Abstract: The present invention relates to insect odorant receptor genes and methods for identifying odorant receptor genes. The invention provides nucleotide sequences of insect odorant receptor genes Or83b, amino acid sequences of their encoded proteins (including peptides or polypeptides), and related products and methods. The nucleic acids of the invention may be operatively linked to promoter sequences and transformed into host cells. Methods of production of an Or83b odorant receptor protein (e.g., by recombinant means), and derivatives and analogs thereof, are provided. Antibodies to an Or83b odorant receptor protein, and derivatives and analogs thereof, are provided. Methods for identifying molecules that bind or modulate the activity of these Or83b odorant receptor genes are provided. Molecules found to bind or modulate the activity of Or83b genes may be formulated into pest control agents by providing a carrier.

Abstract: Embodiments of buffer coatings for semiconductor and integrated circuit manufacturing are presented herein.

Abstract: An apparatus comprises a semiconductor substrate having a device layer, a plurality of metallization layers, a passivation layer, and a metal bump formed on the passivation layer that is electrically coupled to at least one of the metallization layers. The apparatus further includes a solder limiting layer formed on the passivation layer that masks an outer edge of the top surface of the metal bump, thereby making the outer edge of the top surface non-wettable to a solder material.

Abstract: Embodiments of buffer coatings for semiconductor and integrated circuit manufacturing are presented herein, wherein the buffer coating is provided by mechanically blending a first polymer with at least a second polymer. The mechanically blended polymers producing a buffer coating that provides a barrier that is has an increased toughness and decreased shrinkage.

Abstract: A multi-layer thick metallization structure for a microelectronic device includes a first barrier layer (111), a first metal layer (112) over the first barrier layer, a first passivation layer (113) over the first metal layer, a via structure (114) extending through the first passivation layer, a second barrier layer (115) over the first passivation layer and in the via structure, a second metal layer (116) over the second barrier layer, and a second passivation layer (117) over the second metal layer and the first passivation layer.

Abstract: The present invention relates to insect odorant receptor genes and methods for identifying odorant receptor genes. The invention provides nucleotide sequences of insect odorant receptor genes Or83b, amino acid sequences of their encoded proteins (including peptides or polypeptides), and related products and methods. The nucleic acids of the invention may be operatively linked to promoter sequences and transformed into host cells. Methods of production of an Or83b odorant receptor protein (e.g., by recombinant means), and derivatives and analogs thereof, are provided. Antibodies to an Or83b odorant receptor protein, and derivatives and analogs thereof, are provided. Methods for identifying molecules that bind or modulate the activity of these Or83b odorant receptor genes, are provided. Molecules found to bind or modulate the activity of Or83b genes may be formulated into pest control agents by providing a carrier.

Abstract: A composite photoresist comprises a photoresist material and a filler material dispersed within the photoresist material, wherein the filler material includes a plurality of nanoparticles. The photoresist material may comprise an acrylic-based photoresist, a novolak-based photoresist, a polyhydroxystyrene-based photoresist, a SLAM, or a BARC. The filler material may comprise base-soluble styrene-butadiene rubber nanospheres, nitrile-butadiene rubber nanospheres, polystyrene-based nanoparticles, acrylic-based nanoparticles, or inorganic nanoparticles. The nanoparticles may have an average diameter that is between around 10 nm and around 1000 nm and may have a loading in the photoresist material that is between around 5% and 50%. The composite photoresist may be used to form die-side metal bumps for use in a C4 connection that have a roughened sidewall surface but a smooth top surface.

Abstract: Embodiments of silicon semiconductor wafers and die having surface marks are described herein. A laser, or other marking tool, may be used to mark, substantially all of a surface of an IC wafer with surface marks, such as microdimples, that camouflage or reduce or eliminate the visibility of any surface imperfections such as smudges, scratches, or other marks that may reduce the marketability of packaged IC's where such surface imperfections are visible to the end customer. By marking the wafer prior to dicing, the entire surface of each individual die may have its entire bottom surface marked. Other embodiments are also described.

Abstract: The present invention relates to insect odorant receptor genes and methods for identifying odorant receptor genes. The invention provides nucleotide sequences of insect odorant receptor genes Or83b, amino acid sequences of their encoded proteins (including peptides or polypeptides), and related products and methods. The nucleic acids of the invention may be operatively linked to promoter sequences and transformed into host cells. Methods of production of an Or83b odorant receptor protein (e.g., by recombinant means), and derivatives and analogs thereof, are provided. Antibodies to an Or83b odorant receptor protein, and derivatives and analogs thereof, are provided. Methods for identifying molecules that bind or modulate the activity of these Or83b odorant receptor genes are provided. Molecules found to bind or modulate the activity of Or83b genes may be formulated into pest control agents by providing a carrier.

Abstract: An interconnect structure for a microelectronic device includes an electrically conductive material (130, 730, 930) adjacent to a metallization layer (120, 320, 920). The electrically conductive material has a base (131, 931) and a body (132, 932). The base is wider than the body. The base and the body form a single monolithic structure having no internal interface. The interconnect structure may be manufactured by providing a substrate (110, 310, 910) to which the metallization layer is applied, forming a sacrificial layer (410) adjacent to the metallization layer and a resist layer (510) adjacent to the sacrificial layer, patterning the resist layer to form an opening (610) (thereby removing a portion of the sacrificial layer), placing the electrically conductive material in the opening, and removing the resist layer, the sacrificial layer, and a portion of the metallization layer.

Abstract: The present invention relates to insect odorant receptor genes and methods for identifying odorant receptor genes. The invention provides nucleotide sequences of insect odorant receptor genes Or83b, amino acid sequences of their encoded proteins (including peptides or polypeptides), and related products and methods. The nucleic acids of the invention may be operatively linked to promoter sequences and transformed into host cells. Methods of production of an Or83b odorant receptor protein (e.g., by recombinant means), and derivatives and analogs thereof, are provided. Antibodies to an Or83b odorant receptor protein, and derivatives and analogs thereof, are provided. Methods for identifying molecules that bind or modulate the activity of these Or83b odorant receptor genes are provided. Molecules found to bind or modulate the activity of Or83b genes may be formulated into pest control agents by providing a carrier.

Abstract: The present invention relates to insect odorant receptor genes and methods for identifying odorant receptor genes. The invention provides nucleotide sequences of insect odorant receptor genes Or83b, amino acid sequences of their encoded proteins (including peptides or polypeptides), and related products and methods. The nucleic acids of the invention may be operatively linked to promoter sequences and transformed into host cells. Methods of production of an Or83b odorant receptor protein (e.g., by recombinant means), and derivatives and analogs thereof, are provided. Antibodies to an Or83b odorant receptor protein, and derivatives and analogs thereof, are provided. Methods for identifying molecules that bind or modulate the activity of these Or83b odorant receptor genes, are provided. Molecules found to bind or modulate the activity of Or83b genes may be formulated into pest control agents by providing a carrier.

Abstract: Selective removal of on-die redistribution interconnect material from a scribe-line region is generally described. In one example, an apparatus includes a first semiconductor die having a redistribution layer comprising redistribution dielectric and one or more redistribution metal interconnects, a second semiconductor die coupled with the first semiconductor die, the second semiconductor die having a redistribution layer comprising redistribution dielectric and one or more redistribution metal interconnects, and a scribe-line region disposed between the first semiconductor die and second semiconductor die, the scribe-line region having a majority or substantially all of redistribution dielectric or redistribution metal, or suitable combinations thereof, selectively removed to enable die singulation through the scribe-line region.

Abstract: Embodiments of the invention include apparatuses and methods relating to dual layer dielectric stacks for thick metal lines of microelectronic devices. In one embodiment, the dual layer dielectric stack includes a first dielectric layer that is planar and mechanically strong and the second dielectric layer can be patterned by photolithography to the required critical dimensions.

Abstract: According to one aspect of the invention, a method for forming contact formations is provided. A substrate may be placed in an electrolytic solution. The substrate may have an exposed conductive portion and the electrolytic solution may include a plurality of metallic ions and an accelerator. The accelerator may include at least one of bis-(sodium sulfopropyl)-disulfide and 3-mercapto-1-propanesulfonic acid-sodium salt. A voltage may be applied across the electrolytic solution and the conductive portion of the substrate to cause the metallic ions to be changed into metallic particles and deposited on the conductive portion. The electrolytic solution may also include a protonated organic additive. The electrolytic solution may also include an acid and a surfactant. The acid may include at least one of sulfuric acid, methane sulfonic acid, benzene sulfonic acid, and picryl sulfonic acid. The surfactant may include at least one of polyethylene glycol and polypropylene glycol.

Abstract: The present invention relates to insect odorant receptor genes and methods for identifying odorant receptor genes. The invention provides nucleotide sequences of insect odorant receptor genes Or83b, amino acid sequences of their encoded proteins (including peptides or polypeptides), and related products and methods. The nucleic acids of the invention may be operatively linked to promoter sequences and transformed into host cells. Methods of production of an Or83b odorant receptor protein (e.g., by recombinant means), and derivatives and analogs thereof, are provided. Antibodies to an Or83b odorant receptor protein, and derivatives and analogs thereof, are provided. Methods for identifying molecules that bind or modulate the activity of these Or83b odorant receptor genes are provided. Molecules found to bind or modulate the activity of Or83b genes may be formulated into pest control agents by providing a carrier.

Abstract: A structure including a substrate, a copper bump formed over the substrate, and a barrier layer comprising an alloy of at least one of iron and nickel, formed over the copper bump, and methods to make such a structure.

Abstract: An integrated circuit apparatus comprises a semiconductor substrate having a plurality of devices formed thereon, one or more metallization layers to interconnect the plurality of devices, and a bond pad formed over the one or more metallization layers and electrically coupled to at least one of the metallization layers. A first passivation layer is formed over the bond pad and over the metallization layers and a redistribution interconnect formed on the passivation layer. A first via formed through the first passivation layer electrically couples the redistribution interconnect to the bond pad. A second passivation layer is formed on the redistribution interconnect to prevent thermomechanical degradation and improve electromigration performance. A dielectric layer is formed on the second passivation layer and a die-side bump is formed on the dielectric layer.

Abstract: Embodiments of semiconductor devices and methods of making such devices are presented herein.

Abstract: Embodiments of the invention include apparatuses and methods relating to dual layer dielectric stacks for thick metal lines of microelectronic devices. In one embodiment, the dual layer dielectric stack includes a first dielectric layer that is planar and mechanically strong and the second dielectric layer can be patterned by photolithography to the required critical dimensions.