Patents by Inventor Khaled Ahmed

Khaled Ahmed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250105119
    Abstract: Embodiments disclosed herein include glass cores with vias that are lined by a self-healing liner. In an embodiment, an apparatus comprises a substrate that comprises a solid glass layer with an opening through a thickness of the substrate. In an embodiment, a liner is in contact with a sidewall of the opening, where the liner comprises a polymer matrix with capsules distributed through the polymer matrix. In an embodiment, each capsule comprises a shell, and a core within the shell. In an embodiment, the core comprises an organic material. In an embodiment, a via is in the opening and in contact with the liner, and the via is electrically conductive.
    Type: Application
    Filed: September 27, 2023
    Publication date: March 27, 2025
    Inventors: Yuqin LI, Jesse JONES, Sandrine LTEIF, Srinivas V. PIETAMBARAM, Suresh Tanaji NARUTE, Pramod MALATKAR, Gang DUAN, Khaled AHMED
  • Patent number: 12230181
    Abstract: A display device includes light-emitting diode (LED) devices to implement an array of pixels, where pixels in the array are each associated with a respective first set of LED devices to implement a first set of sub-pixels and a respective second set of LED devices to implement a redundant second set of sub-pixels for the corresponding pixel. Controller circuitry is provided to alternatively enable the first set of LED devices or the second set of LED device to implement the sub-pixels of the corresponding pixel.
    Type: Grant
    Filed: June 27, 2020
    Date of Patent: February 18, 2025
    Assignee: Intel Corporation
    Inventors: Khaled Ahmed, Vishal Ravindra Sinha, Marko Bartscherer
  • Publication number: 20250022908
    Abstract: Techniques and mechanisms for a micro-LED (or “uLED”) device to facilitate communication of an optical signal which is propagated via a transparent substrate structure. In an embodiment, one or more recess structures are formed in a side of a transparent substrate structure, such as a glass core of a package substrate. A uLED structure extends partially through the transparent substrate structure in a first recess structure, and is oriented to transmit or receive an optical signal via the transparent substrate. In another embodiment, the uLED structure is coupled to integrated circuitry which provides functionality to operate the uLED structure, at different times, in either one of an optical signal receiver mode or an optical signal transmitter mode.
    Type: Application
    Filed: July 13, 2023
    Publication date: January 16, 2025
    Applicant: Intel Corporation
    Inventors: Brandon Marin, Khaled Ahmed, Srinivas Pietambaram, Gang Duan
  • Publication number: 20250009911
    Abstract: The invention relates to a new therapeutic radiopharmaceutical as an inhibitor of prostate-specific membrane antigen (iPSMA), wherein 1,4,7,10-tetraazacyclododecane-N, N?, N?, N?? -tetraacetic acid (DOTA) bonded to the heterocyclic molecule hydrazinonicotinamide (HYNIC), generates a rigid chemical structure that minimises the number of conformers and intramolecular hydrogen bonds, thereby producing a favourable spatial orientation of the active site (Lys(Nal)—NH—CO—NH-Glu) in the molecule, for biological recognition by the PSMA protein. The new DOTA-HYNIC-iPSMA radiopharmaceutical accumulates, with high affinity in vivo, in tumours that overexpress the PSMA protein, acting as a radiotherapeutic or radiodiagnostic agent. The purpose of the invention is to provide a new specific radiopharmaceutical (molecular target radiopharmaceutical) for the detection and treatment of tumours with PSMA overexpression.
    Type: Application
    Filed: September 16, 2024
    Publication date: January 9, 2025
    Applicants: INSTITUTO NACIONAL DE INVESTIGACIONES NUCLEARES, Telix Innovations SA
    Inventors: Guillermina FERRO FLORES, Blanca Elí OCAMPO GARCÍA, Myrna Alejandra LUNA GUTIÉRREZ, Clara Leticia SANTOS CUEVAS, Erika Patricia AZORÍN VEGA, Nallely Patricia JIMÉNEZ MANCILLA, Tania HERNÁNDEZ JIMÉNEZ, Flor de María RAMÍREZ DE LA CRUZ, Khaled Ahmed Adly Ibrahim ATTIA
  • Patent number: 12119367
    Abstract: A method for forming a composite substrate containing layers of dissimilar materials is provided. The method includes a step of disposing a release layer over a base substrate where the base substrate is composed of a first material. A template layer is attached to the release layer. Characteristically, the template layer is composed of a second material and adapted to form a compound semiconductor device thereon.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: October 15, 2024
    Assignees: University of Southern California, California Institute of Technology, InPi LLC
    Inventors: Rehan Rashid Kapadia, Khaled Ahmed, Frank Greer
  • Patent number: 12119435
    Abstract: An semiconductor manufacturing apparatus and method to smooth surfaces of discrete pads on a substrate. The method includes placing a surface of one of the discrete pads in registration with a first chamber of a set of chambers of a smoothing tool, the set corresponding to a smoothing cycle of the smoothing tool; etching, within the first chamber, a surface of one of the discrete pads to form an etch layer on the surface; placing the surface in registration with a second chamber of the set; after the etch, pumping gas and vapor from the surface within the second chamber; placing the surface in registration with a third chamber of the set; and applying heating to the surface in the third chamber to smooth the surface.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: October 15, 2024
    Assignee: Intel Corporation
    Inventors: Khaled Ahmed, Thomas L. Sounart
  • Publication number: 20240324524
    Abstract: A method for harvesting mushrooms which grow in clusters, by determining a picking schedule that maximises the yield while minimising damage to the mushroom or surrounding mushrooms to thereby increase shelf-life.
    Type: Application
    Filed: July 18, 2022
    Publication date: October 3, 2024
    Applicant: UNIVERSITY OF LINCOLN
    Inventors: Bashir Ibrahim AL-DIRI, Khaled Ahmed ELGENEIDY, Jason Grant BURGON, Simon PEARSON
  • Patent number: 12094396
    Abstract: A micro-LED display having a plurality of pixels arranged in a two-dimensional matrix, wherein an individual pixel of the plurality of pixels each includes a light-emission section and a drive circuit to drive the light-emission section. The drive section includes an in-pixel PWM circuitry to receive a sawtooth or triangular pulse and an electric potential based on an image signal voltage, and to output a current pulse based on a comparison of the sawtooth or triangular pulse and the electric potential. The in-pixel PWM circuitry includes at most 7 transistors. The micro-LED display includes is coupled to one or more circuitries coupled to the plurality of pixels to provide the sawtooth or triangular pulse and the electric potential.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: September 17, 2024
    Assignee: Intel Corporation
    Inventor: Khaled Ahmed
  • Patent number: 12073769
    Abstract: Display pixels having integrated memory are disclosed. A disclosed example memory pixel includes a light emitter on a semiconductor substrate, memory co-located with the light emitter on the same semiconductor substrate, and a comparator in circuit with the memory, the comparator to control a flow of electrical current to the light emitter based on pixel data from the memory and timing information.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: August 27, 2024
    Assignee: Intel Corporation
    Inventors: Douglas Huard, Vishal Sinha, Paul Diefenbaugh, Khaled Ahmed, Kristoffer Fleming, Kunjal Parikh
  • Publication number: 20240230516
    Abstract: This disclosure describes systems, methods, and devices related to bond strength measurement. A device may comprise a first portion of a plate connected to a movement mechanism, a second portion of the plate comprising a sticky probe and a third portion of the plate comprising a mirror with a reflective side pointing outwards. The device may further comprise an optical fiber sensor assembly comprising an optical fiber bundle for sending light through a first optical fiber and receiving light reflected from the mirror through a second optical fiber.
    Type: Application
    Filed: October 25, 2022
    Publication date: July 11, 2024
    Applicant: Intel Corporation
    Inventor: Khaled AHMED
  • Publication number: 20240133799
    Abstract: This disclosure describes systems, methods, and devices related to bond strength measurement. A device may comprise a first portion of a plate connected to a movement mechanism, a second portion of the plate comprising a sticky probe and a third portion of the plate comprising a mirror with a reflective side pointing outwards. The device may further comprise an optical fiber sensor assembly comprising an optical fiber bundle for sending light through a first optical fiber and receiving light reflected from the mirror through a second optical fiber.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventor: Khaled AHMED
  • Patent number: 11940633
    Abstract: An illuminator has phase scrambling particles to reduce speckle.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: March 26, 2024
    Assignee: Intel Corporation
    Inventors: Khaled Ahmed, Liana Ilkova
  • Publication number: 20240097079
    Abstract: Integrated circuit (IC) packages are disclosed. In some embodiments, an IC package includes a glass substrate, a micro light emitting diode (LED), a semiconductor die, one or more through glass vias (TGVs) and a package substrate. The micro LED is positioned over the glass substrate. The TGVs are integrated into the glass substrate and connect the micro LED to the semiconductor die. The semiconductor die is connected to the package substrate to receive external signals when connected to a motherboard.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Inventors: Brandon C. MARIN, Khaled AHMED, Srinivas V. PIETAMBARAM, Hiroki TANAKA, Paul WEST, Kristof DARMAWIKARTA, Gang DUAN, Jeremy D. ECTON, Suddhasattwa NAD
  • Patent number: 11929763
    Abstract: Techniques are described for joint encoding and decoding of information symbols. In one embodiment, a method for joint encoding includes, in part, obtaining a sequence of information symbols, generating a plurality of cyclic codewords each corresponding to a portion of the sequence of information symbols, jointly encoding the plurality of cyclic codewords to generate at least one combined codeword, and providing the combined codeword to a device. The at least one combined codeword may be generated through Galois Fourier Transform (GFT).
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: March 12, 2024
    Assignee: WESTHOLD CORPORATION
    Inventors: Shu Lin, Khaled Ahmed Sabry Abdel-Ghaffar, Juane Li, Keke Liu
  • Patent number: 11908687
    Abstract: A device includes a layer including a first III-Nitride (III-N) material, a channel layer including a second III-N material, a release layer including nitrogen and a transition metal, where the release layer is between the first III-N material and the second III-N material. The device further includes a polarization layer including a third III-N material above the release layer, a gate structure above the polarization layer, a source structure and a drain structure on opposite sides of the gate structure where the source structure and the drain structure each include a fourth III-N material. The device further includes a source contact on the source structure and a drain contact on the drain structure.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: February 20, 2024
    Assignee: Intel Corporation
    Inventors: Khaled Ahmed, Anup Pancholi, John Heck, Thomas Sounart, Harel Frish, Sansaptak Dasgupta
  • Patent number: 11908981
    Abstract: Embodiments disclosed herein include micro light emitting device (LED) display panels and methods of forming such devices. In an embodiment, a display panel includes a display backplane substrate, a light emitting element on the display backplane, a transparent conductor over the light emitting element, a dielectric layer over the transparent conductor, and a color conversion device over the light emitting element. In an embodiment, the dielectric layer separates the transparent conductor from the color conversion device.
    Type: Grant
    Filed: September 14, 2022
    Date of Patent: February 20, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Khaled Ahmed, Anup Pancholi
  • Publication number: 20240038735
    Abstract: Techniques and mechanisms for a micro-LED (“uLED”) structure to facilitate efficient communication of an optical signal. In an embodiment, a columnar “nanopost” uLED structure comprises contiguous bodies of respective semiconductor materials, including a first body of a doped semiconductor material. The first body forms a pyramidal structure, wherein one or more others of the contiguous bodies are arranged on the first body in a vertically stacked configuration. More particularly, a second body of an undoped semiconductor material is to provide a quantum well of the uLED structure, wherein the second body does not cover or otherwise extend along vertical sidewall structures of the first body. In another embodiment, the pyramidal structure, in combination with the vertically stacked arrangement of semiconductor bodies, facilitates efficient communication of narrowly columnated optical signal by mitigating optical signal communication via vertical sides of the uLED structure.
    Type: Application
    Filed: July 21, 2023
    Publication date: February 1, 2024
    Applicant: Intel Corporation
    Inventors: Khaled Ahmed, Brandon Marin
  • Patent number: 11829072
    Abstract: Embodiments related to emissive display device structures having an emissive display element and a metamaterial lens having a plurality of nanoparticles over an emissive surface of the emissive display element to control the angular distribution of light emitted from the emissive display element, displays having such controlled emissive display device structures, systems incorporating such controlled emissive display device structures, and methods for fabricating them are discussed.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: November 28, 2023
    Assignee: Intel Corporation
    Inventors: Khaled Ahmed, Richmond Hicks
  • Publication number: 20230317687
    Abstract: Embodiments disclosed herein include a display. In an embodiment, the display comprises a backplane, and circuitry on the backplane. In an embodiment, a pad with a first width is over the backplane and electrically coupled to the circuitry. In an embodiment, the pad comprises a conductive material. In an embodiment, the display further comprises a light emitting diode (LED) coupled to the pad, where the LED has a second width that is smaller than the first width.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Inventors: Bhupendra KUMAR, Khaled AHMED, Andrew William KEATES, Jay GUPTA
  • Publication number: 20230296361
    Abstract: The present invention pertains to a system and method for transportation of goods, service, marketable securities or other valuable payloads optionally utilizing a carrier or smart carrier to contain a payload and using artillery for transporting the payload relatively longer distances, whereby more conventional transportation systems may bring a payload to the artillery mechanism and then retrieve the payload from the artillery mechanism. The system consists of a modified military artillery projectile, optionally containing a self-monitoring smart carrier or a standard carrier, transportation shells for various transportation methods and when smart carriers are employed, goods and services and in some embodiments, people, on land, air and water through a connected ecosystem, may be monitored and safely transported.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 21, 2023
    Inventors: Hazim Mohaisen, Khaled Ahmed Essam Abdel-Rahman