Patents by Inventor Keun-Yong Lee

Keun-Yong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150002253
    Abstract: Disclosed herein are a thin-layer type common mode filter and a method for preparing the same. The thin-layer type common mode filter includes: a ferrite substrate; a primer layer formed on the ferrite substrate; and a photosensitive insulating layer formed on the primer layer, wherein the primer layer is formed by chemically coupling the ferrite substrate with the photosensitive insulating layer. Therefore, the thin-layer type common mode filter according to the exemplary embodiments of the present invention may simultaneously apply the mechanical surface treatment method and the primer layer chemically coupled with the ferrite substrate and the photosensitive insulating layer to increase the interlayer adhesion, thereby increasing the reliability of the common mode filter.
    Type: Application
    Filed: April 23, 2014
    Publication date: January 1, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Il KWON, Eun Sil KIM, Keun Yong LEE, Sang Hyun SHIN
  • Patent number: 8829155
    Abstract: The present invention relates to a poly(p-xylylene)-based polymer having a low dielectric constant suitable for low loss dielectrics (LLD), and an insulating material, a printed circuit board and a functional element using the same. More particularly, the poly(p-xylylene)-based polymer includes at least one repeat unit expressed by the following formula (1): wherein, at least one of R1, R2, R7 and R8 is independently substituted or unsubstituted C6-C20 aryl; the rest of R1 to R8 are each and independently H, substituted or unsubstituted linear C1-C3 alkyl, or substituted or unsubstituted branched C1-C3 alkyl; and n is an integer of 400 to 900.
    Type: Grant
    Filed: February 12, 2009
    Date of Patent: September 9, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae-Choon Cho, Andreas Greiner, Do-Yeung Yoon, Jun-Rok Oh, Keun-Yong Lee, Moon-Soo Park
  • Patent number: 8822832
    Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: September 2, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Seok Moon, Seong Hyun Yoo, Keun Yong Lee, Hyun Jun Lee
  • Patent number: 8790843
    Abstract: A fuel cell stack includes a plurality of membrane electrode assemblies (MEAs) and a stamped metal separator. The metal separator is positioned between the membrane electrode assemblies. The separator includes at least one channel on both surfaces of the separator formed by a stamping process. The separator comprises a plurality of holes, each of which form a manifold communicating with each the channels.
    Type: Grant
    Filed: January 24, 2008
    Date of Patent: July 29, 2014
    Assignee: Samsung SDI Co., Ltd
    Inventors: Young-Seung Na, Jun-Won Suh, In-Seob Song, Keun-Yong Lee, Sung-Won Jeong, Chan-Gyun Shin
  • Publication number: 20140154479
    Abstract: Disclosed herein is a resin composition for a printed circuit board, including: a liquid crystalline oligomer; an epoxy resin; and an inorganic filler which is a reaction product of silica, silane having a vinyl group and an alkoxy group, and vinyl or hydroxyl terminated silicone oil. The resin composition has a low thermal expansion coefficient, excellent heat resistance and a high glass transition temperature.
    Type: Application
    Filed: March 17, 2013
    Publication date: June 5, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Geum Hee Yun, Jin Ho Hong, Sa Yong Lee, Jin Young Kim, Keun Yong Lee
  • Publication number: 20140147639
    Abstract: Disclosed herein are a resin composition of a printed circuit board including a liquid crystal oligomer, an epoxy resin, and a phenolic curing agent having five or more functional groups, an insulating film and a prepreg manufactured using the resin composition, and a printed circuit board including the insulating film or the prepreg. The resin composition for a printed circuit board according to the present invention, and the insulating film and the prepreg manufactured using the same, may have low coefficient of thermal expansion, excellent heat resistance property, and a high glass transition temperature.
    Type: Application
    Filed: March 15, 2013
    Publication date: May 29, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jin Seok Moon, Hyun Jun Lee, Keun Yong Lee, Seong Hyun Yoo
  • Publication number: 20140145812
    Abstract: Disclosed herein is a multilayer inductor, manufactured by stacking laminates each including: a substrate having internal electrode coil patterns formed thereon; and a magnetic substance filling the substrate on which the internal electrode coil patterns are formed, wherein the substrate is formed by using a composition including a magnetic material, so that, when the substrate is placed in the middle of the electrode circuit patterns at the time of manufacturing a power inductor, the substrate can be utilized as a gap material, and thus the thickness of an inductor chip can be minimized, and, in addition, the magnetic material is included in the substrate forming composition, thereby improving magnetic characteristics, and the liquid crystal oligomer and the nanoclay are added to the composition, to thereby increase insulating property between magnetic metals, thereby raising inductance, and thus dimensional stability and physical hardness of the structure can be secured.
    Type: Application
    Filed: March 15, 2013
    Publication date: May 29, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sa Yong LEE, Jin Young KIM, Keun Yong LEE, Geum Hee YUN, Moon Soo PARK
  • Publication number: 20140106147
    Abstract: Disclosed herein is a prepreg including: a reinforcement substrate; and a polymer resin layer formed by impregnating a polymer resin containing a liquid crystal oligomer and an inorganic filler on the reinforcement substrate, wherein an impregnation ratio of the polymer resin is 60 to 85 wt., whereby a product manufactured by using the prepreg may have excellent coefficient of thermal expansion and thermal properties.
    Type: Application
    Filed: January 2, 2013
    Publication date: April 17, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyun Jun Lee, Seong Hyun Yoo, Jeong Kyu Lee, Jin Seok Moon, Keun Yong Lee
  • Publication number: 20140079924
    Abstract: The present invention relates to a resin composition for a package substrate and a package substrate comprising a core layer and a prepreg using the same, which include a polyester amide liquid crystal oligomer, a bisphenol tetrafunctional epoxy resin, a curing agent, and an inorganic filler, wherein the bisphenol tetrafunctional epoxy resin has a viscosity of greater than 20,000 cps. According to the resin composition for a package substrate in accordance with the present invention can provide a package substrate with reduced substrate warpage by improving heat radiation characteristics of a substrate material. Further, it is possible to improve defects by reducing delamination between a chip and the substrate or occurrence of cracks of solder balls through the reduced substrate warpage characteristics.
    Type: Application
    Filed: March 14, 2013
    Publication date: March 20, 2014
    Applicant: Samsung Electro-Mechanisc Co., Ltd.
    Inventors: Jin Seok MOON, Hyun Jun Lee, Jeong Kyu Lee, Seong Hyun Yoo, Keun Yong Lee
  • Publication number: 20140076198
    Abstract: Disclosed herein are an epoxy resin composition for insulation, and an insulating film, a prepreg, and a printed circuit board, manufactured using the same, the epoxy resin composition including: a chitin nanoparticle or a chitin nanofiber; a liquid crystal oligomer or a soluble liquid crystal thermosetting oligomer; an epoxy resin; and an inorganic filler, so that the epoxy resin composition, the insulating film, and the prepreg can have a low coefficient of thermal expansion, a high glass transition temperature, and high rigidity.
    Type: Application
    Filed: January 7, 2013
    Publication date: March 20, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Young Kim, Sa Yong Lee, Geum Hee Yun, Keun Yong Lee
  • Publication number: 20140080941
    Abstract: The present invention relates to an insulating composition for a multilayer printed circuit board including: nanoclay 0.5 to 10 wt %, a soluble liquid crystal oligomer 5 to 50 wt %, an epoxy resin 5 to 50 wt %, a solvent 5 to 40 wt %, and an inorganic filler 50 to 80 wt %, a prepreg and an insulating film using the composition, and a multilayer printed circuit board including the prepreg and the insulating film as an interlayer insulating layer. Accordingly, the composition prepared by mixing nanoclay with the soluble liquid crystal oligomer (LCO), the epoxy resin, and the inorganic filler having excellent thermal, electrical, and mechanical characteristics can be implemented as a substrate insulating material such as a prepreg or a film which can implement a low efficient of thermal expansion, high rigidity, and high thermal characteristics required for a package substrate with advanced specifications.
    Type: Application
    Filed: September 13, 2013
    Publication date: March 20, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sa Yong LEE, Jin Young KIM, Jin Ho HONG, Keun Yong LEE
  • Publication number: 20140080940
    Abstract: Disclosed herein are a resin composition for insulation, and an insulating film, a prepreg, and a printed circuit board, manufactured using the same, the resin composition including: a cellulose nanoparticle or a cellulose nanofiber; a liquid crystalline oligomer or a soluble liquid crystalline thermohardenable oligomer; an epoxy resin; and an inorganic filler, so that the resin composition, the insulating film, and the prepreg can have a low coefficient of thermal expansion, a high glass transition temperature, and high rigidity.
    Type: Application
    Filed: January 2, 2013
    Publication date: March 20, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sa Yong Lee, Jin Young Kim, Keun Yong Lee
  • Publication number: 20140077129
    Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition for a printed circuit board including a liquid crystal oligomer, an epoxy resin, an amino triazine novolac hardener, and an inorganic filler; the insulating film and the prepreg each being manufactured by using the resin composition; and the multilayer printed circuit board including the insulating film or the prepreg.
    Type: Application
    Filed: February 28, 2013
    Publication date: March 20, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Seok Moon, Seong Hyun Yoo, Keun Yong Lee, Hyun Jun Lee
  • Publication number: 20140066545
    Abstract: Disclosed herein are an epoxy resin composition for a printed circuit board, an insulating film, a prepreg, and a multilayer printed circuit board, the epoxy resin composition including a liquid crystal oligomer having a low coefficient of thermal expansion and an improved glass transition temperature, and the like.
    Type: Application
    Filed: November 28, 2012
    Publication date: March 6, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Seok Moon, Hyun Jun Lee, Jeong Kyu Lee, Seong Hyun Yoo, Keun Yong Lee
  • Publication number: 20140063427
    Abstract: There is provided a resin composition for a thermal radiation board including: 20 wt % to 50 wt % of a liquid crystal oligomer represented by particular Chemical Formulas; 10 wt % to 40 wt % of an epoxy resin; and 10 wt % to 40 wt % of an inorganic filter.
    Type: Application
    Filed: November 21, 2012
    Publication date: March 6, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Kyu LEE, Seong Hyun Yoo, Hyun Jun Lee, Jin Seok Moon, Keun Yong Lee
  • Publication number: 20140034367
    Abstract: Disclosed herein are an epoxy resin composition, an insulating film using the same, and a multilayer printed circuit board; more particularly, an epoxy resin composition including a liquid crystal capable of lowering the coefficient of thermal expansion, improving chemical resistance, and increasing the glass transition temperature, an insulating film or prepreg manufactured by using the epoxy resin composition, and a multilayer printed circuit board including the insulating film or prepreg.
    Type: Application
    Filed: May 13, 2013
    Publication date: February 6, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Kyu Lee, Seong Hyun Yoo, Hyun Jun Lee, Jin Seok Moon, Keun Yong Lee
  • Publication number: 20140002226
    Abstract: Disclosed herein are an inductor and a method of manufacturing the same. More specifically, in the inductor according to the present invention, a coil with a fine pattern may be formed, and an insulating resin composite including liquid crystal oligomer for reducing occurrence of deformation of the coil may be used for an insulating substrate.
    Type: Application
    Filed: April 29, 2013
    Publication date: January 2, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Seok Moon, Sung Kwon Wi, Jeong Kyu Lee, Keun Yong Lee, Hyun Jun Lee, Seong Hyun Yoo
  • Publication number: 20130098666
    Abstract: There is provided a resin composition for a printed circuit board, including 100 parts by weight of a liquid crystal oligomer shown in a predetermined Formula; and 10 to 40 parts by weight of a rubber-modified epoxy resin.
    Type: Application
    Filed: December 30, 2011
    Publication date: April 25, 2013
    Inventor: Keun Yong LEE
  • Patent number: 8232021
    Abstract: A fuel cell stack including an electricity generating unit for generating electrical energy by electrochemically reacting a fuel and an oxidizing agent, the electricity generating unit including: a first separator; a second separator; a membrane electrode assembly (MEA) between the first separator and the second separator, each of the first and second separators including a channel on a surface facing the MEA and a manifold in the surface facing the MEA, the manifold communicating with the channel; and a gasket, positioned at an outer circumference portion of an area where the MEA is positioned, for sealing a space between the first and second separators and for covering an open area of a channel extension area of at least one of the first and second separators where the manifold communicates with the channel.
    Type: Grant
    Filed: March 24, 2008
    Date of Patent: July 31, 2012
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Jun-Won Suh, Young-Seung Na, Keun-Yong Lee, Sung-Won Jeong, Chan-Gyun Shin, Kyoung-Hwan Choi, Sang-Kyun Kang
  • Patent number: 8105663
    Abstract: Disclosed herein is a composition for forming a substrate, comprising: a liquid crystal thermosetting oligomer having one or more soluble structural units in the main chain thereof and having thermosetting groups at one or more ends of the main chain thereof; and a metal alkoxide compound having reaction groups which can be covalently bonded with the thermosetting groups.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: January 31, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd
    Inventors: Keun Yong Lee, Jun Rok Oh, Seong Hyun Yoo