Abstract: A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending outwardly from the core. The fins may be at least partially curved. Each fin may split into a plurality of tines that extend away from the core.

Abstract: A heat sink for a microprocessor includes a thermally conductive base having a plurality of substantially parallel, arcuate fin structures extending outwardly in a vertical direction from the thermally conductive base. The plurality of substantially parallel fin structures have a high fin density to enhance heat dissipation from the heat sink. In one embodiment, a shroud encloses the fin structures and is attached to the thermally conductive base via latches that fit into a pair of grooves in the bottom surface of the thermally conductive base. A fan is attached to the shroud to direct a convection medium through the plurality of substantially parallel fin structures. Also described is a method of fabricating a heat sink assembly.

Abstract: A heat sink apparatus includes a first heat sink thermally coupled with at least a first component of a substrate, and a second heat sink thermally coupled with at least a second component of the substrate. The apparatus further includes a unitary retention module coupled with the first heat sink and the second heat sink, where the unitary retention module is also coupled with the substrate.

Abstract: An integrated circuit system has an increased reliability when subjected to stress and vibration. The system includes heat sink retention clips that provide support to the retention system when an upward force is applied to a heat sink. An EMI shield can be provided that provides peripheral shielding for the circuit package thermally coupled to the heat sink.