Patents by Inventor Ki Seok Kim

Ki Seok Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10739040
    Abstract: Disclosed herein is an air conditioner in which flow noise of a refrigerant is reduced. An air conditioner includes a compressor configured to compress a refrigerant, an outdoor heat exchanger in which the refrigerant exchanges heat with outside air, an expansion device configured to expand the refrigerant, an indoor heat exchanger in which the refrigerant exchanges heat with indoor air, and a muffler configured to reduce flow noise of the refrigerant flowing into the indoor heat exchanger, wherein the muffler includes a shell including a refrigerant inlet and a refrigerant outlet, a first baffle disposed at one side of an inner part of the shell and including a plurality of first holes, a plurality of pipes inserted into the plurality of first holes and serving as passages through which the refrigerant moves, and a second baffle disposed at the other side of the inner part of the shell and including a plurality of second holes through which the refrigerant passing through the pipe passes.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: August 11, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Woo Choi, Du Han Jung, Jun Seok Kwon, Ki Seok Kim, Hyeong Joon Seo
  • Patent number: 10719942
    Abstract: Provided are an image processing system and an image processing method. An image processing method includes: constructing a plurality of grids on an image; extracting features of the image; estimating a grid motion vector of each of the plurality of grids, based on a first motion vector of each of the features; estimating a second motion vector of each feature based on the grid motion vector; and detecting a moving object based on a difference between the first motion vector and the second motion vector.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: July 21, 2020
    Assignee: HANWHA DEFENSE CO., LTD.
    Inventors: Ju Han Bae, Ki Seok Kim, Jae Hyuk Ju
  • Publication number: 20200227373
    Abstract: A light emitting device package according to an embodiment may include a first package body including first and second openings passing through the upper surface and lower surface thereof; a second package body disposed on the first package body and including a third opening passing through the upper surface and lower surface thereof; a light emitting device disposed in the third opening; a first resin disposed between the upper surface of the first package body and the light emitting device; and a second resin disposed in the third opening.
    Type: Application
    Filed: September 14, 2018
    Publication date: July 16, 2020
    Inventors: June O SONG, Ki Seok KIM, Chang Man LIM
  • Publication number: 20200212276
    Abstract: A light emitting device package according to an embodiment has a first frame and a second frame arranged to be spaced apart from each other, a third frame arranged between the first frame and the second frame and spaced apart from the first frame and the second frame, a body supporting the first to third frames, a first light emitting device arranged on the body and electrically connected to the first frame and the third frame, and a second light emitting device arranged on the body and electrically connected to the second frame and the third frame. The body has a first recess in an upper area between the first frame and the third frame, and a second recess in an upper area between the third frame and the second frame. An embodiment may have a first resin part arranged in the first recess, and a second resin part arranged in the second recess.
    Type: Application
    Filed: August 31, 2018
    Publication date: July 2, 2020
    Inventors: Chang Man LIM, Ki Seok KIM, Won Jung KIM, June O SONG
  • Publication number: 20200200803
    Abstract: Provided is a current sensor having variable tuning precision capability depending on an amount of a current to be measured, a system state and the like. In the present disclosure, the current measurement apparatus having variable tuning precision capability does not separately require a current sensor measuring a small current with high precision and a current sensor stably measuring a large current without saturation. In the present disclosure, a single current measurement apparatus may vary current measurement precision depending on a current magnitude and the like, and may thus measure the small current with the high precision and stably measure the large current without saturation.
    Type: Application
    Filed: November 22, 2019
    Publication date: June 25, 2020
    Inventors: Ki Chul HONG, Ki Seok KIM
  • Patent number: 10692495
    Abstract: An electronic device is provided. The electronic device includes at least one processor and a memory electrically connected to the processor. The memory stores instructions, and the instructions are configured to cause the processor, when executed, to activate a voice recognition service in response receiving a specified user input, receive a voice command while activating the voice recognition service, provide a feedback for the voice command, deactivate the voice recognition service after providing the feedback, receive a voice signal distinct from the specified user input while deactivating the voice recognition service, in response to receiving the voice signal, identify whether at least a portion of the voice signal corresponds to a wake-up command that is obtained from the voice command, and in response to identifying that the at least the portion of the voice signal corresponds to the wake-up command, activate the voice recognition service.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: June 23, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Kwang-Taek Woo, Kwan-Shik Park, Chang-Hoon Shin, Ki-Seok Kim, Jin-Wan An
  • Publication number: 20200176654
    Abstract: A semiconductor device package provided in an embodiment comprises: first and second frames spaced apart from each other; a body disposed between the first and second frames; and a semiconductor device disposed on the first and the second frame and comprising a semiconductor layer and a first and a second electrode on the semiconductor layer, wherein the first and the second frame comprise a first metal layer having a plurality of pores, and the first metal layer of the first and the second frame may comprise coupling portions in regions where the first metal layer overlaps the first and the second electrode, respectively.
    Type: Application
    Filed: July 27, 2018
    Publication date: June 4, 2020
    Inventors: Ki Seok KIM, Hee Jeong PARK, June O SONG, Chang Man LIM
  • Publication number: 20200176620
    Abstract: The present disclosure relates to a semiconductor device and a photoelectronic device, both including a transition-metal dichalcogenide thin-film, and to a method for producing a transition-metal dichalcogenide thin-film. The transition-metal dichalcogenide thin-film includes: a first region including a stack of N+M transition-metal dichalcogenide molecular layers; and a second region including a stack of N transition-metal dichalcogenide molecular layers, wherein the second region is horizontally adjacent to the first region, wherein the N transition-metal dichalcogenide molecular layers of the second region respectively horizontally extend from the N transition-metal dichalcogenide molecular layers of the first region.
    Type: Application
    Filed: January 29, 2020
    Publication date: June 4, 2020
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Geun Young YEOM, Ki Seok KIM, Ki Hyun KIM, Jin Woo PARK, Doo San KIM, You Jin JI, Ji Young BYUN
  • Patent number: 10672954
    Abstract: A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion disposed between the first and second frames; a light emitting device including first and second electrode pads; a first through hole in the first frame; a second through hole in the second frame; a conductive material disposed in the first and second through holes; and an intermetallic compound layer disposed between the conductive material and the first frame, and between the conductive material and the second frame, in which the first electrode pad of the light emitting device overlaps with the first through hole in the first frame, the second electrode pad of the light emitting device overlaps with the second through hole in the second frame, and the first and second electrode pads are spaced apart from each other.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: June 2, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Chang Man Lim, Ki Seok Kim, Won Jung Kim, June O Song
  • Publication number: 20200166549
    Abstract: Provided is a current measurement apparatus having a function to correct a current based on system information. The current measurement apparatus includes: a current sensing element generating a signal according to a current to be measured; a current measurement means measuring an amount of the current to be measured from the signal outputted from the current sensing element; a communication unit receiving system information from at least one upper-level controller; a correction amount calculation unit calculating information on an amount of a corrected current based on the amount of the current to be measured and the system information; and a measurement operation unit outputting the information on the amount of the corrected current to the at least one upper-level controller. According to the present invention, it is possible to reduce a non-linear current measurement error varying depending on a magnitude or a frequency of the current to be measured.
    Type: Application
    Filed: November 22, 2019
    Publication date: May 28, 2020
    Inventors: Ki Chul HONG, Ki Seok KIM
  • Patent number: 10636946
    Abstract: A light emitting device package is discussed. The light emitting device package includes a first frame having a first through hole; a second frame having a second through hole; a connecting frame diagonally extending in the light emitting device package from the first frame to the second frame; a first light emitting device including a first electrode pad and a second electrode pad, the second electrode pad being disposed on the first through hole of the first frame; and a second light emitting device including a third electrode pad and a fourth electrode pad, the third electrode pad being disposed on the second through hole of the second frame.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: April 28, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Ki Seok Kim, Won Jung Kim, June O Song, Chang Man Lim
  • Patent number: 10636562
    Abstract: A coil electronic component includes: a plurality of coil layers including, respectively, coil patterns and connection patterns disposed outside the coil patterns and forming a stacking structure; conductive vias connecting the coil patterns formed on different levels to each other; and external electrodes electrically connected to the plurality of coil layers. The coil patterns of at least two of the plurality of coil layers may have the same shape and be electrically connected to each other in parallel.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: April 28, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ki Seok Kim, Myung Sam Kang, Ye Jeong Kim, Kwang Hee Kwon, Sa Yong Lee
  • Patent number: 10626288
    Abstract: A resin composition for a printed circuit board includes an epoxy resin; an active ester hardening agent configured to react with the epoxy resin; and a cyanate ester hardening agent.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: April 21, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ji-Hye Shim, Ki-Seok Kim, Ji-Eun Woo
  • Patent number: 10600945
    Abstract: The light emitting device package disclosed in the embodiment includes: first and second frames having first and second through holes; a body disposed between the first and second frames; a light emitting device including a first bonding pad and a second bonding pad; and a conductive part in the first and second through holes. wherein at least one of the first and second bonding pads faces the first and second frames and overlaps with the first and second through holes and includes a contact region contacting the conductive part and a first non-contact non-contacting the conducive part.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: March 24, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Chang Man Lim, Ki Seok Kim, Young Shin Kim, June O Song, Ju Hyeon Oh, Chang Hyeong Lee, Tae Sung Lee, Se Yeon Jung, Byung Yeon Choi, Sung Min Hwang
  • Patent number: 10593654
    Abstract: A light emitting device package is discussed.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: March 17, 2020
    Assignee: LG INNOTEK CO., LTD.
    Inventors: June O Song, Ki Seok Kim, Chang Man Lim
  • Patent number: 10593819
    Abstract: The present disclosure relates to a semiconductor device and a photoelectronic device, both including a transition-metal dichalcogenide thin-film, and to a method for producing a transition-metal dichalcogenide thin-film. The transition-metal dichalcogenide thin-film includes: a first region including a stack of N+M transition-metal dichalcogenide molecular layers; and a second region including a stack of N transition-metal dichalcogenide molecular layers, wherein the second region is horizontally adjacent to the first region, wherein the N transition-metal dichalcogenide molecular layers of the second region respectively horizontally extend from the N transition-metal dichalcogenide molecular layers of the first region.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: March 17, 2020
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Geun Young Yeom, Ki Seok Kim, Ki Hyun Kim, Jin Woo Park, Doo San Kim, You Jin Ji, Ji Young Byun
  • Publication number: 20200058829
    Abstract: A light emitting device package disclosed to an embodiment of the invention includes a body including an upper surface and a lower surface, the body including a first recess and a second recess concaved from the lower surface toward the upper surface; a light emitting device disposed on the body and including a first bonding portion and a second bonding portion; and first and second conductive portions respectively disposed in the first recess and the second recess, wherein the body includes a first through hole and a second through hole penetrating an upper surface of each of the first recess and the second recess and the upper surface of the body, and wherein each of the first and second conductive portions extends into the first and second through holes and is electrically connected to the first bonding portion and the second bonding portion, respectively.
    Type: Application
    Filed: August 13, 2019
    Publication date: February 20, 2020
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Min Sik KIM, Won Jung KIM, Ki Seok KIM
  • Publication number: 20200014090
    Abstract: An antenna module includes: a base substrate including a rigid region and a flexible region; an antenna member disposed on one surface of the rigid region of the base substrate and including antenna patterns; and a semiconductor package disposed on the other surface of the rigid region of the base substrate and including one or more semiconductor chips.
    Type: Application
    Filed: February 27, 2019
    Publication date: January 9, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyung Mi JUNG, Seong Hyun YOO, Ji Hye SHIM, Ki Seok KIM
  • Patent number: 10515755
    Abstract: A coil electronic component includes: a plurality of stacked coil layers each including coil patterns including anisotropic plating layers; conductive vias connecting the coil patterns formed on different coil layers to each other; and external electrodes electrically connected to the plurality of coil layers.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: December 24, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ki Seok Kim, Ye Jeong Kim, Myung Sam Kang, Kwang Hee Kwon
  • Patent number: 10497827
    Abstract: A light emitting device package includes a first frame and a second frame disposed to be spaced apart from each other; a body disposed between the first and second frames and comprising a recess; a first adhesive on the recess; a light emitting device on the first adhesive; a second adhesive disposed between the first and second frames and the light emitting device; and a resin portion disposed to surround the second adhesive and a partial region of the light emitting device.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: December 3, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Tae Sung Lee, June O Song, Ki Seok Kim, Young Shin Kim, Chang Man Lim