Abstract: Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.

Abstract: An optical system with a base and an image sensor fixed to the base. The optical system includes a holder fixed to the base about the image sensor. The optical system includes a collar oriented about the image sensor and the holder. The optical system includes a lens barrel oriented about the image sensor, the holder, and the collar. The lens barrel includes at least one lens oriented therein. Two of the holder, collar, and lens barrel are threaded together.

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

Abstract: Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.

Abstract: Various implementations relating to an illumination package including an edge-emitting laser diode (EELD) are disclosed. In one embodiment, an illumination package includes a heat spreader including a base and a stub that extends from the base, an EELD configured to generate illumination light, the EELD being mounted to a side surface of the stub, and a substrate coupled to the base at a location spaced from the EELD, the substrate being electrically connected to the EELD.

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

Abstract: Various implementations relating to an illumination package including an edge-emitting laser diode (EELD) are disclosed. In one embodiment, an illumination package includes a heat spreader including a base and a stub that extends from the base, an EELD configured to generate illumination light, the EELD being mounted to a side surface of the stub, and a substrate coupled to the base at a location spaced from the EELD, the substrate being electrically connected to the EELD.

Abstract: An apparatus, method and system is described herein for providing multiple maximum current configuration options including corresponding turbo frequencies for a processing device. Available options for a processor are determined by initialization code. And based on platform electrical capabilities, an optimal one of the multiple current configuration options is selected. Moreover, during runtime another current configuration is dynamically selected based on current configuration considerations to provide high flexibility and best possible performance per part and computing platform.

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

Abstract: A method for managing component performance is described. The method includes determining an angle of a computer processor with respect to gravity. The electronic device includes a computer processor. A parameter is selected for the computer processor. A speed of the computer processor is based on the parameter. A value of the parameter is selected based on the angle. The value of the parameter is set based on the selection.

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

Abstract: Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.

Abstract: Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

Abstract: An apparatus, method and system is described herein for providing multiple maximum current configuration options including corresponding turbo frequencies for a processing device. Available options for a processor are determined by initialization code. And based on platform electrical capabilities, an optimal one of the multiple current configuration options is selected. Moreover, during runtime another current configuration is dynamically selected based on current configuration considerations to provide high flexibility and best possible performance per part and computing platform.

Abstract: An adapter for converting a full size aircraft bomb rack into a rack capable of supporting reduced size bombs or stores. The full size bomb rack includes a bomb ejection mechanism capable of delivering an ejection force to a full size bomb. The adapter includes an elongated plate having a body portion defining a planar center portion and end portions. The end portions include laterally extending sway braces for reducing lateral swaying of the reduced size store or bomb. The adapter plate is mounted between the reduced size store and the full size adapter rack. The body portion of the adapter rack includes apparatus for ejecting a reduced size store from the elongated plate. A first opening is arranged adjacent to one end portion of the elongated plate for receiving fasteners carried by the reduced size store which attach the store to the full size bomb rack. These fasteners are passed through an opening in the elongated plate.

Abstract: A cooling device, such as for cooling a chip and socket may have a centrifugal blower outside of a radial heatsink. In addition, supports for coupling the blower to a center motor may comprise overhead fan blades effectively creating a radial fan in series with the blower to maximize airflow and pressure capability and to minimize the noise. The vertical location of blower may further allow to improve motherboard component as well as system cooling all while reducing the vertical profile of the cooling device.

Abstract: According to some embodiments, systems for improved passive liquid cooling may be provided. In some embodiments, a system may comprise an evaporator and a condenser. According to some embodiments, the evaporator may comprise a first side to receive heat, a second side, and one or more fins protruding from the second side. In some embodiments, the condenser may comprise an inner surface defining a cavity and one or more grooves, a first end coupled to the evaporator such that the one or more fins of the evaporator are disposed within the cavity, and a second end, wherein the one or more grooves extend at least partially between the first and second ends of the condenser.

Abstract: A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending outwardly from the core. The fins may be at least partially curved. Each fin may split into a plurality of tines that extend away from the core.

Abstract: A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending outwardly from the core. The fins may be at least partially curved. Each fin may split into a plurality of tines that extend away from the core.