing device is heated. The support structure is cooled. While the support structure is heated and cooled, pressure is applied to the cover.

Abstract: Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.

Abstract: Thermal management devices for a computing device are described herein. A thermal management device includes a layer of a first material included in a dynamic portion of the thermal management device and a static portion of the thermal management device. The dynamic portion of the thermal management device is bendable relative to the static portion of the thermal management device when the thermal management device is physically connected to a display and a chassis of the computing device, and the display rotates relative to a chassis. The layer of material has a first side and a second side. The second side is opposite the first side. The thermal management device also includes a first layer of a second material and a second layer of the second material physically connected to the first side and the second side of the static portion of the layer of the first material, respectively.

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

Abstract: The trackpad assemblies described herein maintain minimum overall stiffness, weight, and cost requirements of a trackpad assembly, while permitting a decrease in trackpad assembly thickness as compared to conventional trackpad assemblies. The trackpad assemblies may include one or more of a four-layer PCB, structural adhesives, a structural PCB stiffener, and a structural shield assembly. These stiffening features permit increasingly thinner trackpad assemblies and associated computing devices.

Abstract: The trackpad assemblies described herein maintain minimum overall stiffness, weight, and cost requirements of a trackpad assembly, while permitting a decrease in trackpad assembly thickness as compared to conventional trackpad assemblies. The trackpad assemblies may include one or more of a four-layer PCB, structural adhesives, a structural PCB stiffener, and a structural shield assembly. These stiffening features permit increasingly thinner trackpad assemblies and associated computing devices.

Abstract: A computing device is described. The computing device includes a support structure with an interface surface that has a cross-sectional width. The computing device includes a cover adhered to the interface surface of the support structure along an entirety of the cross-sectional width of the interface surface. A method of manufacturing a computing device is described. The method includes applying an adhesive to a cover. A support structure of a computing device is heated. The support structure is cooled. While the support structure is heated and cooled, pressure is applied to the cover.

Abstract: Thermal management devices for a computing device are described herein. A thermal management device includes a layer of a first material included in a dynamic portion of the thermal management device and a static portion of the thermal management device. The dynamic portion of the thermal management device is bendable relative to the static portion of the thermal management device when the thermal management device is physically connected to a display and a chassis of the computing device, and the display rotates relative to a chassis. The layer of material has a first side and a second side. The second side is opposite the first side. The thermal management device also includes a first layer of a second material and a second layer of the second material physically connected to the first side and the second side of the static portion of the layer of the first material, respectively.

Abstract: An optical system with a base and an image sensor fixed to the base. The optical system includes a holder fixed to the base about the image sensor. The optical system includes a collar oriented about the image sensor and the holder. The optical system includes a lens barrel oriented about the image sensor, the holder, and the collar. The lens barrel includes at least one lens oriented therein. Two of the holder, collar, and lens barrel are threaded together.

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.