Patents by Inventor Ki-Jun Sung

Ki-Jun Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10971452
    Abstract: A semiconductor package includes a base substrate and first to Nth sub packages sequentially stacked over the base substrate with each sub package including a semiconductor die and a bridge die disposed on at least one side of the semiconductor die and electrically connected to the semiconductor die, where N is a natural number equal to or more than two (2). The semiconductor package also includes a molding layer formed on the base substrate and exposing an Nth conductive post included in the Nth sub package while covering the first to Nth sub packages. The semiconductor package further includes a shielding layer formed on the molding layer and electrically connected to the Nth conductive post.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: April 6, 2021
    Assignee: SK hynix Inc.
    Inventor: Ki-Jun Sung
  • Publication number: 20210074641
    Abstract: A semiconductor package includes a base substrate and first to Nth sub packages sequentially stacked over the base substrate with each sub package including a semiconductor die and a bridge die disposed on at least one side of the semiconductor die and electrically connected to the semiconductor die, where N is a natural number equal to or more than two (2). The semiconductor package also includes a molding layer formed on the base substrate and exposing an Nth conductive post included in the Nth sub package while covering the first to Nth sub packages. The semiconductor package further includes a shielding layer formed on the molding layer and electrically connected to the Nth conductive post.
    Type: Application
    Filed: January 27, 2020
    Publication date: March 11, 2021
    Applicant: SK hynix Inc.
    Inventor: Ki-Jun SUNG
  • Patent number: 9170333
    Abstract: Disclosed is a system of a dynamic range three-dimensional image, including: an optical detector including a gain control terminal capable of controlling an optical amplification gain; a pixel detecting module for detecting a pixel signal for configuring an image by receiving an output of the optical detector; a high dynamic range (HDR) generating module for acquiring a dynamic range image by generating a signal indicating a saturation degree of the pixel signal and combining the pixel signal based on the pixel signal detected by the pixel detecting module; and a gain control signal generating module generating an output signal for supplying required voltage to the gain control terminal of the optical detector based on the magnitude of the signal indicating the saturation degree of the pixel signal.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: October 27, 2015
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Bongki Mheen, Ki-Jun Sung, Jae-Sik Sim, Kisoo Kim, MyoungSook Oh, Yong-Hwan Kwon, Eun Soo Nam
  • Publication number: 20120162373
    Abstract: Disclosed is a system of a dynamic range three-dimensional image, including: an optical detector including a gain control terminal capable of controlling an optical amplification gain; a pixel detecting module for detecting a pixel signal for configuring an image by receiving an output of the optical detector; a high dynamic range (HDR) generating module for acquiring a dynamic range image by generating a signal indicating a saturation degree of the pixel signal and combining the pixel signal based on the pixel signal detected by the pixel detecting module; and a gain control signal generating module generating an output signal for supplying required voltage to the gain control terminal of the optical detector based on the magnitude of the signal indicating the saturation degree of the pixel signal.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 28, 2012
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Bongki MHEEN, Ki-Jun Sung, Jae-Sik Sim, Kisoo Kim, MyoungSook Oh, Yong-Hwan Kwon, Eun Soo Nam