Patents by Inventor Ki-Bum Kim

Ki-Bum Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210367024
    Abstract: A display device including: a substrate; a conductive layer on the substrate and including a first voltage line and a second voltage line extending in a first direction; a first electrode and a second electrode on the conductive layer, extending in the first direction, and spaced apart from each other; a plurality of light-emitting elements on the first electrode and the second electrode; and an electrode pattern on the conductive layer and separated from the first electrode. The electrode pattern overlaps the first voltage line in a thickness direction and directly contacts the first voltage line.
    Type: Application
    Filed: April 21, 2021
    Publication date: November 25, 2021
    Inventors: Ki Bum KIM, Kyung Tae CHAE, Ki Nyeng KANG, Jin Taek KIM, Hyun Wook LEE
  • Publication number: 20210359167
    Abstract: A pixel includes a first electrode; a second electrode surrounding at least a portion of the first electrode; a plurality of light emitting elements between the first electrode and the second electrode; a first contact electrode on the first electrode, the first contact electrode electrically connecting the first electrode and the plurality of light emitting elements; a second contact electrode on the second electrode, the second contact electrode electrically connecting the second electrode and the plurality of light emitting elements; and an intermediate electrode on the first electrode and the second electrode, the intermediate electrode comprising a first area overlapping the first electrode and a second area overlapping the second electrode, the first area and the second area being integrally connected to each other.
    Type: Application
    Filed: January 22, 2021
    Publication date: November 18, 2021
    Inventors: Hyun Wook LEE, Ki Bum KIM, Jin Taek KIM, Seung Min LEE, Kwang Taek HONG, Jung Eun HONG
  • Patent number: 11168785
    Abstract: A hydraulic pressure control method for a transmission includes determining whether a current shift range is among a plurality of shift ranges, setting a dither frequency of a pressure control solenoid valve of a hydraulic circuit for the transmission to a predetermined first frequency when the current shift range is a predetermined first range, and setting the dither frequency of the pressure control solenoid valve to a predetermined second frequency when the current shift range is a shift range other than the first range.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: November 9, 2021
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Bong Uk Bae, Sung Sik Choi, Kyung Moo Lee, Ki Bum Kim, Seong Min Son, Seul Chan Park, Se Hwan Jo, Min Jae Chai
  • Patent number: 11158849
    Abstract: Provided are lithium ion batteries including a nano-crystalline graphene electrode. The lithium ion battery includes a cathode on a cathode current collector, an electrolyte layer on the cathode, an anode on the electrolyte layer, and an anode current collector on the anode. The anode and the cathode include a plurality of grains having a size in a range from about 5 nm to about 100 nm. The cathode has a double bonded structure in which a carbon of the graphene is combined with oxygen.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: October 26, 2021
    Assignees: Samsung Electronics Co., Ltd., Seoul National University R&DB Foundation
    Inventors: Minhyun Lee, Seongjun Park, Hyunjae Song, Hyeonjin Shin, Ki-Bum Kim, Yunhho Kang, Sanghun Lee
  • Patent number: 11132946
    Abstract: An emission signal driver comprises stages connected to emission lines. Each of the stages includes a node controller which supplies a start signal or a carry signal, which is input to a start terminal, to a first node in response to a clock signal input to a clock terminal, a first inverter connected between the first node and a second node, and a second inverter connected between the second node and an output terminal.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: September 28, 2021
    Assignees: SAMSUNG DISPLAY CO., LTD., KONKUK UNIVERSITY INDUSTRIAL COOPERATION CORP
    Inventors: Tae Hoon Yang, Joon Ho Lee, Kee Chan Park, Ki Bum Kim, Jong Chan Lee, Woong Hee Jeong
  • Patent number: 11117425
    Abstract: Disclosed is a tire configured for reducing noise during running of the tire by forming a predetermined shape in a groove of the tire to reduce a peak of air column resonance sound. The tire with reduced noise includes a first protrusion formed on a sidewall of a groove, protruding in a depth direction of the groove, and dispersing sound waves generated in a tread, and a second protrusion formed on the sidewall of the groove, protruding in a longitudinal direction of the groove, and dispersing sound waves generated in the tread.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: September 14, 2021
    Assignee: Hankook Tire Co., Ltd.
    Inventors: Ki Bum Kim, Su Jin Son, Il Sik Kim, Chang Hyo Hong
  • Publication number: 20210278355
    Abstract: The present invention relates to a method for manufacturing a sample for thin film property measurement and analysis, and a sample manufactured thereby and, more specifically, to: a method for manufacturing a sample capable of measuring or analyzing various properties in one sample; and a sample manufactured thereby.
    Type: Application
    Filed: July 21, 2017
    Publication date: September 9, 2021
    Inventors: Ki-Bum KIM, Min-Sik KIM, Hyun-Mi KIM, Ki-Ju KIM
  • Patent number: 11114362
    Abstract: A stacked semiconductor package includes a first die, a second die stacked on a surface of the first die, a heat dissipation layer disposed on the surface, a heat insulation layer disposed on the surface to cover the heat dissipation layer and the first die, a heat sink disposed on the second die, and a heat conduction structure spaced apart from the second die in a lateral direction on the surface to connect the heat dissipation layer to the heat sink.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: September 7, 2021
    Assignee: SK hynix Inc.
    Inventors: Bok Kyu Choi, Jong Hoon Kim, Ki Bum Kim
  • Publication number: 20210138844
    Abstract: A tire with noise-reducing main grooves includes: a groove portion which is formed to extend circumferentially along a circumference of a tire tread; and a knurled portion which is formed on bottom and side surfaces of the groove portion. The knurled portion is provided to reduce noise energy by narrowing an air path formed when the groove portion and the ground contact each other.
    Type: Application
    Filed: November 10, 2020
    Publication date: May 13, 2021
    Inventors: Il Sik KIM, Seung Ju KWAK, Su Jin SON, Ki Bum KIM, Seung Hwan LEE
  • Patent number: 10991640
    Abstract: A semiconductor package includes a first semiconductor die and a stack of second semiconductor dies disposed on a package substrate. The semiconductor package further includes a first bridge die having first through vias that electrically connect the first semiconductor die to the package substrate, a second bridge die having second through vias that electrically connect the stack of the second semiconductor dies to the package substrate, and a third semiconductor die disposed to overlap with the first semiconductor die and the stack of the second semiconductor dies. Moreover, the semiconductor package further includes redistribution lines electrically connecting the third semiconductor die to the second bridge die.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: April 27, 2021
    Assignee: SK hynix Inc.
    Inventors: Jong Hoon Kim, Ki Bum Kim, Bok Kyu Choi
  • Publication number: 20210118375
    Abstract: A display device includes: a plurality of pixels, each of which is connected to a corresponding one of a plurality of scan lines, and a scan driver including a plurality of stages, each of which supplies a scan signal to a corresponding one of the scan lines, each of the stages includes: a node controller which supplies a second output signal of a previous stage to a first node based on an input signal of a first clock terminal or a first output signal of the previous stage, a first inverter connected between the first node and a second node, a buffer which supplies a voltage of the second node to a first output terminal based on an input signal of a second clock terminal, and a second inverter connected between the first output terminal and a second output terminal.
    Type: Application
    Filed: October 20, 2020
    Publication date: April 22, 2021
    Inventors: Tae Hoon YANG, Joon Ho LEE, Kee Chan PARK, Ki Bum KIM, Hyang A. PARK, Jong Chan LEE, Woong Hee JEONG
  • Patent number: 10909929
    Abstract: A scan driver includes stage circuits, each including: a first circuit including a control terminal (CT) connected to a first node (N1), and connecting/disconnecting a previous scan line of a previous stage circuit to a second node (N2) based on a control signal (CS); a second circuit including a CT connected to a clock signal line, and connecting one of a first power voltage line (FPVL) and a second power voltage line (SPVL) to the N1 based on a CS; a third circuit including a CT connected to the N2, and connecting one of the N1 and the SPVL to a third node (N3) based on a CS; a fourth circuit including a CT connected to the N3, and connecting one of the FPVL and the SPVL to a current scan line based on a CS; and a first capacitor connecting the CT of the third circuit and the SPVL.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: February 2, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Tae Hoon Yang, Ki Bum Kim, Jong Chan Lee, Woong Hee Jeong
  • Publication number: 20210028244
    Abstract: A display device includes light transmitting areas including a first light transmitting area and light emitting areas around the light transmitting areas and including a first light emitting area disposed around the first light transmitting area, wherein the first light emitting area includes a first-first light emitting area adjacent to a first portion of each of the light transmitting areas, a first-second light emitting area adjacent to a second portion of each of the light transmitting areas, a first-third light emitting area adjacent to a third portion of each of the light transmitting areas, and a first-fourth light emitting area disposed adjacent to a fourth portion of each of the light transmitting areas. The first-first to first-fourth light emitting areas each include at least one of first to third light emitting portions to emit light of first to third colors, respectively.
    Type: Application
    Filed: July 13, 2020
    Publication date: January 28, 2021
    Applicant: Samsung Display Co., LTD.
    Inventors: Woong Hee JEONG, Ki Bum KIM, Jin Yeong KIM, Hyang A PARK, Tae Hoon YANG, Jong Chan LEE
  • Publication number: 20210012708
    Abstract: An emission signal driver comprises stages connected to emission lines. Each of the stages includes a node controller which supplies a start signal or a carry signal, which is input to a start terminal, to a first node in response to a clock signal input to a clock terminal, a first inverter connected between the first node and a second node, and a second inverter connected between the second node and an output terminal.
    Type: Application
    Filed: May 18, 2020
    Publication date: January 14, 2021
    Inventors: Tae Hoon YANG, Joon Ho LEE, Kee Chan PARK, Ki Bum KIM, Jong Chan LEE, Woong Hee JEONG
  • Publication number: 20210005527
    Abstract: A stacked semiconductor package includes a first die, a second die stacked on a surface of the first die, a heat dissipation layer disposed on the surface, a heat insulation layer disposed on the surface to cover the heat dissipation layer and the first die, a heat sink disposed on the second die, and a heat conduction structure spaced apart from the second die in a lateral direction on the surface to connect the heat dissipation layer to the heat sink.
    Type: Application
    Filed: October 30, 2019
    Publication date: January 7, 2021
    Applicant: SK hynix Inc.
    Inventors: Bok Kyu CHOI, Jong Hoon KIM, Ki Bum KIM
  • Patent number: D909359
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: February 2, 2021
    Assignee: SPIGEN KOREA CO., LTD.
    Inventor: Ki Bum Kim
  • Patent number: D910611
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: February 16, 2021
    Assignee: SPIGEN KOREA CO., LTD.
    Inventor: Ki Bum Kim
  • Patent number: D911323
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: February 23, 2021
    Assignee: SPIGEN KOREA CO., LTD.
    Inventor: Ki Bum Kim
  • Patent number: D916691
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: April 20, 2021
    Assignee: SPIGEN KOREA CO., LTD.
    Inventor: Ki Bum Kim
  • Patent number: D917441
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: April 27, 2021
    Assignee: SPIGEN KOREA CO., LTD.
    Inventor: Ki Bum Kim