Abstract: An airfoil cooling structure, an airfoil having the airfoil cooling structure, and a turbine blade/vane element including the airfoil are disclosed. The airfoil cooling structure includes a cooling path formed inside the airfoil and having a first surface and a second surface opposite to the first surface, and an additive manufactured (AM) feature disposed in the cooling path, manufactured by additive manufacturing, and including a plurality of column parts intersecting with each other so as to abut against the first surface and the second surface.

Abstract: Disclosed are a spinning dope for an aramid and carbon-nanotube composite fiber and a method of manufacturing an aramid and carbon-nanotube composite fiber using the same.

Abstract: An embodiment is a thermal management system for a vehicle, the thermal management system including a main refrigerant line in which a compressor, an indoor condenser, a first expansion valve, an outdoor condenser, a second expansion valve, and an indoor evaporator are sequentially provided, a battery cooling water line in which a battery, the chiller for a battery, and a water pump for a battery are sequentially provided, a refrigerant heater disposed between the compressor and the indoor condenser on the main refrigerant line, and a controller configured to control operations of the compressor and the refrigerant heater, control opening and closing of the first expansion valve and the second expansion valve, control operations of the water pump for an electric component and the water pump for a battery, and control flow paths of the refrigerant, the cooling water for an electric component, and the cooling water for a battery.

Abstract: A cleaning apparatus including a vacuum cleaner and a docking station is provided. The cleaning apparatus includes a vacuum cleaner including a dust collecting chamber in which foreign substances are collected, and a docking station configured to be connected to the dust collecting chamber to remove the foreign substances collected in the dust collecting chamber. The dust collecting chamber is configured to collect foreign substances through centrifugation, and configured to be docked to the docking station, and the docking station includes a suction device configured to suction the foreign substances and air in the dust collecting chamber docked to the docking station.

Abstract: A battery pack is advantageous for effective control and maintenance of thermal events. A battery pack according to one aspect of the present disclosure may include a battery module having one or more battery cells; a fire extinguishing tank holding a fire extinguishing liquid, disposed on top of the battery module and having a through hole formed therein; and a cover member installed in the through hole of the fire extinguishing tank and configured to open or close the through hole according to a change in internal pressure of the fire extinguishing tank.

Abstract: A semiconductor package includes a connection structure including a redistribution layer, a plurality of under bump metal layers electrically connected to the redistribution layer, a passivation layer which overlaps at least portions of side faces of the plurality of under bump metal layers, and includes a first trench disposed between under bump metal layers adjacent to each other, a surface mounting element which is on the under bump metal layers adjacent to each other, connected to the redistribution layer, and overlaps the first trench, and an underfill material layer that is between a portion of the passivation layer and the surface mounting element, and is in the first trench. The first trench extends in a first direction and includes a first sub-trench having a first width in a second direction, and a second sub-trench having a second width different from the first width in the second direction.

Abstract: A fan-out semiconductor package including a first redistribution layer; a first semiconductor chip on the first redistribution layer; an interconnector on the first redistribution layer and spaced apart from the first semiconductor chip; a molded layer covering the interconnector and side surfaces of the first semiconductor chip; and a second redistribution layer on the molded layer, wherein the interconnector includes a metal ball and is electrically connected to the first redistribution layer, the second redistribution layer includes a first line wiring, and a first via electrically connected to the first line wiring, the first via is connected to the interconnector, and a part of the first via is in the molded layer.

Abstract: A fan-out semiconductor package including a first redistribution layer; a first semiconductor chip on the first redistribution layer; an interconnector on the first redistribution layer and spaced apart from the first semiconductor chip; a molded layer covering the interconnector and side surfaces of the first semiconductor chip; and a second redistribution layer on the molded layer, wherein the interconnector includes a metal ball and is electrically connected to the first redistribution layer, the second redistribution layer includes a first line wiring, and a first via electrically connected to the first line wiring, the first via is connected to the interconnector, and a part of the first via is in the molded layer.

Abstract: A blood testing apparatus includes an analyzer configured to analyze blood components of an animal that are included in a test medium; an output device configured to display analysis results of the blood components; and a controller configured to determine a species of the animal based on at least one from among types of the blood components and the analysis results of the blood components and control the output device to display the determined species of the animal.

Abstract: A semiconductor package includes a connection structure including a redistribution layer, a plurality of under bump metal layers electrically connected to the redistribution layer, a passivation layer which overlaps at least portions of side faces of the plurality of under bump metal layers, and includes a first trench disposed between under bump metal layers adjacent to each other, a surface mounting element which is on the under bump metal layers adjacent to each other, connected to the redistribution layer, and overlaps the first trench, and an underfill material layer that is between a portion of the passivation layer and the surface mounting element, and is in the first trench. The first trench extends in a first direction and includes a first sub-trench having a first width in a second direction, and a second sub-trench having a second width different from the first width in the second direction.

Abstract: A semiconductor package mounted board includes a printed circuit board on which a plurality of first pads and a plurality of second pads are disposed on one surface, and a semiconductor package disposed on the one surface of the printed circuit board and including a plurality of third pads and a plurality of fourth pads. A plurality of first electrical connection structures electrically connect the plurality of first pads and the plurality of third pads, and one or more second electrical connection structures electrically connect the plurality of second pads and the plurality of fourth pads. The plurality of first pads are disposed to correspond to and overlap/align with the plurality of third pads from each other, and the plurality of second pads are disposed to be staggered and offset with respect to the plurality of fourth pads.

Abstract: A semiconductor package includes: a connection member having first and second surfaces opposing each other and including a redistribution layer; a support member disposed on the first surface of the connection member, including a cavity, and having an inner sidewall surrounding the cavity of which an upper region is chamfered; a semiconductor chip disposed on the connection member in the cavity and having connection pads electrically connected to the redistribution layer; at least one electronic component disposed between the semiconductor chip and the inner sidewall and having connection terminals electrically connected to the redistribution layer; and an encapsulant encapsulating the semiconductor chip and the at least one electronic component disposed in the cavity.

Abstract: A semiconductor package mounted board includes a printed circuit board on which a plurality of first pads and a plurality of second pads are disposed on one surface, and a semiconductor package disposed on the one surface of the printed circuit board and including a plurality of third pads and a plurality of fourth pads. A plurality of first electrical connection structures electrically connect the plurality of first pads and the plurality of third pads, and one or more second electrical connection structures electrically connect the plurality of second pads and the plurality of fourth pads. The plurality of first pads are disposed to correspond to and overlap/align with the plurality of third pads from each other, and the plurality of second pads are disposed to be staggered and offset with respect to the plurality of fourth pads.

Abstract: A blood testing apparatus includes an analyzer configured to analyze blood components of an animal that are included in a test medium; an output device configured to display analysis results of the blood components; and a controller configured to determine a species of the animal based on at least one from among types of the blood components and the analysis results of the blood components and control the output device to display the determined species of the animal.

Abstract: An electronic device module includes: a board including at least one mounting electrode and at least one external connection electrode and having a protective insulation layer which is provided on an outer surface thereof; at least one electronic device mounted on the mounting electrodes; a molded part sealing the electronic device; and at least one connective conductor of which one end is bonded to the external connection electrode of the board and which penetrates through the molded part to be disposed in the molded part, wherein the protective insulation layer is disposed to be spaced apart from the connective conductor.

Abstract: A semiconductor package includes: a connection member having first and second surfaces opposing each other and including a redistribution layer; a support member disposed on the first surface of the connection member, including a cavity, and having an inner sidewall surrounding the cavity of which an upper region is chamfered; a semiconductor chip disposed on the connection member in the cavity and having connection pads electrically connected to the redistribution layer; at least one electronic component disposed between the semiconductor chip and the inner sidewall and having connection terminals electrically connected to the redistribution layer; and an encapsulant encapsulating the semiconductor chip and the at least one electronic component disposed in the cavity.

Abstract: A semiconductor package and manufacturing method thereof includes a chip member installed on an upper surface, a lower surface, or both of a substrate. The semiconductor package and manufacturing method thereof also include a mold part stacked embedding the chip member, a connection member disposed at a center portion of the mold part, and a solder part formed on a portion of the connection member.

Abstract: A blood testing apparatus includes a loader configured to receive a test medium, the test medium including a test object to be tested; a controller configured to perform control to operate the loader to receive the test medium in response to receiving an input of a trigger signal indicating a test start in an emergency mode; a display configured to display a user interface screen indicating the emergency mode; and an analyzer configured to automatically start analysis of the test object under the control of the controller when the test medium is received.

Abstract: A pet blood tester includes a reader configured to read identification information of a pet from a tag; an analyzer configured to analyze blood of the pet to acquire information on the blood; a storage; a controller configured to receive stored body information of the pet corresponding to the identification information from at least one of an external device and the storage if the stored body information of the pet corresponding to the identification information is stored in at least one of the external device and the storage; and an inputter configured to receive input body information of the pet from a user if the body information of the pet corresponding to the identification information is not stored in at least one of the external device and the storage, wherein the controller is further configured to provide a blood test result and diagnosis information for the pet, based on the information on the blood, and the stored body information of the pet or the input body information on the blood.

Abstract: A test device and a method for controlling the test device are disclosed. After a test is interrupted due to a malfunction of the test device, the test device continuously performs the interrupted testing. The test device for testing a biological material includes: a memory configured to store information which relates to progress of a test; and a controller which, if the test is interrupted due to a malfunction of the test device, is configured to continue performance of the test by using the information which relates to the test progress which is stored in the memory.