Abstract: Provided is a method of providing a recommended card, the method including: receiving a radio signal from at least one access point around a device; selecting one from the at least one access point, based on a strength of the received radio signal; determining a card merchant corresponding to the selected access point; determining at least one recommended card regarding the determined card merchant from at least one card registered with the device, based on the card merchant and card benefit information of the registered at least one card; and providing the at least one recommended card.

Abstract: An embodiment of a substrate treatment device may comprise: a disk provided to be able to rotate; at least one susceptor arranged on the disk, a substrate being seated on the upper surface of the susceptor, the susceptor rotating, as the disk rotates, and revolving about the center of the disk as the axis; a metal ring coupled to the lower portion of the susceptor and arranged such that the center of the metal ring coincides with the center of the susceptor, and a magnet arranged radially on the lower portion of the disk with reference to the center of the disk and provided such that at least a part of the magnet faces the metal ring in the up/down direction.

Abstract: A pixel including a light emitting element, a first transistor connected between a first node and the light emitting element to control current flowing from a first power supply to a second power supply, a second transistor connected between a data line and the first transistor to be turned on by an ith first scan signal, a third transistor including a P-type TFT connected between the first transistor and the first node to be turned on by the ith first scan signal and, a fourth transistor including an N-type TFT connected between the first node and an initialization power supply line to be turned on by an i?1th scan signal, and a first connection line connected between the third and fourth transistors to electrically connect semiconductor patterns thereof, in which the first connection line is disposed on the third and fourth transistors and contacts the semiconductor patterns thereof.

Abstract: A system-in-package includes a redistributed line (RDL) structure, a first semiconductor chip, a second semiconductor chip, and a bridge die. The RDL structure includes a first RDL pattern to which a first chip pad of the first semiconductor chip is electrically connected. The second semiconductor chip is stacked on the first semiconductor chip such that the second semiconductor chip protrudes past a side surface of the first semiconductor chip, wherein a second chip pad disposed on the protrusion is electrically connected to the first RDL pattern through the bridge die.

Abstract: A semiconductor package includes an outer redistributed line (RDL) structure, a first semiconductor chip disposed on the outer RDL structure, a stack module stacked on the first semiconductor chip, and a bridge die stacked on the outer RDL structure. A portion of the stack module laterally protrudes from a side surface of the first semiconductor chip. The bridge die supports the protruding portion of the stack module. The stack module includes an inner RDL structure, a second semiconductor chip disposed on the inner RDL structure, a capacitor die disposed on the inner RDL structure, and an inner encapsulant. The capacitor die acts as a decoupling capacitor of the second semiconductor chip.

Abstract: A semiconductor package includes a first semiconductor die and a stack of second semiconductor dies disposed on a package substrate. The semiconductor package further includes a first bridge die having first through vias that electrically connect the first semiconductor die to the package substrate, a second bridge die having second through vias that electrically connect the stack of the second semiconductor dies to the package substrate, and a third semiconductor die disposed to overlap with the first semiconductor die and the stack of the second semiconductor dies. Moreover, the semiconductor package further includes redistribution lines electrically connecting the third semiconductor die to the second bridge die.

Abstract: Disclosed is a tire configured for reducing noise during running of the tire by forming a predetermined shape in a groove of the tire to reduce a peak of air column resonance sound. The tire with reduced noise includes a first protrusion formed on a sidewall of a groove, protruding in a depth direction of the groove, and dispersing sound waves generated in a tread, and a second protrusion formed on the sidewall of the groove, protruding in a longitudinal direction of the groove, and dispersing sound waves generated in the tread.

Abstract: A chip stack package includes first and second semiconductor chips. A first redistribution line structure is disposed on a front surface of the first semiconductor chip, and the first redistribution line structure extends onto a side surface of the first semiconductor chip. A second redistribution line structure is disposed on the front surface of the first semiconductor chip, and the second redistribution line structure extends onto the side surface of the first semiconductor chip. A third redistribution line structure is disposed on a front surface of the second semiconductor chip, and the third redistribution line structure extends onto a side surface of the second semiconductor chip to be electrically connected to the second redistribution line structure.

Abstract: A chip stack package includes first and second semiconductor chips. A first redistribution line structure is disposed on a front surface of the first semiconductor chip and the first redistribution line structure extends onto a side surface of the first semiconductor chip. A second redistribution line structure is disposed on the front surface of the first semiconductor chip, and the second redistribution line structure extends onto the side surface of the first semiconductor chip. A third redistribution line structure is disposed on a front surface of the second semiconductor chip, and the third redistribution line structure extends onto a side surface of the second semiconductor chip to be electrically connected to the second redistribution line structure.

Abstract: A pixel including a light emitting element, a first transistor connected between a first node and the light emitting element to control current flowing from a first power supply to a second power supply, a second transistor connected between a data line and the first transistor to be turned on by an ith first scan signal, a third transistor including a P-type TFT connected between the first transistor and the first node to be turned on by the ith first scan signal and, a fourth transistor including an N-type TFT connected between the first node and an initialization power supply line to be turned on by an i?1th scan signal, and a first connection line connected between the third and fourth transistors to electrically connect semiconductor patterns thereof, in which the first connection line is disposed on the third and fourth transistors and contacts the semiconductor patterns thereof.

Abstract: A scan driver includes stage circuits, each including: a first circuit including a control terminal (CT) connected to a first node (N1), and connecting/disconnecting a previous scan line of a previous stage circuit to a second node (N2) based on a control signal (CS); a second circuit including a CT connected to a clock signal line, and connecting one of a first power voltage line (FPVL) and a second power voltage line (SPVL) to the N1 based on a CS; a third circuit including a CT connected to the N2, and connecting one of the N1 and the SPVL to a third node (N3) based on a CS; a fourth circuit including a CT connected to the N3, and connecting one of the FPVL and the SPVL to a current scan line based on a CS; and a first capacitor connecting the CT of the third circuit and the SPVL.

Abstract: A power apparatus including a reducing agent supply control system includes: an engine configured to emit exhaust gas containing nitrogen oxide by burning air and fuel at a preset air-fuel ratio; an exhaust passage configured such that the exhaust gas emitted by the engine moves therethrough; a pressure sensor configured to actually measure the pressure of air which is supplied to the engine; a nitrogen oxide concentration sensor installed on the exhaust passage, and configured to measure the nitrogen oxide (NOx) concentration of the exhaust gas; a reducing agent supply unit configured to supply a reducing agent to the exhaust gas which moves along the exhaust passage; and a control unit configured to determine the amount of reducing agent to be supplied based on information received from the pressure sensor and the nitrogen oxide concentration sensor, and to control the reducing agent supply unit.

Abstract: An embodiment of a substrate treatment device may comprise: a disk provided to be able to rotate; at least one susceptor arranged on the disk, a substrate being seated on the upper surface of the susceptor, the susceptor rotating, as the disk rotates, and revolving about the center of the disk as the axis; a metal ring coupled to the lower portion of the susceptor and arranged such that the center of the metal ring coincides with the center of the susceptor, and a magnet arranged radially on the lower portion of the disk with reference to the center of the disk and provided such that at least a part of the magnet faces the metal ring in the up/down direction.

Abstract: The present invention relates to a method for screening protein-protein interaction inhibitors using a nanopore, a method for analyzing protein structures, a method for analyzing protein-protein interactions, and a kit therefor.

Abstract: Provided are lithium ion batteries including a nano-crystalline graphene electrode. The lithium ion battery includes a cathode on a cathode current collector, an electrolyte layer on the cathode, an anode on the electrolyte layer, and an anode current collector on the anode. The anode and the cathode include a plurality of grains having a size in a range from about 5 nm to about 100 nm. The cathode has a double bonded structure in which a carbon of the graphene is combined with oxygen.

Abstract: Disclosed is a substrate processing apparatus including a disc provided so as to be rotatable on its axis, at least one susceptor disposed on the disc such that a substrate is seated on an upper surface thereof, the susceptor being configured to rotate on its axis and to revolve around a center of the disc as the disc rotates on its axis, a metal ring coupled to a lower portion of the susceptor, the metal ring being arranged such that a center thereof coincides with a center of the susceptor, and a magnet provided below the disc so as to be radially arranged on a basis of the center of the disc, at least a portion of the magnet being opposite the metal ring in a vertical direction.

Abstract: The present invention provides a touch switch attachable on a wall. The touch switch, attachable on a wall, comprises: a switch box unit which is inserted into an embedded box formed on a wall; a back cover unit which is inserted inside the switch box unit and has a plurality of PCBs stacked and placed; a fixing plate unit which is coupled to the switch box unit and fixes the back cover unit; and an LCD touch pad unit which is fixed on one end of the back cover unit passing through the fixing plate unit, is electrically connected to the plurality of PCBs, and is for inputting switching operation information to the plurality of PCBs by means of capacitive touch.