Abstract: A chip component includes a magnetic substrate having ferrite layers, and an insulating layer disposed on the magnetic substrate and having an electrode disposed therein. An external electrode is connected to the electrode on the insulating layer. The magnetic substrate and the insulating layer have a chemical coupling structure formed on an interface therebetween. The chemical coupling structure includes Si—O—C or Si—O—N.

Abstract: The present invention relates to a glycol chitosan-based hydrogel containing only natural polysaccharides without use of a toxic crosslinking agent. The hydrogel of the present invention exhibits a self-healing behavior under physiological conditions and in the presence of iron oxide nanoparticles, and thus can be useful for use as a delivery system for injection. In addition, in the hydrogel of the present invention, a delivery rate or amount of a substance carried within the hydrogel can be regulated using the magnetic field, which allows the hydrogel to be used for a variety of drug delivery and tissue engineering applications with on-demand release of gel payloads under external magnetic stimulation. The hydrogel can be effectively used as a delivery vehicle for a physiologically active substance such as a therapeutic agent.

Abstract: A prepreg includes a core layer, a first resin layer including a first resin material and laminated on a first side of the core layer, the first resin material impregnating a portion of the core layer, and a second resin layer including a second resin material and laminated on a second side of the core layer, the second resin material impregnating a portion of the core layer so as to form a non-linear joint interface with the first resin material.

Abstract: A prepreg, a printed circuit board and a method of manufacturing the same are provided. A prepreg includes a core layer including nanofibers having a thickness in a range of 10 to 100 nm, a first insulating layer on a first surface of the core layer, and a second insulating layer on a second surface of the core layer.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a light-blocking glass substrate; a negative photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and embedded in the negative photosensitive insulating layer.

Abstract: A common mode filter is disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a coil pattern formed on the magnetic substrate; a dielectric layer formed on the magnetic substrate so as to cover an upper part, a lower part and a side surface of the coil pattern; and a first coupling agent interposed between the magnetic substrate and the dielectric layer so as to prevent the magnetic substrate and the dielectric layer from being separated.

Abstract: An electronic component embedded substrate is disclosed. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core substrate having a cavity formed therein; a plurality of electronic components embedded in the cavity and arranged in a predetermined format; and a plurality of dielectric spacers interposed in between the plurality of electronic components that are adjacent to one another in the cavity.

Abstract: Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature.

Abstract: An electronic component embedded substrate is disclosed. The electronic component embedded substrate in accordance with an embodiment of the present invention includes: a core substrate having a cavity formed therein; a plurality of electronic components embedded in the cavity and arranged in a predetermined format; and a plurality of dielectric spacers interposed in between the plurality of electronic components that are adjacent to one another in the cavity.

Abstract: Disclosed herein is a multilayer inductor, manufactured by stacking laminates each including: a substrate having internal electrode coil patterns formed thereon; and a magnetic substance filling the substrate on which the internal electrode coil patterns are formed, wherein the substrate is formed by using a composition including a magnetic material, so that, when the substrate is placed in the middle of the electrode circuit patterns at the time of manufacturing a power inductor, the substrate can be utilized as a gap material, and thus the thickness of an inductor chip can be minimized, and, in addition, the magnetic material is included in the substrate forming composition, thereby improving magnetic characteristics, and the liquid crystal oligomer and the nanoclay are added to the composition, to thereby increase insulating property between magnetic metals, thereby raising inductance, and thus dimensional stability and physical hardness of the structure can be secured.

Abstract: Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded into the porous scaffold and the insulating material and having internal electrodes exposed on both surfaces thereof.

Abstract: Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded into the porous scaffold and the insulating material and having external electrodes formed on both surfaces thereof.

Abstract: A common mode filter is disclosed. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a coil pattern formed on the magnetic substrate; a dielectric layer formed on the magnetic substrate so as to cover an upper part, a lower part and a side surface of the coil pattern; and a first coupling agent interposed between the magnetic substrate and the dielectric layer so as to prevent the magnetic substrate and the dielectric layer from being separated.

Abstract: Disclosed herein are a prepreg for a printed circuit board, a manufacturing method thereof, and a printed circuit board including the same. More particularly, the manufacturing method of a prepreg for a printed circuit board includes: coating an insulating composition on each of the two carrier films to form an insulating layer and drying the coated insulating composition to form first and second carrier substrates; disposing glass fiber between the insulating layers of the first and second carrier substrates and bonding the first and second carrier substrates to each other to form a laminated substrate; pressing the laminated substrate; and removing the carrier film from the laminated substrate subjected to the pressing. The prepreg may be manufactured so as to have the desired thickness or maintain a uniform thickness, such that thickness quality may be stabilized, and a coefficient of thermal expansion property may be improved.

Abstract: A chip component includes a magnetic substrate having ferrite layers, and an insulating layer disposed on the magnetic substrate and having an electrode disposed therein. An external electrode is connected to the electrode on the insulating layer. The magnetic substrate and the insulating layer have a chemical coupling structure formed on an interface therebetween. The chemical coupling structure includes Si—O—C or Si—O—N.

Abstract: Disclosed herein are a copper clad laminate for a printed circuit board, in which a composite having a glass fibers formed on both sides of a prepreg is disposed between a resin layer of a first resin-coated copper foil (RCC) and a resin layer of a second resin-coated copper foil and having a structure in which the resin layers are symmetric or asymmetric based on the composite, and a manufacturing method thereof. A thickness of the copper clad laminate may be manufactured at the desired thickness or the thickness may be uniformly maintained, such that stabilization of thickness quality may be implemented, the adhesion between the copper foil and the resin may be improved, and warpage may be adjusted when laminating substrates having different upper and lower thermal expansion coefficients.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. According to the preferred embodiment of the present invention, the printed circuit board includes: a glass substrate through which light is not transmitted; a positive photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and buried in the positive photosensitive insulating layer.

Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a light-blocking glass substrate; a negative photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and embedded in the negative photosensitive insulating layer.

Abstract: Disclosed herein are a core substrate and a method of manufacturing the same. The core substrate includes: a glass substrate made of an insulating material and a photosensitive insulating layer formed on at least one of one surface and the other surface of the glass substrate. With the core substrate and the method of manufacturing the same, fine circuit patterns may be formed and generation of a defect such as separation of a circuit pattern may be decreased.

Abstract: An inorganic filler has a negative coefficient of thermal expansion, and a shell thereon that decreases diffusion of ions contained in the inorganic filler to outside of the shell and organic filler.